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US4844719A Expired / Lapsed US ⏱️ 0.0 years remaining

Permeable polymer membrane for dessication of gas

Assignee: Asahi Kasei Corp
•
Filing: 1987-09-08
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Granted: 1989-07-04
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Expires: 2007-09-08
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Abstract

Abstract A permeable polymer membrane, formed of a fluorine type copolymer containing a repeating unit represented by the general formula: ##STR1## wherein m is 0 or 1 and n is an integer of the value of 2 to 5 and satisfying the relation between the water absorption ratio, W, and the ion-exchange capacity, Q, represented by the following formula: 1.20Q-1.964<log W<1.2=0Q-1.742 wherein W is W 2 -W 1 )/W 1 , W 1 a dry weight, W 2 an equilibrium weight as immersed in pure water at 25° C., and Q an ion-exchange capacity in meq/g of H form dry resin. This permeable polymer membrane is capable of highly desiccating a gas to a low water content. By the use of the extremely desiccated gas, semiconductor elements, semiconductor devices, intermediates thereof, and new components can be produced with outstanding quality. This permeable polymer membrane can be produced by a heat treatment.

Inventors

  • 👤 Kazuo Toyomoto
  • 👤 Eigo Terada
  • 👤 Hiroshi Kobayashi
  • 👤 Yoshiaki Kageura

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 16:17
CPC Classifications
C; C08; C08F; C08F214/00; C08F214/18; B; B01; B01D; B01D53/00; B01D53/26; B01D53/268; B01D71/00; B01D71/06; B01D71/76; C08J; C08J5/00; C08J5/20; C08J5/22; C08J5/2206; C08J5/2218; C08J5/2231; C08J5/2237; C23; C23C; C23C16/00; C23C16/44; C23C16/4401; C23C16/4402; B01D71/30; B01D71/32; C08J2327/00; C08J2327/02; C08J2327/12; C08J2327/18

