US4554182A — Method for conditioning a surface of a dielectric…

Claim 1

Independent Claim 91 words

Method for conditioning at least one surface of a dielectric substrate for eliminating resist blistering from subsequently applied photoresist and for electrolessly plating of a conductive metal thereon comprising: bringing said at least one surface into contact with a composition containing H 2 SO 4 and a multifunctional cationic polymer containing at least two available cationic moieites and wherein said composition has a pH value of between about 0 and about 3, and then activating the surface by treating it with a colloidal solution containing palladium chloride, stannous chloride and HCl.

Claim 2

Dependent Claim 91 words

Method for conditioning at least one surface of a dielectric substrate for eliminating resist blistering from subsequently applied photoresist and for electrolessly plating of a conductive metal thereon comprising: bringing said at least one surface into contact with a composition containing H 2 SO 4 and a multifunctional cationic polymer containing at least two available cationic moieites and wherein said composition has a pH value of between about 0 and about 3, and then activating the surface by treating it with a colloidal solution containing palladium chloride, stannous chloride and HCl.

Claim 3

Dependent Claim 37 words

Method according to claim 1 wherein a polymer of polyacrylamide forming the inert backbone and functionally active tetra alkyl ammonium compounds in a H 2 SO 4 solution is used for contacting said at least one surface.

Claim 4

Dependent Claim 32 words

Method according to claim 2 wherein an about 0.05 to about 0.5 weight percent solution of the polymer in H 2 SO 4 is used for contacting said at least one surface.

Claim 5

Dependent Claim 30 words

Method according to claim 2 wherein a polymer of polyacrylamide and betamethacryloxyethyltrimethylammonium methyl sulphate in an H 2 SO 4 solution is used for contacting said at least one surface.

Claim 6

Dependent Claim 131 words

Method according to claim 1 wherein the surface brought into contact with the cationic polymer is activated with a colloidal solution prepared from a mixture formed by mixing a solution of SnCl 2 .2H 2 O in 37% HCl and a solution of PdCl 2 in diluted HCl, boiling for two hours and adding a surfactant and containing per liter of solution about 600 grs of SnCl 2 .2H 2 O, about 10 grs of PdCl 2 , about 650 ml of 37% HCl and 0.7 gr of a surfactant, by diluting fixed amounts of said mixture with deionized water, the colloidal solution containing per liter 1.2-2.25 grs of PdCl 2 , 80-150 grs of SnCl 2 .2H 2 O, 85-160 ml of 37% HCl and 0.09-0.16 gr of the surfactant.

Claim 7

Dependent Claim 131 words

Method according to claim 2 wherein the surface brought into contacted with the cationic polymer is activated with a colloidal solution prepared from a mixture formed by mixing a solution of SnCl 2 .2H 2 O in 37% HCl and a solution of PdCl 2 in diluted HCl, boiling for two hours and adding a surfactant and containing per liter of solution about 600 grs of SnCl 2 .2H 2 O, about 10 grs of PdCl 2 , about 650 ml of 37% HCl and 0.7 gr of a surfactant, by diluting fixed amounts of said mixture with deionized water, the colloidal solution containing per liter 1.2-2.25 grs of PdCl 2 , 80-150 grs of SnCl 2 .2H 2 O, 85-160 ml of 37% HCl and 0.09-0.16 gr of the surfactant.

Claim 8

Dependent Claim 131 words

Method according to claim 3 wherein the surface brought into contact with the cationic polymer is activated with a colloidal solution prepared from a mixture formed by mixing a solution of SnCl 2 .2H 2 O in 37% HCl and a solution of PdCl 2 in diluted HCl, boiling for two hours and adding a surfactant and containing per liter of solution about 600 grs of SnCl 2 .2H 2 O, about 10 grs of PdCl 2 , about 650 ml of 37% HCl and 0.7 gr of a surfactant, by diluting fixed amounts of said mixture with deionized water, the colloidal solution containing per liter 1.2-2.25 grs of PdCl 2 , 80-150 grs of SnCl 2 .2H 2 O, 85-160 ml of 37% HCl and 0.09-0.16 gr of the surfactant.

