US4764803A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thin semiconductor card
Assignee: Mitsubishi Electric Corp
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Filing: 1987-03-17
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Granted: 1988-08-16
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Expires: 2007-03-17
Abstract
Abstract The reliability of a thin semiconductor card, such as an IC card, is enhanced by stress absorbing part such as deformable part for absorbing externally applied stress, thereby preventing the stress from damaging the card main body, the semiconductor module, or the semiconductor elements. Alternatively, protection is provided by a weaker section, located away from the semiconductor module, that breaks under external stress before the stress can destroy the semiconductor module.
Inventors
- 👤 Tetsuya Ueda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 13:11
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/0772; G06K19/07728; G06K19/02
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
47 words
A thin semiconductor card comprising: a card main body and a semiconductor module mounted therein, wherein said card main body is provided with strip-shaped portions, extending across said card main body and intersecting each other, which can absorb stresses resulting from external forces applied to the card.
Claim 2
Dependent Claim
47 words
A thin semiconductor card comprising: a card main body and a semiconductor module mounted therein, wherein said card main body is provided with strip-shaped portions, extending across said card main body and intersecting each other, which can absorb stresses resulting from external forces applied to the card.
Claim 3
Dependent Claim
27 words
A thin semiconductor card according to claim 1, wherein said stress-absorbing means comprises deformable means that absorb stress by deforming under the action of externally applied forces.
Claim 4
Dependent Claim
16 words
A thin semiconductor card according to claim 2, wherein said deformable means comprises an elastic material.
Claim 5
Dependent Claim
85 words
A thin semiconductor card comprising: a card main body and a semiconductor module mounted therein, wherein said card main body is provided with strip-shaped portions extending across said card main body at locations other than that where said semconductor module is provided and intersecting each other, said strip-shaped portions being weaker than that part of said card main body in which said semiconductor module is provided, so that, when an external force is applied, said strip-shaped portions will break before said semiconductor module is destroyed.
Claim 6
Dependent Claim
85 words
A thin semiconductor card comprising: a card main body and a semiconductor module mounted therein, wherein said card main body is provided with strip-shaped portions extending across said card main body at locations other than that where said semconductor module is provided and intersecting each other, said strip-shaped portions being weaker than that part of said card main body in which said semiconductor module is provided, so that, when an external force is applied, said strip-shaped portions will break before said semiconductor module is destroyed.
Claim 7
Dependent Claim
19 words
A thin semiconductor card according to claim 1, wherein said strip-shaped portions intersect each other at substantially right angles.
Claim 8
Dependent Claim
25 words
A thin semiconductor card according to claim 1, wherein said strip-shaped portions extend substantially in the length and width directions of said card main body.
Claim 9
Dependent Claim
19 words
A thin semiconductor card according to claim 4, wherein said strip-shaped portions intersect each other at substantially right angles.
Claim 10
Dependent Claim
25 words
A thin semiconductor card according to claim 4, wherein said strip-shaped portions extend substantially in the length and width directions of said card main body.
References Cited (Backward Citations)
JPS536491A
Cited
JPS5562591A
Cited
JPS5626451A
Cited
US4463971A
Cited
JPS58210646A
Cited
US4639585A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-08-16 | 1992-02-15 | 1992-08-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-08-16 | 1996-02-15 | 1996-08-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-08-16 | 2000-02-15 | 2000-08-16 | $7700.00 | Window Closed / Lapsed |