Claims Analysis

Total Claims: 43
Claim 1
Independent Claim 88 words
A method for the desiccation of a water-containing gas, which comprises: preparing a permeable polymer membrane formed of a fluorine type copolymer containing a repeating unit represented by the general formula: ##STR24## wherein m is 0 or 1 and n is an integer of the value of 2 to 5, said permeable polymer membrane being thermally treated at a temperature in the range of 60° C. to 250° C. and having a water absorption ratio, W, and an ion-exchange capacity, Q, which are represented by the following formula:
Claim 2
Independent Claim 88 words
A method for the desiccation of a water-containing gas, which comprises: preparing a permeable polymer membrane formed of a fluorine type copolymer containing a repeating unit represented by the general formula: ##STR24## wherein m is 0 or 1 and n is an integer of the value of 2 to 5, said permeable polymer membrane being thermally treated at a temperature in the range of 60° C. to 250° C. and having a water absorption ratio, W, and an ion-exchange capacity, Q, which are represented by the following formula:
Claim 3
Dependent Claim 97 words
20Q-1.964<log W<1.20Q-1.742 wherein W is (W 2 -W 1 )/W 1 , W 1 is a dry weight, W 2 is an equilibrium weight as immersed in pure water at 25° C., and Q is an ion-exchange capacity in meq/g of H form dry resin in the form of a membrane; and bringing said gas into contact with one side of said membrane, and either bringing a dry purge gas into contact with the other side of said membrane or reducing the pressure on said other side of said membrane thereby removing water from said water-containing gas.
Claim 4
Dependent Claim 97 words
20Q-1.964<log W<1.20Q-1.742 wherein W is (W 2 -W 1 )/W 1 , W 1 is a dry weight, W 2 is an equilibrium weight as immersed in pure water at 25° C., and Q is an ion-exchange capacity in meq/g of H form dry resin in the form of a membrane; and bringing said gas into contact with one side of said membrane, and either bringing a dry purge gas into contact with the other side of said membrane or reducing the pressure on said other side of said membrane thereby removing water from said water-containing gas.
Claim 5
Dependent Claim 13 words
The method according to claim 1, wherein said desiccated gas comprises hydrogen chloride.
Claim 6
Independent Claim 101 words
A method for etching a semiconductor wafer, a semiconductor device, or an intermediate thereof, which comprises: using a gas which has been desiccated by preparing a permeable polymer membrane formed of a fluorine type copolymer containing a repeating unit represented by the general formula: ##STR25## wherein m is 0 or 1 and n is an integer of the value of 2 to 5, said permeable polymer membrane being thermally treated at a temperature in the range of 60° C. to 250° C. and having a water absorption ratio, W, and an ion-exchange capacity, Q, which are represented by the following formula:
Claim 7
Independent Claim 101 words
A method for etching a semiconductor wafer, a semiconductor device, or an intermediate thereof, which comprises: using a gas which has been desiccated by preparing a permeable polymer membrane formed of a fluorine type copolymer containing a repeating unit represented by the general formula: ##STR25## wherein m is 0 or 1 and n is an integer of the value of 2 to 5, said permeable polymer membrane being thermally treated at a temperature in the range of 60° C. to 250° C. and having a water absorption ratio, W, and an ion-exchange capacity, Q, which are represented by the following formula:
Claim 8
Dependent Claim 97 words
20Q-1.964<log W<1.20Q-1.742 wherein W is (W 2 -W 1 )/W 1 , W 1 is a dry weight, W 2 is an equilibrium weight as immersed in pure water at 25° C., and Q is an ion-exchange capacity in meq/g of H form dry resin in the form of a membrane; and bringing said gas into contact with one side of said membrane, and either bringing a dry purge gas into contact with the other side of said membrane or reducing the pressure on said other side of said membrane thereby removing water from said water-containing gas.
Claim 9
Dependent Claim 97 words
20Q-1.964<log W<1.20Q-1.742 wherein W is (W 2 -W 1 )/W 1 , W 1 is a dry weight, W 2 is an equilibrium weight as immersed in pure water at 25° C., and Q is an ion-exchange capacity in meq/g of H form dry resin in the form of a membrane; and bringing said gas into contact with one side of said membrane, and either bringing a dry purge gas into contact with the other side of said membrane or reducing the pressure on said other side of said membrane thereby removing water from said water-containing gas.
Claim 10
Dependent Claim 13 words
The method according to claim 3, wherein said desiccated gas comprises hydrogen chloride.
Claim 11
Independent Claim 118 words
A method of oxide coating in the production of a semiconductor wafer, a semiconductor device, or an intermediate thereof, which comprises: forming said oxide coating by the use of an ordinary gas and/or a corrosive gas which has been desiccated by preparing a permeable polymer membrane formed of a fluorine type copolymer containing a repeating unit represented by the general formula: ##STR26## wherein m is 0 or 1 and n is an integer of the value of 2 to 5, said permeable polymer membrane being thermally treated at a temperature in the range of 60° C. to 250° C. and having a water absorption ratio, W, and an ion-exchange capacity, Q, which are represented by the following formula:
Claim 12
Independent Claim 118 words