Claim 9

Dependent Claim 131 words

Method according to claim 4 wherein the surface brought into contact with the cationic polymer is activated with a colloidal solution prepared from a mixture formed by mixing a solution of SnCl 2 .2H 2 O in 37% HCl and a solution of PdCl 2 in diluted HCl, boiling for two hours and adding a surfactant and containing per liter of solution about 600 grs of SnCl 2 .2H 2 O, about 10 grs of PdCl 2 , about 650 ml of 37% HCl and 0.7 gr of a surfactant, by diluting fixed amounts of said mixture with deionized water, the colloidal solution containing per liter 1.2-2.6 grs of PdCl 2 , 80-150 grs of SnCl 2 .2H 2 O, 85-160 ml of 37% HCl and 0.09-0.16 gr of the surfactant.

Claim 10

Dependent Claim 88 words

Method for conditioning at least one surface of a dielectric substrate for eliminating resist blistering from subsequently applied photoresist and for electroless plating with copper thereon comprising: bringing into contact said at least one surface with a composition containing H 2 SO 4 and a multifunctional cationic polymer containing at least two available cationic moieties wherein said composition has a pH value of between about 0 and about 3, and then activating the surface by treating it with a colloidal solution containing palladium chloride, stannous chloride and HCl.

Claim 11

Dependent Claim 88 words

Method for conditioning at least one surface of a dielectric substrate for eliminating resist blistering from subsequently applied photoresist and for electroless plating with copper thereon comprising: bringing into contact said at least one surface with a composition containing H 2 SO 4 and a multifunctional cationic polymer containing at least two available cationic moieties wherein said composition has a pH value of between about 0 and about 3, and then activating the surface by treating it with a colloidal solution containing palladium chloride, stannous chloride and HCl.

Claim 12

Dependent Claim 37 words

Method according to claim 9 wherein a polymer of polyacrylamide forming the inert backbone and functionally active tetra alkyl ammonium compounds in a H 2 SO 4 solution is used for contacting said at least one surface.

Claim 13

Dependent Claim 32 words

Method according to claim 10 wherein an about 0.05 to about 0.5 weight percent solution of the polymer in H 2 SO 4 is used for contacting said at least one surface.

Claim 14

Dependent Claim 30 words

Method according to claim 10 wherein a polymer of polyacrylamide and betamethacryloxyethyltrimethylammonium methyl sulphate in an H 2 SO 4 solution is used for contacting said at least one surface.

Claim 15

Dependent Claim 131 words

Method according to claim 9 wherein the surface brought into contact with the cationic polymer is activated with a colloidal solution prepared from a mixture formed by mixing a solution of SnCl 2 .2H 2 O in 37% HCl and a solution of PdCl 2 in diluted HCl, boiling for two hours and adding a surfactant and containing per liter of solution about 600 grs of SnCl 2 .2H 2 O, about 10 grs of PdCl 2 , about 650 ml of 37% HCl and 0.7 gr of a surfactant, by diluting fixed amounts of said mixture with deionized water, the colloidal solution containing per liter 1.2-2.6 grs of PdCl 2 , 80-150 grs of SnCl 2 .2H 2 O, 100-140 ml of 37% HCl and 0.09-0.16 gr of the surfactant.

Claim 16

Dependent Claim 131 words

Method according to claim 10 wherein the surface brought into contact with the cationic polymer is activated with a colloidal solution prepared from a mixture formed by mixing a solution of SnCl 2 .2H 2 O in 37% HCl and a solution of PdCl 2 in diluted HCl, boiling for two hours and adding a surfactant and containing per liter of solution about 600 grs of SnCl 2 .2H 2 O, about 10 grs of PdCl 2 , about 650 ml of 37% HCl and 0.7 gr of a surfactant, by diluting fixed amounts of said mixture with deionized water, the colloidal solution containing per liter 1.2-2.25 grs of PdCl 2 , 80-150 grs of SnCl 2 .2H 2 O, 85-160 ml of 37% HCl and 0.09-0.16 gr of the surfactant.

