Method for constructing a surgical implant

Claim 1

A method for constructing a surgical implant wherein a biologically compatible substrate is adapted for transmitting loads imparted to a skeletal structure of an animal or human and a porous layer is coupled to the substrate to enhance biological fixation of the implant relative to the skeletal structure, the method comprising the steps of disposing the porous layer adjacent to the substrate and subjecting the porous layer and the substrate to metallurgical bonding by transmitting a current through the porous layer and the substrate so that all of the porous layer is metallurgically bonded together at points of contact therebetween to form a porous surface and the porous layer is metallurgically bonded to the substrate at the points of contact therebetween, the metallurgical bonding takes place in the absence of a furnace to substantially avoid heat build up throughout the substrate and substantially confine heat build up at the points of contact, and the metallurgical bonding occurs via an electrode engageable with the porous layer and the electrode is moved toward the porous layer while current is transmitted to the porous layer and the substrate, and movement of the electrode is limited independently of the porous layer to a predetermined distance.

Claim 2

A method for constructing a surgical implant wherein a biologically compatible substrate is adapted for transmitting loads imparted to a skeletal structure of an animal or human and a porous layer is coupled to the substrate to enhance biological fixation of the implant relative to the skeletal structure, the method comprising the steps of disposing the porous layer adjacent to the substrate and subjecting the porous layer and the substrate to metallurgical bonding by transmitting a current through the porous layer and the substrate so that all of the porous layer is metallurgically bonded together at points of contact therebetween to form a porous surface and the porous layer is metallurgically bonded to the substrate at the points of contact therebetween, the metallurgical bonding takes place in the absence of a furnace to substantially avoid heat build up throughout the substrate and substantially confine heat build up at the points of contact, and the metallurgical bonding occurs via an electrode engageable with the porous layer and the electrode is moved toward the porous layer while current is transmitted to the porous layer and the substrate, and movement of the electrode is limited independently of the porous layer to a predetermined distance.