A method of oxide coating in the production of a semiconductor wafer, a semiconductor device, or an intermediate thereof, which comprises: forming said oxide coating by the use of an ordinary gas and/or a corrosive gas which has been desiccated by preparing a permeable polymer membrane formed of a fluorine type copolymer containing a repeating unit represented by the general formula: ##STR26## wherein m is 0 or 1 and n is an integer of the value of 2 to 5, said permeable polymer membrane being thermally treated at a temperature in the range of 60° C. to 250° C. and having a water absorption ratio, W, and an ion-exchange capacity, Q, which are represented by the following formula:
Claim 13
Dependent Claim 103 words
20Q-1.964<log W<1.20Q-1.742 wherein W is (W 2 -W 1 )/W 1 , W 1 is a dry weight, W 2 is an equilibrium weight as immersed in pure water at 25° C., and Q is an ion-exchange capacity in meq/g of H form dry resin in the form of a membrane; and bringing said ordinary and/or corrosive gas into contact with one side of said membrane, and either bringing a dry purge gas into contact with the other side of said membrane or reducing the pressure on said other side of said membrane thereby removing water from said ordinary gas and/or corrosive gas.
Claim 14
Dependent Claim 103 words
20Q-1.964<log W<1.20Q-1.742 wherein W is (W 2 -W 1 )/W 1 , W 1 is a dry weight, W 2 is an equilibrium weight as immersed in pure water at 25° C., and Q is an ion-exchange capacity in meq/g of H form dry resin in the form of a membrane; and bringing said ordinary and/or corrosive gas into contact with one side of said membrane, and either bringing a dry purge gas into contact with the other side of said membrane or reducing the pressure on said other side of said membrane thereby removing water from said ordinary gas and/or corrosive gas.
Claim 15
Dependent Claim 13 words
The method according to claim 5, wherein said desiccated gas comprises hydrogen chloride.
Claim 16
Independent Claim 136 words
A method for cleaning the surface of a semiconductor wafer, a CVD device, and an impurity diffusing furnace in the production of the semiconductor wafer, a semiconductor device, or an intermediate thereof, which comprises: passing a raw material gas through an entire system and thereafter effecting said cleaning by the use of a gas which has been desiccated by preparing a permeable polymer membrane formed of a fluorine type copolymer containing a repeating unit represented by the general formula: ##STR27## wherein m is 0 or 1 and n is an integer of the value of 2 to 5, said permeable polymer membrane being thermally treated at a temperature in the range of 60° C. to 250° C. and having a water absorption ratio, W, and an ion-exchange capacity, Q, which are represented by the following formula:
Claim 17
Independent Claim 136 words
A method for cleaning the surface of a semiconductor wafer, a CVD device, and an impurity diffusing furnace in the production of the semiconductor wafer, a semiconductor device, or an intermediate thereof, which comprises: passing a raw material gas through an entire system and thereafter effecting said cleaning by the use of a gas which has been desiccated by preparing a permeable polymer membrane formed of a fluorine type copolymer containing a repeating unit represented by the general formula: ##STR27## wherein m is 0 or 1 and n is an integer of the value of 2 to 5, said permeable polymer membrane being thermally treated at a temperature in the range of 60° C. to 250° C. and having a water absorption ratio, W, and an ion-exchange capacity, Q, which are represented by the following formula:
Claim 18
Dependent Claim 96 words
20Q-1.964<log W<1.20Q-1.742 wherein W is (W 2 -W 1 )/W 1 , W 1 is a dry weight, W 2 is an equilibrium weight as immersed in pure water at 25° C., and Q is an ion-exchange capacity in meq/g of H form dry resin in the form of a membrane; and bringing said gas into contact with one side of said membrane, and either bringing a dry purge gas into contact with the other side of said membrane or reducing the pressure on said other side of said membrane thereby removing water from said gas.
Claim 19
Dependent Claim 96 words
20Q-1.964<log W<1.20Q-1.742 wherein W is (W 2 -W 1 )/W 1 , W 1 is a dry weight, W 2 is an equilibrium weight as immersed in pure water at 25° C., and Q is an ion-exchange capacity in meq/g of H form dry resin in the form of a membrane; and bringing said gas into contact with one side of said membrane, and either bringing a dry purge gas into contact with the other side of said membrane or reducing the pressure on said other side of said membrane thereby removing water from said gas.
Claim 20
Dependent Claim 13 words
The method according to claim 7, wherein said desiccated gas comprises hydrogen chloride.
Claim 21
Independent Claim 130 words
A method for diffusing impurities in the production of a semiconductor wafer, a compound semiconductor wafer, a semiconductor device, a compound semiconductor device, and/or an intermediate thereof, which comprises: diffusing said impurities on said semiconductor wafer of said compound semiconductor wafer by the use of a doping gas which has been desiccated by preparing a permeable polymer membrane formed of a fluorine type copolymer containing a repeating unit represented by the general formula: ##STR28## wherein m is 0 or 1 and n is an integer of the value of 2 to 5, said permeable polymer membrane being thermally treated at a temperature in the range of 60° C. to 250° C. and having a water absorption ratio, W, and an ion-exchange capacity, Q, which are represented by the following formula:
Claim 22
Independent Claim 130 words
