Patent US3599098A successfully refreshed from Google Patents.
← Back to Patent Explorer
USRE29039E Expired / Lapsed US ⏱️ 0.0 years remaining

Metal deposition process

Assignee: Imperial Chemical Industries Ltd
•
Filing: 1975-06-30
•
Granted: 1976-11-16
•
Expires: 1995-06-30
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract Metal is deposited on a substrate containing neutral radicals, radical cations or neutral molecules (the latter being derived from a dication normally stable in aqueous media), by contacting the substrate with an electroless plating solution, optionally after sensitization with a salt of a platinum group metal silver or gold. The use of the process for data recording, particularly for the production of magnetic information carriers e.g. tapes or discs, metallizing plastic foam and for producing printed circuits is described.

Inventors

  • 👤 Timothy Douglas Andrews

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 01:22
CPC Classifications
B; B41; B41M; B41M5/00; B41M5/26; B41M5/30; B41M5/32; C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1607; C23C18/1608; C23C18/1612; C23C18/1633; C23C18/1635; C23C18/1639; C23C18/1641; C23C18/1646; C23C18/165; C23C18/1653; C23C18/1655; C23C18/1657; C23C18/18; C23C18/20; C23C18/28; C23C18/30; G; G03; G03C; G03C1/00; G03C1/72; G03C1/73; G03C5/00; G03C5/58; H; H01; H01F; H01F41/00; H01F41/32; H01F41/34; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0373; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/38; H05K3/381

Claims Analysis

Total Claims: 25
Claim 1
Independent Claim 62 words
A process for the deposition of metal in or on substrate characterized in that the substrate contains or consists of, as active component, an organic compound derived from a cation of the general formula ##SPC8## where R 1 - 12 are hydrogen, halogen or organic substituents and n = 0 or an integer, comprising contacting the substrate with an electroless plating solution.
Claim 2
Dependent Claim 62 words
A process for the deposition of metal in or on substrate characterized in that the substrate contains or consists of, as active component, an organic compound derived from a cation of the general formula ##SPC8## where R 1 - 12 are hydrogen, halogen or organic substituents and n = 0 or an integer, comprising contacting the substrate with an electroless plating solution.
Claim 3
Dependent Claim 37 words
A process according to claim 1 comprising contacting the substrate first with a sensitizer comprising a solution of a compound of a metal of the platinum group, silver or gold and subsequently with the electroless plating solution.
Claim 4
Dependent Claim 20 words
A process according to claim 1 in which the active component is supported in a water soluble or swellable polymer.
Claim 5
Dependent Claim 23 words
A process according to claim 1 in which the active component is formed in situ from the cation by radiation or by heat.
Claim 6
Dependent Claim 19 words
A process according to claim 1 wherein the active component is derived from a cation of the formula: ##SPC9##
Claim 7
Dependent Claim 19 words
A process according to claim 1 wherein the active component is derived from a cation of the formula: ##SPC10##
Claim 8
Dependent Claim 70 words
A data recording process which comprises preparing a substrate, containing or consisting of, as active component, an organic compound derived from a cation of the general formula ##SPC11## where R 1 - 12, are hydrogen, halogen or organic substituents and n = 0 or an integer, comprising contacting the substrate with an electroless plating solution, exposing said substrate to radiation or heat, and subsequently contacting with an electroless plating solution.
Claim 9
Dependent Claim 70 words
A data recording process which comprises preparing a substrate, containing or consisting of, as active component, an organic compound derived from a cation of the general formula ##SPC11## where R 1 - 12, are hydrogen, halogen or organic substituents and n = 0 or an integer, comprising contacting the substrate with an electroless plating solution, exposing said substrate to radiation or heat, and subsequently contacting with an electroless plating solution.
Claim 10
Dependent Claim 36 words
A data recording process according to claim 7 in which the exposed material is contacted with a sensitizing solution of a metal of the platinum group, silver or gold before contact with the electroless plating solution.
Claim 11
Dependent Claim 19 words
A data recording process according to claim 7 in which the plating solution is a ferromagnetic material plating solution.
Claim 12
Dependent Claim 22 words
A data recording process according to claim 9 in which the plating solution is selected from cobalt/phosphorus, nickel/phosphorus and cobalt/nickel/phosphorus plating solutions.
Claim 13
Dependent Claim 22 words
A data recording process according to claim 7 in which the support is a non-magnetic disc bearing a coating containing said salt.
Claim 14
Dependent Claim 22 words
A data recording process according to claim 7 in which the support is a polymeric film bearing a coating containing said salt.
Claim 15
Dependent Claim 20 words
A data recording process according to claim 12 in which the support is a tape formed from a linear polyester.
Claim 16
Dependent Claim 24 words
A data recording process according to claim 9 wherein the imagewise distribution of organic compound in a series of discrete tracks on the support.
Claim 17
Independent Claim 61 words
A method of producing metallized foam which includes the steps of introducing an active component derived from a cation of the general formula ##SPC12## where R 1 - 12 are hydrogen, halogen or organic substituents and n = 0 or an integer into a plastics foam and electroless plating, consolidating the deposited metal by electroplating and optionally removing the plastics material.
Claim 18
Independent Claim 61 words
A method of producing metallized foam which includes the steps of introducing an active component derived from a cation of the general formula ##SPC12## where R 1 - 12 are hydrogen, halogen or organic substituents and n = 0 or an integer into a plastics foam and electroless plating, consolidating the deposited metal by electroplating and optionally removing the plastics material.
Claim 19
Dependent Claim 19 words
A method according to claim 15 wherein the active component is derived from a cation of the formula: ##SPC13##
Claim 20
Dependent Claim 19 words
A method according to claim 15 wherein the active component is derived from a cation of the formula: ##SPC14##
Claim 21
Independent Claim 64 words
A method of producing printed circuits for electrical or electronic devices in which a circuitwise distribution of active component derived from a cation of the general formula ##SPC15## where R 1 - 12 are hydrogen, halogen or organic substituents and n = 0 or an integer is formed on a base support material, electroless plating, and building up the metallic layer by further plating.
Claim 22
Independent Claim 64 words
A method of producing printed circuits for electrical or electronic devices in which a circuitwise distribution of active component derived from a cation of the general formula ##SPC15## where R 1 - 12 are hydrogen, halogen or organic substituents and n = 0 or an integer is formed on a base support material, electroless plating, and building up the metallic layer by further plating.
Claim 23
Dependent Claim 52 words
A method according to claim 18 for the production of circuits having regions of differing resistivity in which a first circuitwise distribution of active components is plated with a first metal and then a second circuitwise distribution of active component is plated with a second metal of higher resistivity than the first.
Claim 24
Dependent Claim 19 words
A method according to claim 18 wherein the active component is derived from a cation of the formula: ##SPC16##
Claim 25
Dependent Claim 19 words
A method according to claim 18 wherein the active component is derived from a cation of the formula: ##SPC17##

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1979-11-16 1980-05-17 1980-11-16 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1983-11-16 1984-05-17 1984-11-16 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1987-11-16 1988-05-17 1988-11-16 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag