Patent US3444456A successfully refreshed from Google Patents.
US5002818A
Expired / Lapsed
US
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Reworkable epoxy die-attach adhesive
Assignee: Raytheon Co
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Filing: 1989-09-05
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Granted: 1991-03-26
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Expires: 2009-09-05
Abstract
Abstract An adhesive mixture reworkably adheres electronic integrated circuit dies to hybrid microcircuit substrates, and includes a thermosetting epoxy resin. A thermoplastic resin additive allows the mixture to retain the high adhesive strength of the epoxy resin up to approximately 150° C., or the upper limit of the operating and testing temperature range of the dies, and then soften sufficiently to enable defective dies to be removed at a temperature of preferably between 150° C. and 200° C. without damage to the substrate or adjacent dies.
Inventors
- 👤 James J. Licari
- 👤 Gabriel G. Bakhit
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 18:48
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/073; H10W72/30; H10W72/07331; H10W72/07337; H10W72/07339; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/25; Y10T428/31504; Y10T428/31511; Y10T428/31515
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
54 words
A reworkable electronic component structure, comprising: a substrate; an electronic circuit component; and an adhesive for reworkably adhering the component to the substrate, the adhesive including: a curable thermosetting resin; and an additive selected to cause the adhesive, in its cured state, to soften at a temperature between approximately 100° C. and 250° C.
Claim 2
Dependent Claim
54 words
A reworkable electronic component structure, comprising: a substrate; an electronic circuit component; and an adhesive for reworkably adhering the component to the substrate, the adhesive including: a curable thermosetting resin; and an additive selected to cause the adhesive, in its cured state, to soften at a temperature between approximately 100° C. and 250° C.
Claim 3
Dependent Claim
28 words
A structure as in claim 1, in which the additive is selected to cause the adhesive to soften at a temperature between approximately 150° C. and 200° C.
Claim 4
Dependent Claim
18 words
A structure as in claim 2, in which the additive has a melting temperature above approximately 150° C.
Claim 5
Dependent Claim
20 words
A structure as in claim 3, in which the thermosetting resin has a glass transition temperature above approximately 200° C.
Claim 6
Dependent Claim
15 words
A structure as in claim 1, in which the thermosetting resin comprises an epoxy resin.
Claim 7
Dependent Claim
17 words
A structure as in claim 5, in which the epoxy resin comprises diglycidyl ether of bisphenol A.
Claim 8
Dependent Claim
21 words
A structure as in claim 5, in which the additive constitutes between approximately 1% and 50% by weight of the adhesive.
Claim 9
Dependent Claim
21 words
A structure as in claim 5, in which the additive constitutes between approximately 10% and 30% by weight of the adhesive.
Claim 10
Dependent Claim
14 words
A structure as in claim 5, in which the additive comprises a thermoplastic resin.
Claim 11
Dependent Claim
16 words
A structure as in claim 9, in which the thermoplastic resin comprises a thermoplastic epoxy resin.
Claim 12
Dependent Claim
15 words
A structure as in claim 1, in which the component is an integrated circuit die.
Claim 13
Dependent Claim
15 words
A structure as in claim 1, in which the adhesive further comprises a filler material.
Claim 14
Dependent Claim
34 words
A reworkable electronic die-attach adhesive comprising: a curable thermosetting resin; and an additive selected to cause the adhesive, in its cured state, to soften at a temperature between approximately 100° C. and 250° C.
Claim 15
Dependent Claim
34 words
A reworkable electronic die-attach adhesive comprising: a curable thermosetting resin; and an additive selected to cause the adhesive, in its cured state, to soften at a temperature between approximately 100° C. and 250° C.
Claim 16
Dependent Claim
28 words
An adhesive as in claim 13, in which the additive is selected to cause the adhesive to soften at a temperature between approximately 150° C. and 200° C.
Claim 17
Dependent Claim
18 words
An adhesive as in claim 14, in which the additive has a melting temperature above approximately 150° C.
Claim 18
Dependent Claim
20 words
An adhesive as in claim 15, in which the thermosetting resin has a glass transition temperature above approximately 200° C.
Claim 19
Dependent Claim
15 words
An adhesive as in claim 13, in which the thermosetting resin comprises an epoxy resin.
Claim 20
Dependent Claim
17 words
An adhesive as in claim 17, in which the epoxy resin comprises diglycidyl ether of bisphenol A.
Claim 21
Dependent Claim
21 words
An adhesive as in claim 17, in which the additive constitutes between approximately 1% and 50% by weight of the adhesive.
Claim 22
Dependent Claim
21 words
An adhesive as in claim 17, in which the additive constitutes between approximately 10% and 30% by weight of the adhesive.
Claim 23
Dependent Claim
14 words
An adhesive as in claim 17, in which the additive comprises a thermoplastic resin.
Claim 24
Dependent Claim
16 words
An adhesive as in claim 21, in which the thermoplastic resin comprises a thermoplastic epoxy resin.
Claim 25
Dependent Claim
11 words
An adhesive as in claim 13, further comprising a filler material.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-03-25 | 1994-09-24 | 1995-03-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-03-25 | 1998-09-24 | 1999-03-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-03-25 | 2002-09-24 | 2003-03-26 | $7700.00 | Window Closed / Lapsed |