US5068865A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor laser module
Assignee: NEC Corp
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Filing: 1989-06-09
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Granted: 1991-11-26
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Expires: 2009-06-09
Abstract
Abstract A semiconductor laser module comprises a semiconductor laser device, an optical fiber, and a lens for coupling light emitted from the semiconductor laser device to the optical fiber. There is provided a metal base having a flat portion and a pipe portion in a metal case. The semiconductor laser device is mounted on a chip carrier which is mounted on the flat portion of the metal base. The lens is fixed in the inside of the pipe portion of the metal base. The optical fiber is protected at one end by a ferrule which is fixed to the pipe portion of the metal base. A device such as a monitor photodiode and a thermistor may be mounted on the flat portion of the metal base. The flat portion of the metal base may be formed with a concave portion of an area smaller than an area of the bottom of the chip carrier. The chip carrier is soldered to the flat portion of the metal base by a low temperature solder to provide thermal connection therebetween, and by a spot welding at a point other than the soldered portion of the low temperature solder.
Inventors
- 👤 Yasunobu Ohshima
- 👤 Naoki Shibanuma
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 05:06
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/02; H01S5/022; H01S5/02208; G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4204; G02B6/4207; G02B6/4219; G02B6/422; G02B6/4225; G02B6/4248; G02B6/4236; G02B6/4237; G02B6/4238; H01S5/0225; H01S5/02251; H01S5/0235; H01S5/02355; H01S5/0237; H01S5/024; H01S5/02407; H01S5/02415
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
212 words
A semiconductor laser module: comprising, a semiconductor laser device from which light of a predetermined wavelength radiates, said semiconductor laser device being mounted on a chip carrier; an optical fiber for supplying said light to a following stage, one end of said optical fiber being protected by a ferrule; a lens for coupling said light of said semiconductor laser device to an input end of said optical fiber; a metal base having a flat portion on which said chip carrier is mounted, and a pipe portion in the inside of which said lens is fixed on one side of said pipe portion and to which said ferrule is fixed on the other side of said pipe portion, said semiconductor laser device, said lens, and said input end of said optical fiber being aligned on an axis of said light to provide an optical system; a metal case in which said optical system is fixed and through a side wall of which said ferrule protecting said optical fiber is passed; a first means for detecting light; and a second means for detecting a temperature of said semiconductor laser device; wherein said first means is mounted on said flat portion of said metal base, and said second means is mounted on said chip carrier.
Claim 2
Dependent Claim
212 words
A semiconductor laser module: comprising, a semiconductor laser device from which light of a predetermined wavelength radiates, said semiconductor laser device being mounted on a chip carrier; an optical fiber for supplying said light to a following stage, one end of said optical fiber being protected by a ferrule; a lens for coupling said light of said semiconductor laser device to an input end of said optical fiber; a metal base having a flat portion on which said chip carrier is mounted, and a pipe portion in the inside of which said lens is fixed on one side of said pipe portion and to which said ferrule is fixed on the other side of said pipe portion, said semiconductor laser device, said lens, and said input end of said optical fiber being aligned on an axis of said light to provide an optical system; a metal case in which said optical system is fixed and through a side wall of which said ferrule protecting said optical fiber is passed; a first means for detecting light; and a second means for detecting a temperature of said semiconductor laser device; wherein said first means is mounted on said flat portion of said metal base, and said second means is mounted on said chip carrier.
Claim 3
Dependent Claim
244 words
A semiconductor laser module: comprising, a semiconductor laser device from which light of a predetermined wavelength radiates, said semiconductor laser device being mounted on a chip carrier; an optical fiber for supplying said light to a following stage, one end of said optical fiber being protected by a ferrule; a lens for coupling said light of said semiconductor laser device to an input end of said optical fiber; a metal base having a flat portion on which said chip carrier is mounted, and a pipe portion in the inside of which said lens is fixed on one side of said pipe portion and to which said ferrule is fixed on the other side of said pipe portion, said semiconductor laser device, said lens, and said input end of said optical fiber being aligned on an axis of said light to provide an optical system; and a metal case in which said optical system is fixed and through a side wall of which said ferrule protecting said optical fiber is passed; wherein said flat portion of said metal base is formed with a concave portion, an area of said concave portion being smaller than the bottom surface area of said chip carrier, and said chip carrier being soldered to said flat portion of said metal base by a low temperature solder completely filled in said concave portion and by a spot welding at a point other than the soldered portion of said low temperature solder.
