Two-dimensional array ultrasonic transducers

Claim 2

A piezoelectric transducer chip comprising: a plurality of transducer elements a width of from about 0.05 mm to about 1 mm arranged in a two-dimensional array, at least one of said transducer elements being a multilayer element having an internal edge portion and comprising a plurality of piezoelectric layers and a plurality of electrode layers forming a plurality of capacitive elements electrically connected in parallel, each of said plurality of piezoelectric layers being separated from the adjacent piezoelectric layers by one of said plurality of electrode layers, and said piezoelectric layers consisting of a first set of alternating electrode layers and a second set of alternating electrode layers interposed between said first set of alternating electrode layers; a first via electrically connecting said first set of alternating electrode layers, said first via being electrically insulated from said second set of alternating electrode layers; and a second via electrically connecting said second set of alternating electrode layers, said second via being electrically insulated from said first set of alternating electrode layers; wherein at least one of said vias is an internal via.

Claim 3

A piezoelectric transducer chip according to claim 1, wherein said plurality of transducer elements comprises a plurality of multilayer elements.

Claim 4

A piezoelectric transducer chip according to claim 1, wherein said multilayer element comprises piezoelectric layers which are between about 0.01 and 0.6 mm in thickness.

Claim 5

A piezoelectric transducer chip according to claim 1, wherein said multilayer element is substantially square in cross-section.

Claim 6

A piezoelectric transducer chip according to claim 1 wherein said first set of alternating electrode layers and said second set of alternating electrode layers each comprise a plurality of electrode layers.

Claim 7

A piezoelectric transducer chip according to claim 1, wherein said first via is insulated from said second set of alternating electrodes by a plurality of insulating gaps.

Claim 8

A piezoelectric transducer chip according to claim 1, wherein said second via is insulated from said first set of alternating electrodes by a plurality of insulating gaps.

Claim 9

A piezoelectric transducer chip according to claim 1, wherein said multiple layer elements are rectangular in cross-section.

Claim 10

A piezoelectric transducer chip according to claim 1, wherein at least one of said transducer elements has a single piezoelectric layer.

Claim 11

An ultrasonic transducer array comprising: (a) a connector having an upper surface, a lower surface, and an array of connector pads formed in said connector for electrically connecting said upper surface to said lower surface; (b) a piezoelectric transducer chip having a plurality of ultrasonic transducer elements arranged in a two-dimensional array, at least one of said ultrasonic transducer elements being a multilayer element having an internal edge portion and comprising a plurality of piezoelectric layers and a plurality of electrode layers forming a plurality of capacitative elements electrically connected in parallel, each of said plurality of piezoelectric layers being separated from the adjacent piezoelectric layers by one of said plurality of electrode layers, and said piezoelectric layers consisting of a first set of alternating electrode layers and a second set of alternating electrode layers interposed between said first set of alternating electrode layers; (c) a first via connecting said first set of alternating electrode layers, said first via being electrically insulated from said second set of alternating electrode layers; and (d) a second via connecting in parallel said second set of alternating electrode layers, said second via being electrically insulated from said first set of alternating electrode layers; wherein at least one of said vias is an internal via; (e) means for electrically connecting said first set of alternating electrodes to ground; and (f) means for electrically connecting said second set of alternating electrodes to a corresponding one of said connector pads.

Claim 12

An ultrasonic transducer array comprising: (a) a connector having an upper surface, a lower surface, and an array of connector pads formed in said connector for electrically connecting said upper surface to said lower surface; (b) a piezoelectric transducer chip having a plurality of ultrasonic transducer elements arranged in a two-dimensional array, at least one of said ultrasonic transducer elements being a multilayer element having an internal edge portion and comprising a plurality of piezoelectric layers and a plurality of electrode layers forming a plurality of capacitative elements electrically connected in parallel, each of said plurality of piezoelectric layers being separated from the adjacent piezoelectric layers by one of said plurality of electrode layers, and said piezoelectric layers consisting of a first set of alternating electrode layers and a second set of alternating electrode layers interposed between said first set of alternating electrode layers; (c) a first via connecting said first set of alternating electrode layers, said first via being electrically insulated from said second set of alternating electrode layers; and (d) a second via connecting in parallel said second set of alternating electrode layers, said second via being electrically insulated from said first set of alternating electrode layers; wherein at least one of said vias is an internal via; (e) means for electrically connecting said first set of alternating electrodes to ground; and (f) means for electrically connecting said second set of alternating electrodes to a corresponding one of said connector pads.

Claim 13

An ultrasonic transducer array according to claim 10, which further comprises a metallic ground sheet which overlies said piezoelectric transducer chip and is electrically connected to said means for electrically connecting said first set of alternating electrodes.

