US4568562A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of electroless plating employing plasma treatment
Assignee: Hughes Missile Systems Co
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Filing: 1984-11-28
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Granted: 1986-02-04
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Expires: 2004-11-28
Abstract
Abstract A method for electroless overplating of a conductive metal on printed wiring circuitry components mounted upon a plastic substrate which eliminates deposit metal overgrowth upon the plastic substrate and plastic bonding materials. The substrate and printed wiring are treated by exposure to a tetrafluoromethane plasma environment to chemically passivate, or neutralize, the plastic or adhesive substrate surface areas prior to electroless plating of the printed circuitry elements, thus preventing the establishment of catalyzing ions on the plastic or adhesive surfaces and subsequent lay down of the deposited metal thereon.
Inventors
- 👤 Eugene Phillips
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 18:32
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/244; B; B05; B05D; B05D1/00; B05D1/62; B05D3/00; B05D3/14; B05D3/141; B05D3/142; C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/22; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2203/00; H05K2203/09; H05K2203/095
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
68 words
A method for preparing a plastic electronic circuit board having a circuitry pattern supported thereon, comprising the steps of: treating the board in a plasma environment to neutralize the chemically reactive sites in plastic surface areas, activating the circuit pattern in a catalyzing agent solution, and electrolessly overplating the circuit pattern with a conductive metal, whereby said treating and activating steps limit said overplating to the circuitry pattern.
Claim 2
Independent Claim
68 words
A method for preparing a plastic electronic circuit board having a circuitry pattern supported thereon, comprising the steps of: treating the board in a plasma environment to neutralize the chemically reactive sites in plastic surface areas, activating the circuit pattern in a catalyzing agent solution, and electrolessly overplating the circuit pattern with a conductive metal, whereby said treating and activating steps limit said overplating to the circuitry pattern.
Claim 3
Dependent Claim
18 words
The method of claim 1 wherein: said treating step includes exposing the circuit board to a fluoroalkane plasma.
Claim 4
Dependent Claim
14 words
The method of claim 2 wherein: said fluoroalkane environment comprises a tetrafluoromethane gas plasma.
Claim 5
Dependent Claim
29 words
The method of claim 1 wherein said activating step includes: immersing the circuit board in a solution of 0.02 percent chlorauric acid and 1 percent hydrochloric acid by volume.
Claim 6
Dependent Claim
14 words
The method of claim 1 wherein said overplating step includes: electroless plating with nickel-boron.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-02-03 | 1989-08-05 | 1990-02-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-02-03 | 1993-08-05 | 1994-02-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-02-03 | 1997-08-05 | 1998-02-04 | $7700.00 | Window Closed / Lapsed |