A method for diffusing impurities in the production of a semiconductor wafer, a compound semiconductor wafer, a semiconductor device, a compound semiconductor device, and/or an intermediate thereof, which comprises: diffusing said impurities on said semiconductor wafer of said compound semiconductor wafer by the use of a doping gas which has been desiccated by preparing a permeable polymer membrane formed of a fluorine type copolymer containing a repeating unit represented by the general formula: ##STR28## wherein m is 0 or 1 and n is an integer of the value of 2 to 5, said permeable polymer membrane being thermally treated at a temperature in the range of 60° C. to 250° C. and having a water absorption ratio, W, and an ion-exchange capacity, Q, which are represented by the following formula:
Claim 23
Dependent Claim 98 words
20Q-1.964<log W<1.20Q-1.742 wherein W is (W 2 -W 1 )/W 1 , W 1 is a dry weight, W 2 is an equilibrium weight as immersed in pure water at 25° C., and Q is an ion-exchange capacity in meq/g of H form dry resin in the form of a membrane; and bringing said doping gas into contact with one side of said membrane, and either bringing a dry purge gas into contact with the other side of said membrane or reducing the pressure on said other side of said membrane thereby removing water from said doping gas.
Claim 24
Dependent Claim 98 words
20Q-1.964<log W<1.20Q-1.742 wherein W is (W 2 -W 1 )/W 1 , W 1 is a dry weight, W 2 is an equilibrium weight as immersed in pure water at 25° C., and Q is an ion-exchange capacity in meq/g of H form dry resin in the form of a membrane; and bringing said doping gas into contact with one side of said membrane, and either bringing a dry purge gas into contact with the other side of said membrane or reducing the pressure on said other side of said membrane thereby removing water from said doping gas.
Claim 25
Dependent Claim 13 words
The method according to claim 9, wherein said desiccated gas comprises hydrogen chloride.
Claim 26
Independent Claim 132 words
A method for forming a coating on a substrate placed under a vacuum or atmospheric pressure, which comprises: introducing a raw material gas for the formation of said coating and/or a carrier gas into the system enclosing said vacuum or atmospheric pressure therein, wherein said raw material gas and/or carrier gas has been desiccated by preparing a permeable polymer membrane formed of a fluorine type copolymer containing a repeating unit represented by the general formula: ##STR29## wherein m is 0 or 1 and n is an integer of the value of 2 to 5, said permeable polymer membrane being thermally treated at a temperature in the range of 60° C. to 250° C. and having a water absorption ratio, W, and an ion-exchange capacity, Q, which are represented by the following formula:
Claim 27
Independent Claim 132 words
A method for forming a coating on a substrate placed under a vacuum or atmospheric pressure, which comprises: introducing a raw material gas for the formation of said coating and/or a carrier gas into the system enclosing said vacuum or atmospheric pressure therein, wherein said raw material gas and/or carrier gas has been desiccated by preparing a permeable polymer membrane formed of a fluorine type copolymer containing a repeating unit represented by the general formula: ##STR29## wherein m is 0 or 1 and n is an integer of the value of 2 to 5, said permeable polymer membrane being thermally treated at a temperature in the range of 60° C. to 250° C. and having a water absorption ratio, W, and an ion-exchange capacity, Q, which are represented by the following formula:
Claim 28
Dependent Claim 105 words
20Q-1.964<log W<1.20Q-1.742 wherein W is (W 2 -W 1 )/W 1 , W 1 is a dry weight, W 2 is an equilibrium weight as immersed in pure water at 25° C., and Q is an ion-exchange capacity in meq/g of H form dry resin in the form of a membrane; and bringing said raw material and/or carrier gas into contact with one side of said membrane, and either bringing a dry purge gas into contact with the other side of said membrane or reducing the pressure on said other side of said membrane thereby removing water from said raw material gas and/or carrier gas.
Claim 29
Dependent Claim 105 words
20Q-1.964<log W<1.20Q-1.742 wherein W is (W 2 -W 1 )/W 1 , W 1 is a dry weight, W 2 is an equilibrium weight as immersed in pure water at 25° C., and Q is an ion-exchange capacity in meq/g of H form dry resin in the form of a membrane; and bringing said raw material and/or carrier gas into contact with one side of said membrane, and either bringing a dry purge gas into contact with the other side of said membrane or reducing the pressure on said other side of said membrane thereby removing water from said raw material gas and/or carrier gas.
Claim 30
Independent Claim 129 words
A method for producing a permeable polymer membrane having a water absorption ratio, W, and an ion-exchange capacity, Q, represented by the following formula: 1.20Q-1.964<log W<1.20Q-1.742 wherein W is (W 2 -W 1 )/W 1 , W 1 is a dry weight, W 2 is an equilibrium weight as immersed in pure water at 25° C., and Q is an ion-exchange capacity in meq/g of H form dry resin in the form of a membrane, which comprises: forming a membrane of a fluorine type copolymer containing a repeating unit represented by the general formula: ##STR30## wherein m is 0 or 1 and n is an integer of the value of 2 to 5, and heating the membrane at a temperature in the range of 60° C. to 250° C.
Claim 31
Independent Claim 129 words
