US4668334A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for applying a layer of photosensitive material to a semiconductor wafer
Assignee: US Philips Corp
•
Filing: 1985-11-06
•
Granted: 1987-05-26
•
Expires: 2005-11-06
Abstract
Abstract In a method of applying a layer of photosensitive material to a semiconductor material wafer (3), the photosensitive material is applied in liquid form to the wafer and the wafer is then rotated in order to obtain the desired thickness of the layer. Photosensitive material (7) present at the edge (6) of the wafer (3) is removed by means of a jet of a liquid directed onto this edge to dissolve the photosensitive material, the jet being directed first to an area beyond the wafer of semiconductor material, where upon the jet of liquid is directed to the edge of the wafer and finally the jet of liquid is directed again to an area beyond the wafer and the supply of liquid is switched off.
Inventors
- 👤 Herman E. Doornveld
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 19:38
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/16; G03F7/162
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
129 words
A method of applying a layer of photosensitive material to a wafer of semiconductor material, in which photosensitive material is applied to the wafer in liquid form and the wafer is then rotated in order to obtain the desired thickness of the layer, photosensitive material present at an edge of the wafer being removed by means of a jet of a liquid directed onto this edge to dissolve the photosensitive material characterized in that the jet of the liquid employed to dissolve the photosensitive material is directed first onto an area beyond the wafer of semiconductor material, in that the jet of liquid is then directed to the edge of the wafer and in that subsequently the jet of liquid is directed again onto an area beyond the wafer.
Claim 2
Independent Claim
129 words
A method of applying a layer of photosensitive material to a wafer of semiconductor material, in which photosensitive material is applied to the wafer in liquid form and the wafer is then rotated in order to obtain the desired thickness of the layer, photosensitive material present at an edge of the wafer being removed by means of a jet of a liquid directed onto this edge to dissolve the photosensitive material characterized in that the jet of the liquid employed to dissolve the photosensitive material is directed first onto an area beyond the wafer of semiconductor material, in that the jet of liquid is then directed to the edge of the wafer and in that subsequently the jet of liquid is directed again onto an area beyond the wafer.
Claim 3
Independent Claim
135 words
An apparatus for applying a layer of photosensitive material to a wafer of semiconductor material, which apparatus comprises a rotatable table, means for holding a wafer of semiconductor material on the table and a supply device for a liquid capable of dissolving photosensitive material, characterized in that said supply device comprises a tubular part provided with an outlet nozzle for the liquid capable of dissolving the photosensitive material and in that the tubular part with the outlet nozzle is arranged so as to be laterally displaceable with respect to the rotatable table and means for laterally displacing said tubular part in a manner such that a jet of liquid emanating from the outlet nozzle is directed beyond the edge, then to the edge and subequently again beyond the edge of said wafer of semiconductor material.
Claim 4
Independent Claim
135 words
An apparatus for applying a layer of photosensitive material to a wafer of semiconductor material, which apparatus comprises a rotatable table, means for holding a wafer of semiconductor material on the table and a supply device for a liquid capable of dissolving photosensitive material, characterized in that said supply device comprises a tubular part provided with an outlet nozzle for the liquid capable of dissolving the photosensitive material and in that the tubular part with the outlet nozzle is arranged so as to be laterally displaceable with respect to the rotatable table and means for laterally displacing said tubular part in a manner such that a jet of liquid emanating from the outlet nozzle is directed beyond the edge, then to the edge and subequently again beyond the edge of said wafer of semiconductor material.
Claim 5
Dependent Claim
70 words
An apparatus as claimed in claim 2, characterized in that the tubular part provided with the outlet nozzle is pivotably arranged and in that means are included for pivoting the tubular part from the position in which the jet of liquid is directed beyond the edge of the semiconductor wafer, into a position in which the jet of liquid is directed to said edge and then again beyond said edge.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-05-25 | 1990-11-24 | 1991-05-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-05-25 | 1994-11-24 | 1995-05-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-05-25 | 1998-11-24 | 1999-05-26 | $7700.00 | Window Closed / Lapsed |