Cooling device for semiconductor power element

Abstract

Abstract PURPOSE:To improve the cooling effect of semiconductor elements and realize structural compactness, by combining a conductor which supports flat semiconductors with a heat pipe and a cooling fin. CONSTITUTION:Heat loss produced at each semiconductor element is transmitted to either common conductor of P1, P2 or N, and also to a cooling fin via a heat pipe 15 inserted between these common conductors. As heat conductivity of the heat pipe 15 is very high, temperature difference between the common conductor and the cooling fin is very small. Cooling air is sucked through a rear panel suction, part by means of a cooling fan, heat-exchanged through cooling fins, and exhausted swiftly upwards. In the Fig, a positive-side common conductor for a forward converter is represented as P1, a positive-side common conductor for an reverse converter as P2, a negative-side common conductor for both forward and reverse converters as N, inputs as U, V and W, and outputs as R, S and T.

Inventors

• 👤 Minoru Ebara

Bibliographic Details