Sputter module for modular wafer processing machine

Claim 2

A sputter deposition apparatus comprising: chamber means for holding a vacuum environment when connected to a vacuum pump, said chamber means having a port for receiving a wafer; means for sputter coating a wafer, said means for sputter coating being located in said chamber means; means for supporting a wafer; means for holding a wafer against said means for supporting; means, attached to said means for supporting, for heating said means for supporting; and means for rotating said means for supporting and said means for heating from a first position wherein a surface of said means for supporting is substantially horizontal for receiving a wafer oriented horizontally to a second position wherein said surface is substantially vertical so that a wafer held against said surface by said means for holding is positioned substantially vertically opposite said means for sputter coating.

Claim 3

A sputter deposition apparatus as in claim 1 wherein said means for supporting includes an interior chamber, the interior of which is not in said vacuum environment, said means for supporting being mounted on means for conveying gas to said interior chamber.

Claim 4

A sputter deposition apparatus as in claim 2 wherein said means for supporting includes clips for holding a wafer at points near the perimeter of the wafer and a spring-biased mechanism for forcing said clips against the wafer.

Claim 5

A sputter deposition apparatus as in claim 3 wherein said means for supporting includes means for lifting a wafer from said surface.

Claim 6

A sputter deposition apparatus as in claim 4 wherein said interior chamber of said means for supporting surrounds said means for lifting, said means for lifting being in said vacuum environment.

Claim 7

A sputter deposition apparatus as in claim 5 further including means for closing said port so that a vacuum seal is formed between said chamber means for holding a vacuum environment and a transfer module of a multifunction wafer processing apparatus.

Claim 8

A sputter deposition apparatus as in claim 2 further including a thermocouple attached to said means for supporting and exposed to the interior of said interior chamber.

Claim 9

A sputter deposition apparatus as in claim 1 further including means attached to said chamber means and extendable into said chamber means for disengaging a wafer from said means for holding by contacting a peripheral region of the wafer.

Claim 10

A sputter deposition apparatus as in claim 1 wherein said means for supporting includes channels for conveying a gas to outlet holes in said surface, said channels passing through said means for rotating.

Claim 11

A sputter deposition apparatus comprising: a vacuum chamber for holding a vacuum environment when connected to a vacuum pump, said vacuum chamber having a port for receiving a wafer; a sputter coating source, said sputter coating source being located in said vacuum chamber; a turntable for receiving a wafer in a horizontal plane on a front face from an arm extended through a port into said vacuum chamber, said turntable being located inside said vacuum chamber, said turntable having vacuum-tight walls defining an interior volume not in said vacuum environment and said turntable being mounted on trunnions which are capable of conveying gas to said interior volume of said turntable from a source exterior to said vacuum chamber, said turntable including lifting pins for lifting a wafer from said front face and sealing means for forming a vacuum tight-seal between said interior volume and said lifting pins, said lifting pins operating in the vacuum environment; a clamping apparatus for holding a substrate to said turntable; a heater for heating said front face of said turntable, said heater being attached to said turntable; and a mechanism for rotating said turntable, said clamping apparatus and said heater through a right angle about an axis so that said wafer is positioned substantially vertically opposite said sputter coating source.

Claim 12

A sputter deposition apparatus comprising: a vacuum chamber for holding a vacuum environment when connected to a vacuum pump, said vacuum chamber having a port for receiving a wafer; a sputter coating source, said sputter coating source being located in said vacuum chamber; a turntable for receiving a wafer in a horizontal plane on a front face from an arm extended through a port into said vacuum chamber, said turntable being located inside said vacuum chamber, said turntable having vacuum-tight walls defining an interior volume not in said vacuum environment and said turntable being mounted on trunnions which are capable of conveying gas to said interior volume of said turntable from a source exterior to said vacuum chamber, said turntable including lifting pins for lifting a wafer from said front face and sealing means for forming a vacuum tight-seal between said interior volume and said lifting pins, said lifting pins operating in the vacuum environment; a clamping apparatus for holding a substrate to said turntable; a heater for heating said front face of said turntable, said heater being attached to said turntable; and a mechanism for rotating said turntable, said clamping apparatus and said heater through a right angle about an axis so that said wafer is positioned substantially vertically opposite said sputter coating source.