US4962415A
Expired / Lapsed
US
⏱️ 0.0 years remaining
IC card
Assignee: Maxell Ltd
•
Filing: 1990-02-06
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Granted: 1990-10-09
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Expires: 2010-02-06
Abstract
Abstract An IC card is provided in which an IC chip is packaged in an opening formed in the IC card. One surface of the IC chip is laid on a film substrate on which external contact terminals are formed, and the other surface is covered with a reinforcing plate, the IC chip. The film substrate and the reinforcing plate are formed integrally in a thin plate-like module which is well-fitted in the above-mentioned opening while the external contact terminals on the film substrate are exposed externally.
Inventors
- 👤 Hiroshi Yamamoto
- 👤 Ryutaro Arakawa
- 👤 Akio Anada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 15:10
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/0772; G06K19/07728; G06K19/07745; H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/699; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
255 words
An IC card for transmitting and receiving signals to and from an external apparatus, said IC card including a card-type base having therein a window, a module disposed in said window, and resin provided in a space defined between said module and said window in said card-type base, said module further comprising: a film substrate having an aperture and top and bottom surfaces; an IC chip located in said aperture, said IC chip having top and bottom surfaces; a reinforcing plate supporting said film substrate and said IC chip; a wiring formed on the stop surface of said film substrate; external contact terminals incorporated integrally with said wiring to permit connection to said external apparatus; and bonding leads extending from said wiring toward said aperture in said film substrate, wherein said IC chip is arranged so that the bottom surface of said IC chip is located on said reinforcing plate and adjacent to said bottom surface of said film substrate, wherein said reinforcing plate is bonded to said bottom surface of said film substrate so as to cover said aperture in said film substrate, and wherein said module is embedded in said resin so that said external connecting terminals are exposed at least in part, externally from said card-like base and, further wherein said reinforcing plate is comprised of a sheet material having a thickness of 0.1 to 0.5 mm, wherein said IC chip has a thickness of 200 to 350 μm and wherein said film substrate has a thickness of 50 to 250 μm.
Claim 2
Dependent Claim
255 words
An IC card for transmitting and receiving signals to and from an external apparatus, said IC card including a card-type base having therein a window, a module disposed in said window, and resin provided in a space defined between said module and said window in said card-type base, said module further comprising: a film substrate having an aperture and top and bottom surfaces; an IC chip located in said aperture, said IC chip having top and bottom surfaces; a reinforcing plate supporting said film substrate and said IC chip; a wiring formed on the stop surface of said film substrate; external contact terminals incorporated integrally with said wiring to permit connection to said external apparatus; and bonding leads extending from said wiring toward said aperture in said film substrate, wherein said IC chip is arranged so that the bottom surface of said IC chip is located on said reinforcing plate and adjacent to said bottom surface of said film substrate, wherein said reinforcing plate is bonded to said bottom surface of said film substrate so as to cover said aperture in said film substrate, and wherein said module is embedded in said resin so that said external connecting terminals are exposed at least in part, externally from said card-like base and, further wherein said reinforcing plate is comprised of a sheet material having a thickness of 0.1 to 0.5 mm, wherein said IC chip has a thickness of 200 to 350 μm and wherein said film substrate has a thickness of 50 to 250 μm.
Claim 3
Dependent Claim
13 words
An IC card according to claim 1, wherein said window is an aperture.
Claim 4
Dependent Claim
13 words
An IC card according to claim 1, wherein said window is a recess.
Claim 5
Dependent Claim
35 words
An IC card according to claim 1, wherein an overlay is provided on the surface of said card-type base having said externally contact terminals, such that said overlay does not cover said externally contact terminals.
Claim 6
Dependent Claim
15 words
An IC card according to claim 1, wherein said IC chip is a one-chip microcomputer.
Claim 7
Dependent Claim
21 words
An IC card according to claim 1, wherein said IC chip is mounted on said film substrate by tape carrier method.
Claim 8
Dependent Claim
19 words
An IC card according to claim 1, wherein said reinforcing plate is made of a sheet of a metal.
Claim 9
Dependent Claim
28 words
An IC card according to claim 1, wherein the portion of said reinforcing plate corresponding to said IC chip is recessed so as to receive said IC chip.
Claim 10
Dependent Claim
35 words
An IC card according to claim 4, wherein the space defined by said window in said card-type base and said overlay and receiving said film substrate and said reinforcing plate is filled with a resin.
Claim 11
Dependent Claim
42 words
An IC card according to claim 4, wherein the surface of said externally contact terminals is positioned at a level 100 μm below the surface of said overlay at the lowest and flush with the surface of said overlay at the highest.
Claim 12
Dependent Claim
31 words
An IC card according to claim 1, wherein said film substrate is made of a material selected from a group consisting of glass-fiber-reinforced epoxy resin, polyimide resin and polyethylene terephthalate resin.
Claim 13
Dependent Claim
26 words
An IC card according to claim 4, wherein said overlay has a thickness which is not smaller than 100 μm but not greater than 150 μm.
Claim 14
Dependent Claim
18 words
An IC card according to claim 1, wherein said externally connecting terminal has an uppermost layer of gold.
Claim 15
Dependent Claim
23 words
An IC card according to claim 13, wherein said externally connecting terminal has a copper layer, a nickel layer and a gold layer.
Claim 16
Dependent Claim
28 words
An IC card according to claim 1, wherein the top surface of said IC chip carrying elements of said IC chip is covered by an epoxy resin layer.
Claim 17
Dependent Claim
50 words
An IC card according to claim 9, wherein said resin filling said space defined by said window in said card-type base and said overlay and receiving said film substrate and said reinforcing plate is a resin selected from a group consisting of a thermocuring epoxy resin and a photocuring resin.
Claim 18
Dependent Claim
35 words
An IC card according to claim 1, wherein said resin filled in said window in said card-like base is made of a resin material selected from a group consisting of thermocuring epoxy-resin and photocuring resin.
Claim 19
Dependent Claim
21 words
An IC card according to claim 1, wherein said IC card has an overall maximum thickness of 0.76 mm or less.
References Cited (Backward Citations)
US4447716A
Cited
US4731645A
Cited
US4649418A
Cited
US4682017A
Cited
US4725924A
Cited
US4731700A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-10-08 | 1994-04-09 | 1994-10-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-10-08 | 1998-04-09 | 1998-10-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-10-08 | 2002-04-09 | 2002-10-09 | $7700.00 | Window Closed / Lapsed |