Claim 14

An ultrasonic transducer array according to claim 10, wherein said means for electrically connecting said second set of alternating electrodes comprises a bonding layer to connect to said upper surface of said connector.

Claim 15

An ultrasonic transducer array according to claim 10, wherein said piezoelectric chip comprises a plurality of multilayer elements.

Claim 16

An ultrasonic transducer array according to claim 10, wherein said piezoelectric chip comprises at least one multilayer element which includes a first internal edge and a second internal edge, and wherein said first via is an internal via, and wherein said second via is an internal via.

Claim 17

Tn ultrasonic transducer array according to claim 10, wherein said ultrasonic transducer operates at a frequency of between about 1 and 10 MHz.

Claim 18

An ultrasonic scanner comprising: (a) means for producing an ultrasonic signal; (b) an ultrasonic transducer array operatively connected to said means for producing an ultrasonic signal for transmitting said ultrasonic signal to a target said ultrasonic transducer array comprising: (i) a connector having an upper surface, a lower surface, and an array of connector pads formed in said connector for electrically connecting said upper surface to said lower surface; (ii) a piezoelectric transducer chip having a plurality of ultrasonic transducer elements arranged in a two-dimensional array, at least one of said ultrasonic transducer elements being a multilayer element having an internal edge portion and comprising a plurality of piezoelectric layers and a plurality of electrode layers forming a plurality of capacitative elements electrically connected in parallel, each of said plurality of piezoelectric layers being separated from the adjacent piezoelectric layers by one of said plurality of electrode layers, and said piezoelectric layers consisting of a first set of alternating electrode layers and a second set of alternating electrode layers interposed between said first set of alternating electrode layers; (iii) a first via connecting said first set of alternating electrode layers, said first via being electrically insulated from said second set of alternating electrode layers; and (iv) a second via connecting in parallel said second set of alternating electrode layers, said second via being electrically insulated from said first set of alternating electrode layers; wherein at least one of said vias is an internal via; (v) means for electrically connecting said first set of alternating electrodes to ground; and (vi) means for electrically connecting said second set of alternating electrodes to a corresponding one of said connector pads; (c) means for amplifying a received ultrasonic signal from a target operatively connected to said ultrasonic transducer array; and (d) means for processing said ultrasonic signal operatively connected to said amplifying means.

Claim 19

An ultrasonic scanner comprising: (a) means for producing an ultrasonic signal; (b) an ultrasonic transducer array operatively connected to said means for producing an ultrasonic signal for transmitting said ultrasonic signal to a target said ultrasonic transducer array comprising: (i) a connector having an upper surface, a lower surface, and an array of connector pads formed in said connector for electrically connecting said upper surface to said lower surface; (ii) a piezoelectric transducer chip having a plurality of ultrasonic transducer elements arranged in a two-dimensional array, at least one of said ultrasonic transducer elements being a multilayer element having an internal edge portion and comprising a plurality of piezoelectric layers and a plurality of electrode layers forming a plurality of capacitative elements electrically connected in parallel, each of said plurality of piezoelectric layers being separated from the adjacent piezoelectric layers by one of said plurality of electrode layers, and said piezoelectric layers consisting of a first set of alternating electrode layers and a second set of alternating electrode layers interposed between said first set of alternating electrode layers; (iii) a first via connecting said first set of alternating electrode layers, said first via being electrically insulated from said second set of alternating electrode layers; and (iv) a second via connecting in parallel said second set of alternating electrode layers, said second via being electrically insulated from said first set of alternating electrode layers; wherein at least one of said vias is an internal via; (v) means for electrically connecting said first set of alternating electrodes to ground; and (vi) means for electrically connecting said second set of alternating electrodes to a corresponding one of said connector pads; (c) means for amplifying a received ultrasonic signal from a target operatively connected to said ultrasonic transducer array; and (d) means for processing said ultrasonic signal operatively connected to said amplifying means.

Claim 20

An ultrasonic transducer array according to claim 16, which further comprises a metallic ground sheet which overlies said piezoelectric transducer chip and is electrically connected to said means for electrically connecting said first set of alternating electrodes.

Claim 21

An ultrasonic transducer array according to claim 16, wherein said means for electrically connecting said second set of alternating electrodes comprises a bonding layer to connect to said upper surface of said connector.

Claim 22

An ultrasonic transducer array according to claim 16, wherein said piezoelectric chip comprises a plurality of multilayer elements.

Claim 23

An ultrasonic transducer array according to claim 16, wherein said piezoelectric chip comprises at least one multilayer element which includes a first internal edge and a second internal edge, and wherein said first via is an internal via, and wherein said second via is an internal via.