A method for producing a permeable polymer membrane having a water absorption ratio, W, and an ion-exchange capacity, Q, represented by the following formula: 1.20Q-1.964<log W<1.20Q-1.742 wherein W is (W 2 -W 1 )/W 1 , W 1 is a dry weight, W 2 is an equilibrium weight as immersed in pure water at 25° C., and Q is an ion-exchange capacity in meq/g of H form dry resin in the form of a membrane, which comprises: forming a membrane of a fluorine type copolymer containing a repeating unit represented by the general formula: ##STR30## wherein m is 0 or 1 and n is an integer of the value of 2 to 5, and heating the membrane at a temperature in the range of 60° C. to 250° C.
Claim 32
Dependent Claim 23 words
The method according to claim 12, wherein said heating is carried out at a temperature in the range of 70° to 200° C.
Claim 33
Dependent Claim 76 words
A permeable polymer membrane formed of a fluorine type copolymer containing a repeating unit represented by the general formula: ##STR31## wherein m is 0 or 1 and n is an integer of the value of 2 to 5, said permeable polymer membrane being thermally treated at a temperature in the range of 60° C. to 250° C. and having a water absorption ratio, W, and an ion-exchange capacity, Q, which are represented by the following formula:
Claim 34
Dependent Claim 76 words
A permeable polymer membrane formed of a fluorine type copolymer containing a repeating unit represented by the general formula: ##STR31## wherein m is 0 or 1 and n is an integer of the value of 2 to 5, said permeable polymer membrane being thermally treated at a temperature in the range of 60° C. to 250° C. and having a water absorption ratio, W, and an ion-exchange capacity, Q, which are represented by the following formula:
Claim 35
Dependent Claim 51 words
20Q-1.964<log W<1.20Q-1.742 wherein W is (W 2 -W 1 )/W 1 , W 1 is a dry weight, W 2 is an equilibrium weight as immersed in pure water at 25° C., and Q is an ion-exchange capacity in meq/g of H form dry resin in the form of a membrane.
Claim 36
Dependent Claim 51 words
20Q-1.964<log W<1.20Q-1.742 wherein W is (W 2 -W 1 )/W 1 , W 1 is a dry weight, W 2 is an equilibrium weight as immersed in pure water at 25° C., and Q is an ion-exchange capacity in meq/g of H form dry resin in the form of a membrane.
Claim 37
Dependent Claim 20 words
The permeable polymer membrane according to claim 14, wherein m is 1 and n is 3 in said general formula.
Claim 38
Dependent Claim 20 words
The permeable polymer membrane according to claim 14, wherein said permeable polymer membrane is in the form of hollow fibers.
Claim 39
Dependent Claim 24 words
The permeable polymer membrane according to claim 14 wherein the ion-exchange capacity is in the range of 0.8-1.8 meq/g of H form dry resin.
Claim 40
Independent Claim 156 words
An apparatus for forming a thin-film, comprising: a film-forming chamber capable of maintaining the interior thereof under a vacuum or atmospheric pressure, a gas inlet for introducing a gas from a gas supply source into said film-forming chamber, vacuumizing means capable of evacuating said film-forming chamber of a gas, and water separating means interposed between said gas inlet and said gas supply source, wherein said water separating means comprises a casing having inserted therein a multiplicity of hollow fibers of a permeable polymer membrane formed of a fluorine type copolymer containing a repeating unit represented by the general formula: ##STR32## wherein m is 0 or 1 and n is an integer of the value of 2 to 5, said permeable polymer membrane being thermally treated at a temperature in the range of 60° C. to 250° C. and having a water absorption ratio, W, and an ion-exchange capacity, Q, which are represented by the following formula:
Claim 41
Independent Claim 156 words
An apparatus for forming a thin-film, comprising: a film-forming chamber capable of maintaining the interior thereof under a vacuum or atmospheric pressure, a gas inlet for introducing a gas from a gas supply source into said film-forming chamber, vacuumizing means capable of evacuating said film-forming chamber of a gas, and water separating means interposed between said gas inlet and said gas supply source, wherein said water separating means comprises a casing having inserted therein a multiplicity of hollow fibers of a permeable polymer membrane formed of a fluorine type copolymer containing a repeating unit represented by the general formula: ##STR32## wherein m is 0 or 1 and n is an integer of the value of 2 to 5, said permeable polymer membrane being thermally treated at a temperature in the range of 60° C. to 250° C. and having a water absorption ratio, W, and an ion-exchange capacity, Q, which are represented by the following formula:
Claim 42
Dependent Claim 79 words
20Q-1.964<log W<1.20Q-1.742 wherein W is (W 2 -W 1 )/W 1 , W 1 is a dry weight, W 2 is an equilibrium weight as immersed in pure water at 25° C., and Q is an ion-exchange capacity in meq/g of H form dry resin in the form of a membrane, with the opposite ends of said hollow fibers fixed in place with resin in such a manner that different gases are passable outside and inside said hollow fibers.
Claim 43
Dependent Claim 79 words
20Q-1.964<log W<1.20Q-1.742 wherein W is (W 2 -W 1 )/W 1 , W 1 is a dry weight, W 2 is an equilibrium weight as immersed in pure water at 25° C., and Q is an ion-exchange capacity in meq/g of H form dry resin in the form of a membrane, with the opposite ends of said hollow fibers fixed in place with resin in such a manner that different gases are passable outside and inside said hollow fibers.

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