Patent EP0084424A2 successfully refreshed from Google Patents.
EP0084424A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Chemical removal of resin bleed from encapsulated devices and device treated by the method
Assignee: American Microsystems Holding Corp
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Filing: 1983-01-07
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Granted: —
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Expires: 2003-01-07
Abstract
Abstract In a method for the chemical removal of resin bleed from synthetic resin-encapsulated semiconductor devices, moulded parts are first deflashed, simultaneously removing encapsulating material from between adjacent leads and removing those portions of the lead frame which hold the leads fixed during the moulding operation. The lead frame is then cleaned, and subjected to chemical treatment by applying to the device a material which is a solvent of the encapsulating resin for a time sufficient to remove the resin bleed but insufficient to cause appreciable damage to the resin encapsulation. After removal of the resin bleed the device is rinsed and the lead frame is plated or solder-dipped in known fashion.
Inventors
- 👤 Jong-Sang Lee
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-23 18:21
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W70/00; H10W70/01; H10W70/04; H10W70/045; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
55 words
A method for the chemical removal of resin bleed from an encapsulated semiconductor device characterized by the step of applying to said encapsulated device a material which is a solvent of the resin for a time sufficient to remove said resin bleed, but for a time insufficient to cause appreciable damage to the device encapsulation.
Claim 2
Independent Claim
55 words
A method for the chemical removal of resin bleed from an encapsulated semiconductor device characterized by the step of applying to said encapsulated device a material which is a solvent of the resin for a time sufficient to remove said resin bleed, but for a time insufficient to cause appreciable damage to the device encapsulation.
Claim 3
Dependent Claim
18 words
A method as claimed in claim 1 characterized in that said encapsulated device is submerged in said solvent.
Claim 4
Dependent Claim
27 words
A method as claimed in claim 1 or claim 2 characterized in that said solvent is agitated during the time said device is submerged in said solvent.
Claim 5
Dependent Claim
19 words
A method as claimed in claim 3 characterized in that said agitation is provided by an ultrasonic energy source.
Claim 6
Independent Claim
17 words
A method as claimed in any preceding claim characterized in that said solvent comprises a haloginated hydrocarbon.
Claim 7
Dependent Claim
16 words
A method as claimed in claim 5 characterized in that said haloginated hydrocarbon comprises methylene chloride.
Claim 8
Independent Claim
17 words
A method as claimed in any preceding claim characterized in that said solvent acid comprises acetic acid.
Claim 9
Independent Claim
32 words
A method as claimed in any preceding claim characterized in that said solvent is contained within a tank and said solvent is sealed by a layer of material formed on its surface.
Claim 10
Dependent Claim
39 words
A method as claimed in claim 8 characterized in that said layer of material formed on the surface of the solvent is a layer of water which is within the range of approximately 3/4 to 1 inch in thickness.
Claim 11
Dependent Claim
15 words
An encapsulated semiconductor device which has been treated by the method of any preceding claim.
Claim 12
Independent Claim
54 words
A method for the chemical removal of resin bleed from a device incorporating a resin characterized by the step of applying to said device a material which is a solvent of said resin for a time sufficient to remove said resin bleed, but for a time insufficient to cause appreciable damage to said device.
Claim 13
Independent Claim
54 words
A method for the chemical removal of resin bleed from a device incorporating a resin characterized by the step of applying to said device a material which is a solvent of said resin for a time sufficient to remove said resin bleed, but for a time insufficient to cause appreciable damage to said device.
References Cited (Backward Citations)
No citation records indexed.
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