US4614563A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for producing multilayer conductor structure
Assignee: Fujifilm Holdings Corp
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Filing: 1985-07-29
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Granted: 1986-09-30
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Expires: 2005-07-29
Abstract
Abstract A process for producing a multilayer conductor structure having at least two conductor patterns in layers and a smooth surface over the upper pattern, which comprises the steps of: (1) forming a first conductor pattern on a substrate or a layer provided on the substrate; (2) providing a conductor layer over an intermediate insulation layer formed on said first conductor pattern; (3) providing a resin layer on said conductor layer to form a smooth surface thereover; and (4) etching said resin layer and a part of said conductor layer provided on the first conductor pattern to form a second conductor pattern having a smooth surface thereon.
Inventors
- 👤 Takashi Kubo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 15:05
CPC Classifications
G; G11; G11B; G11B5/00; G11B5/127; G11B5/31; G11B5/3163; H; H01; H01F; H01F41/00; H01F41/32; H01F41/34; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/056; H10W20/062; H10W20/063
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
107 words
A process for producing a multilayer conductor structure having at least two conductor patterns in layers and a smooth surface over the upper pattern, which comprises the steps of: (1) forming a first conductor pattern on a substrate or on a layer provided on the substrate; (2) providing a conductor layer over an intermediate insulation layer formed on said first conductor pattern; (3) providing a resin layer on said conductor layer to form a smooth surface thereon; and (4) etching said resin layer and a part of said conductor layer provided on the first conductor pattern to form a second conductor pattern having a smooth surface thereon.
Claim 2
Dependent Claim
107 words
A process for producing a multilayer conductor structure having at least two conductor patterns in layers and a smooth surface over the upper pattern, which comprises the steps of: (1) forming a first conductor pattern on a substrate or on a layer provided on the substrate; (2) providing a conductor layer over an intermediate insulation layer formed on said first conductor pattern; (3) providing a resin layer on said conductor layer to form a smooth surface thereon; and (4) etching said resin layer and a part of said conductor layer provided on the first conductor pattern to form a second conductor pattern having a smooth surface thereon.
Claim 3
Dependent Claim
75 words
The process for producing a multilayer conductor structure as claimed in claim 1, wherein said conductor layer provided over the intermediate insulation layer has a thickness equal to or greater than that of the first conductor pattern, the said conductor layer has a step of a height in the range of 0.8 to 8 μm, and the thickness of said resin layer is in the range of 1 to 20 μm in the recessed area.
Claim 4
Dependent Claim
41 words
The process for producing a multilayer conductor structure as claimed in claim 1, wherein said conductor is of a conductive metal composed of Cu, Al, Au, an alloy thereof or permalloy and said resin layer is of a quinone diazide photoresist.
Claim 5
Dependent Claim
24 words
The process for producing a multilayer conductor structure as claimed in claim 1, wherein said etching is performed by ion-beam etching or sputter etching.
Claim 6
Dependent Claim
24 words
The process for producing a multilayer conductor structure as claimed in claim 1, wherein the steps (1) to (4) are repeated at least twice.
Claim 7
Dependent Claim
31 words
The process for producing a multilayer conductor structure as claimed in any of claims 1 to 5, wherein said multilayer conductor structure is a multilayer coil of a thin-film magnetic head.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-09-29 | 1990-03-31 | 1990-09-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-09-29 | 1994-03-31 | 1994-09-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-09-29 | 1998-03-31 | 1998-09-30 | $7700.00 | Window Closed / Lapsed |