Apparatus and method for transferring workpieces

Claim 1

In apparatus for handling a plurality of semiconductor wafers comprising: a horizontal baseplate having a rectilinear slot therethrough; a carriage; means shiftably mounting the carriage on the baseplate below the slot for movement along a horizontal path relative thereto; a post extending through the slot and having an upper and a lower end; a vertical lead screw journalled on the carriage and movable therewith along said horizontal path; means coupling the post to the vertical lead screw for movement of the post along a vertical path as a function of the rotation of the vertical lead screw; a horizontal screw journalled at its ends thereof on the baseplate on the lower surface thereof, there being means coupling the carriage to the horizontal lead screw for movement of the carriage in response to the rotation of the horizontal lead screw relative to the baseplate; a first reversible drive motor coupled with the horizontal lead screw for rotating the same to cause movement of the post along said horizontal path, said post having a shaft rotatably mounted therein and extending longitudinally thereof, there being a wafer transfer arm coupled to the upper end of the shaft for rotation therewith relative to the post; a second reversible drive motor carried by the post near the lower end thereof for rotating the shaft relative to the post and thereby rotating the transfer arm in a generally horizontal plane, said arm having an outer end provided with a wafer engageable pad, said pad, said arm and shaft having a fluid passage therethrough, there being vacuum means coupled with said fluid passage for reducing the air pressure therewithin to cause a suction force at the pad to thereby permit removable attachment of a wafer to the pad; a third drive motor coupled with the vertical lead screw for rotating the same; and control means coupled with said drive motors and said vacuum means for actuating the same in accordance with a predetermined sequence.