← Back to Patent Explorer
US4950622A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for manufacturing a surface emitting type AlGaAs/GaAs semiconductor laser diode

Assignee: Korea Advanced Institute of Science and Technology
•
Filing: 1989-04-27
•
Granted: 1990-08-21
•
Expires: 2009-04-27
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A method for manufacturing a surface emitting type AlGaAs/GaAs semiconductor LASER diode by a selective epitaxy method which is capable of forming naturally a 45° mirror reflective face during the epitaxy method itself. The method comprises the steps of forming a silicon oxide or silicon nitride layer on one side of a n-type single crystal GaAs substrate as a mask, removing the mask of the regions each for forming a 45° mirror reflective face and a LASER diode by use of a photolithography and a chemicaletching, forming the two layers by removing the photoresistor on the remaining mask after a selective epitaxy process and converting a slant face of the LASER diode into a vertical face, depositing a n-type metal layer on the other side of the substrate, and carrying out a heat treatment.

Inventors

  • 👤 Young Se Kwon
  • 👤 Tae Kyung Yoo

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 12:29
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/10; H01S5/18; H01S5/185; Y; Y10; Y10S; Y10S148/00; Y10S148/026; Y10S148/095

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 159 words
A method for manufacturing a surface emitting type AlGaAs/GaAs semiconductor LASER diode by a selective epitaxy process comprising the following steps of: forming a silicon oxide layer or a silicon nitride layer on one side of a n-type single crystal GaAs substrate so as to be a mask; removing said mask of regions each for forming a 45° mirror reflective face and a LASER diode by making use of a photolithography method and a chemical etching method; forming a triangular 45° mirror reflective face and a LASER diode by removing the photoresistor on the remaining mask after a selective epitaxy process and depositing a p-type metal layer on those layers; forming a slant face of the LASER diode into a vertical face under the state of said p type metal layer being made as a mask; and depositing a n-type metal layer on the other side of the n-type single crystal GaAs substrate, thereafter carrying out a heat treatment.
Claim 2
Independent Claim 159 words
A method for manufacturing a surface emitting type AlGaAs/GaAs semiconductor LASER diode by a selective epitaxy process comprising the following steps of: forming a silicon oxide layer or a silicon nitride layer on one side of a n-type single crystal GaAs substrate so as to be a mask; removing said mask of regions each for forming a 45° mirror reflective face and a LASER diode by making use of a photolithography method and a chemical etching method; forming a triangular 45° mirror reflective face and a LASER diode by removing the photoresistor on the remaining mask after a selective epitaxy process and depositing a p-type metal layer on those layers; forming a slant face of the LASER diode into a vertical face under the state of said p type metal layer being made as a mask; and depositing a n-type metal layer on the other side of the n-type single crystal GaAs substrate, thereafter carrying out a heat treatment.
Claim 3
Dependent Claim 33 words
The method as claimed in claim 1, wherein the width of the 45° mirror reflective face is 10-50 μm, and the width of the region for forming the LASER diode is 200-1000 μm.
Claim 4
Dependent Claim 49 words
The method as claimed in claim 1, wherein the angle of the mirror reflective face is obtained by making use of a mass-transport of a GaAs layer on a triangular AlGaAs layer during an epitaxy process when manufacturing the triangular 45° mirror reflective face by the selective epitaxy process.

References Cited (Backward Citations)

JPS57164591A Cited
JPS60165777A Cited
US4865684A Cited
US4718070A Cited
US4784722A Cited
JPS61263185A Cited
JPS62106686A Cited
US4869780A Cited
US4881237A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-08-20 1994-02-19 1994-08-21 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-08-20 1998-02-19 1998-08-21 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-08-20 2002-02-19 2002-08-21 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag