US4903120A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Chip carrier with interconnects on lid
Assignee: Texas Instruments Inc
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Filing: 1985-11-22
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Granted: 1990-02-20
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Expires: 2005-11-22
Abstract
Abstract A chip carrier with multiple through hole vias in its hermetic sealing lid. One or more chips is mounted on the inner surface of that lid. The lid contains multiple through vias, and the semiconductor chip on the inner surface of the lid is bonded to the vias in the lid by TAB strips or (optionally) by wire bonds. The vias in the lid connect these leads through to contacts on the outer surface of the package. These contacts can than be connected to (using interconnect structures such as TAB strips, or printed wiring boards, or discretionary wiring), to provide circuit interconnection. Preferably low-power-dissipation chips are mounted on the inner surface of the lid in this fashion, with higher-power-dissipation chips mounted on the bottom surface of the chip cavity.
Inventors
- 👤 Gary L. Beene
- 👤 Thomas D. Petrovich
- 👤 Charles E. Williams
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 16:16
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
134 words
A chip carrier comprising: a chip carrier body defining a cavity therein, said cavity having a substantially planar mounting surface at the bottom thereof and one or more bonding ledges in proximity to said mounting surface within said cavity; external contacts on the exterior of said chip carrier body; a lid hermetically sealed to enclose said cavity in said chip carrier body, said lid comprising conductive vias therethrough; and one or more integrated circuit chips enclosed between said lid and said body within said cavity; wherein a first set of chips (comprising one or more integrated circuit chips) is mounted on said mounting surface, at the bottom of said cavity, and a second set of chips (comprising one or more integrated circuit chips) is mounted on the surface of said lid facing said cavity.
Claim 2
Dependent Claim
134 words
A chip carrier comprising: a chip carrier body defining a cavity therein, said cavity having a substantially planar mounting surface at the bottom thereof and one or more bonding ledges in proximity to said mounting surface within said cavity; external contacts on the exterior of said chip carrier body; a lid hermetically sealed to enclose said cavity in said chip carrier body, said lid comprising conductive vias therethrough; and one or more integrated circuit chips enclosed between said lid and said body within said cavity; wherein a first set of chips (comprising one or more integrated circuit chips) is mounted on said mounting surface, at the bottom of said cavity, and a second set of chips (comprising one or more integrated circuit chips) is mounted on the surface of said lid facing said cavity.
Claim 3
Dependent Claim
22 words
The chip carrier of claim 1, wherein said vias through said lid are not entirely straight, but run crooked within said lid.
Claim 4
Dependent Claim
51 words
The chip carrier of claim 1, wherein said lid comprises a multilayer cofired ceramic structure, said vias each comprising straight vias through each of said cofired layers which are mutually misaligned with respect to the straight vias through other of said cofired layers with short lateral interconnects linking said separate vias.
Claim 5
Dependent Claim
81 words
The chip carrier of claim 1, wherein a first set of chips (comprising one or more integrated circuit chips) is mounted on said first mounting surface, and a second set of chips (comprising one or more chips) is mounted on the surface of said lid facing said cavity, and at least some of said chips in said second set are bonded to said vias in said lid and are not bonded to said contact pads on said ledges inside said cavity.
Claim 6
Dependent Claim
42 words
The chip carrier of claim 4, wherein at least some of said vias are thermally connected with low resistance to said chips in said second set, to provide a heat sinking path through said lid for said chips in said second set.
Claim 7
Dependent Claim
73 words
The chip carrier of claim 4, wherein at least some of said chips in said second set are bonded to said vias in said lid and are not bonded to said contact pads on said ledges inside said cavity, and further comprising interconnects linking portions of said vias on the outer surface of said lid to contact pads on the upper surface of said chip carrier body outside the periphery of said lid.
Claim 8
Dependent Claim
39 words
The chip carrier of claim 1, further comprising interconnects linking portions of said vias on the outer surface of said lid to contact pads on the upper surface of said chip carrier body outside the periphery of said lid.
Claim 9
Dependent Claim
34 words
The chip carrier of claim 7, wherein said contacts on the upper surface of said body are electrically connected to ones of said external contacts on the lower surface of said chip carrier body.
Claim 10
Dependent Claim
34 words
The chip carrier of claim 7, wherein said interconnects from said lid to said upper surface of said body comprise at least one flexible polymer strip having a multiplicity of conductive traces supported thereon.
Claim 11
Dependent Claim
25 words
The chip carrier of claim 7, wherein said interconnects from said lid to said upper surface of said chip carrier body comprise discrete bond wires.
Claim 12
Dependent Claim
25 words
The chip carrier of claim 7, wherein said interconnects from said chip carrier lid to said upper surface of said body comprise a circuit board.
Claim 13
Dependent Claim
43 words
The chip carrier of claim 7, wherein said contacts on said upper surface of said body are connected to said external contacts in proximity to said lower surface of said body through castellation vias on the exterior sides of said chip carrier body.
Claim 14
Dependent Claim
63 words
The chip carrier of claim 4, wherein a plurality of contacts from said first set of chips are connected to pads located on the underside of said chip carrier, and wherein a plurality of contacts from said second set of chips are connected to external contacts at the edge between said underside of said chip carrier and the sides of said chip carrier.
Claim 15
Dependent Claim
21 words
The chip carrier of claim 1, wherein said lid also includes traces on its inner surface, in addition to said vias.
Claim 16
Dependent Claim
19 words
The chip carrier of claim 1, wherein said lid is concave to define a portion of said cavity therein.
Claim 17
Dependent Claim
30 words
The chip carrier of claim 15, wherein said lid also includes bonding ledges in proximity to said cavity therein, said bonding ledges not being coplanar with said second mounting surface.
Claim 18
Dependent Claim
26 words
The chip carrier of claim 1, wherein said lid also comprises traces other than said vias embedded within the body thereof, to provide additional interconnect complexity.
Claim 19
Dependent Claim
30 words
The chip carrier of claim 1, wherein at least some of said chips are connected to said vias in said lid by interconnects which which do not comprise organic material.
Claim 20
Dependent Claim
128 words
A circuit board comprising: a board substrate; a plurality of chip carrier packages affixed to said substrate; and a plurality of traces on said circuit board to interconnect said packages to achieve a predetermined macroscopic circuit configuration; wherein at least some of said chip carrier packages comprise; a chip carrier body defining a cavity therein, said cavity having a substantially planar mounting surface at the bottom thereof and one or more bonding ledges in proximity to said mounting surface within said cavity; external contacts on the exterior of said chip carrier body; a lid hermetically sealed to enclose said cavity in said chip carrier body, said lid comprising conductive vias therethrough; and one or more integrated circuit chips enclosed between said lid and said body within said cavity.
Claim 21
Dependent Claim
128 words
A circuit board comprising: a board substrate; a plurality of chip carrier packages affixed to said substrate; and a plurality of traces on said circuit board to interconnect said packages to achieve a predetermined macroscopic circuit configuration; wherein at least some of said chip carrier packages comprise; a chip carrier body defining a cavity therein, said cavity having a substantially planar mounting surface at the bottom thereof and one or more bonding ledges in proximity to said mounting surface within said cavity; external contacts on the exterior of said chip carrier body; a lid hermetically sealed to enclose said cavity in said chip carrier body, said lid comprising conductive vias therethrough; and one or more integrated circuit chips enclosed between said lid and said body within said cavity.
Claim 22
Dependent Claim
27 words
The board of claim 19, wherein said lid of at least some of said chip carrier packages is concave to define a portion of said cavity therein.
Claim 23
Dependent Claim
47 words
The board of claim 19, wherein at least some of said chip carrier packages further comprise interconnects linking portions of said vias on the outer surface of said lid to contact pads on the upper surface of said chip carrier body outside the periphery of said lid.
Claim 24
Dependent Claim
56 words
The board of claim 19, wherein at least some of said chip carrier packages comprise both a first set of chips (comprising one or more integrated circuit chips) mounted on said first mounting surface, and also a second set of chips (comprising one or more chips) mounted on the surface of said lid facing said cavity.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-02-19 | 1993-08-21 | 1994-02-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-02-19 | 1997-08-21 | 1998-02-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-02-19 | 2001-08-21 | 2002-02-20 | $7700.00 | Window Closed / Lapsed |