Claim 4
Dependent Claim
244 words
A semiconductor laser module: comprising, a semiconductor laser device from which light of a predetermined wavelength radiates, said semiconductor laser device being mounted on a chip carrier; an optical fiber for supplying said light to a following stage, one end of said optical fiber being protected by a ferrule; a lens for coupling said light of said semiconductor laser device to an input end of said optical fiber; a metal base having a flat portion on which said chip carrier is mounted, and a pipe portion in the inside of which said lens is fixed on one side of said pipe portion and to which said ferrule is fixed on the other side of said pipe portion, said semiconductor laser device, said lens, and said input end of said optical fiber being aligned on an axis of said light to provide an optical system; and a metal case in which said optical system is fixed and through a side wall of which said ferrule protecting said optical fiber is passed; wherein said flat portion of said metal base is formed with a concave portion, an area of said concave portion being smaller than the bottom surface area of said chip carrier, and said chip carrier being soldered to said flat portion of said metal base by a low temperature solder completely filled in said concave portion and by a spot welding at a point other than the soldered portion of said low temperature solder.
Claim 5
Dependent Claim
194 words
A semiconductor laser module: comprising, a semiconductor laser device from which light of a predetermined wavelength radiates, said semiconductor laser device being mounted on a chip carrier; an optical fiber for supplying said light to a following stage, one end of said optical fiber being protected by a ferrule; a lens for coupling said light of said semiconductor laser device to an input end of said optical fiber; a metal base on which said chip carrier is mounted; a lens holder for holding said lens; and a metal case in which said metal base, said lens holder, and said ferrule are aligned on an axis of said light to provide an optical system, and through a side wall of which said ferrule protecting said optical fiber is passed; wherein said metal base is formed with a concave portion, an area of said concave portion being smaller than the bottom surface area of said chip carrier, and said chip carrier being soldered to said metal base by a low temperature solder completely filled in said concave portion and by a spot welding at a point other than the soldered portion of said low temperature solder.
Claim 6
Dependent Claim
194 words
A semiconductor laser module: comprising, a semiconductor laser device from which light of a predetermined wavelength radiates, said semiconductor laser device being mounted on a chip carrier; an optical fiber for supplying said light to a following stage, one end of said optical fiber being protected by a ferrule; a lens for coupling said light of said semiconductor laser device to an input end of said optical fiber; a metal base on which said chip carrier is mounted; a lens holder for holding said lens; and a metal case in which said metal base, said lens holder, and said ferrule are aligned on an axis of said light to provide an optical system, and through a side wall of which said ferrule protecting said optical fiber is passed; wherein said metal base is formed with a concave portion, an area of said concave portion being smaller than the bottom surface area of said chip carrier, and said chip carrier being soldered to said metal base by a low temperature solder completely filled in said concave portion and by a spot welding at a point other than the soldered portion of said low temperature solder.
Claim 7
Dependent Claim
172 words
A semiconductor laser module: comprising, a semiconductor laser device from which light of a predetermined wavelength radiates, said semiconductor laser device being mounted on a chip carrier; an optical fiber for supplying said light to a following stage; a lens for coupling said light of said semiconductor laser device to an input end of said optical fiber; a metal base having a flat portion on which said chip carrier is mounted, said semiconductor laser device, said lens, and said input end of said optical fiber being aligned on an axis of said light to provide an optical system; and wherein said flat portion of said metal base is formed with concave portion, an area of said concave portion being smaller than the bottom surface area of said chip carrier, and said chip carrier being soldered to said flat portion of said metal base by a low temperature solder completely filled in said concave portion and by a spot welding at a point other than the soldered portion of said low temperature solder.
Claim 8
Dependent Claim
172 words
A semiconductor laser module: comprising, a semiconductor laser device from which light of a predetermined wavelength radiates, said semiconductor laser device being mounted on a chip carrier; an optical fiber for supplying said light to a following stage; a lens for coupling said light of said semiconductor laser device to an input end of said optical fiber; a metal base having a flat portion on which said chip carrier is mounted, said semiconductor laser device, said lens, and said input end of said optical fiber being aligned on an axis of said light to provide an optical system; and wherein said flat portion of said metal base is formed with concave portion, an area of said concave portion being smaller than the bottom surface area of said chip carrier, and said chip carrier being soldered to said flat portion of said metal base by a low temperature solder completely filled in said concave portion and by a spot welding at a point other than the soldered portion of said low temperature solder.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-11-25 | 1995-05-27 | 1995-11-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-11-25 | 1999-05-27 | 1999-11-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-11-25 | 2003-05-27 | 2003-11-26 | $7700.00 | Window Closed / Lapsed |