Claim 17

Dependent Claim 131 words

Method according to claim 11 wherein the surface brought into contact with the cationic polymer is activated with a colloidal solution prepared from a mixture formed by mixing a solution of SnCl 2 .2H 2 O in 37% HCl and a solution of PdCl 2 in diluted HCl, boiling for two hours and adding a surfactant and containing per liter of solution about 600 grs of SnCl 2 .2H 2 O, about 10 grs of PdCl 2 , about 650 ml of 37% HCl and 0.7 gr of a surfactant, by diluting fixed amounts of said mixture with deionized water, the colloidal solution containing per liter 1.2-2.25 grs of PdCl 2 , 80-150 grs of SnCl 2 .2H 2 O, 85-160 ml of 37% HCl and 0.09-0.16 gr of the surfactant.

Claim 18

Dependent Claim 131 words

Method according to claim 12 wherein the surface brought into contact with the cationic polymer is activated with a colloidal solution prepared from a mixture formed by mixing a solution of SnCl 2 .2H 2 O in 37% HCl and a solution of PdCl 2 in diluted HCl, boiling for two hours and adding a surfactant and containing per liter of solution about 600 grs of SnCl 2 .2H 2 O, about 10 grs of PdCl 2 , about 650 ml of 37% HCl and 0.7 gr of a surfactant, by diluting fixed amounts of said mixture with deionized water, the colloidal solution containing per liter 1.2-2.6 grs of PdCl 2 , 80-150 grs of SnCl 2 .2H 2 O, 85-160 ml of 37% HCl and 0.09-0.16 gr of the surfactant.

Claim 19

Dependent Claim 183 words

Method according to claim 9 wherein prior to conditioning said at least one surface, a copper plate is laminated to said at least one surface and subsequently removed by etching and wherein after the activation of said at least one surface said at least one activated surface is rinsed with deionized water, brought into contact with an aqueous solution of HCl, rinsed again and dried at elevated temperatures, a photoresist layer is applied to said at least one dried surface exposed to selective radiation and developed and plating said at least one selectively masked surface by contacting it for a period of from about 15 minutes to about 30 minutes with a first plating bath containing CuSO 4 , a complexing agent, HCHO and a surfactant with the oxygen content being less than 2 ppm and then for a period of from about 10 hours to about 20 hours with a second plating bath differing from the first plating bath by an increased oxygen content of about 3 ppm to about 4 ppm and an NaCN content of 10 ppm to 20 ppm.

Claim 20

Dependent Claim 183 words

Method according to claim 14 wherein prior to conditioning said at least one surface a copper plate is laminated to said at least one surface and subsequently removed by etching and wherein after the activation of said at least one surface said at least one activated surface is rinsed with deionized water, brought into contact with an aqueous solution of HCl, rinsed again and dried at elevated temperatures, a photoresist layer is applied to said at least one dried surface exposed to selective radiation and developed and plating said at least one selectively masked surface by contacting it for a period of from about 15 minutes to about 30 minutes with a first plating bath containing CuSO 4 , a complexing agent, HCHO and a surfactant with the oxygen content being less than 2 ppm and then for a period of from about 10 hours to about 20 hours with a second plating bath differing from the first plating bath by an increased oxygen content of about 3 ppm to about 4 ppm and an NaCN content of 10 ppm to 20 ppm.

Claim 21

Dependent Claim 101 words

Method for conditioning at least one surface of a dielectric substrate of a thermosetting or thermoplastic resin or of a glass for eliminating resist blistering from subsequently applied photoresist and for the electroless plating of conductive metal thereon comprising: bringing into contact said at least one surface with a composition containing H 2 SO 4 and a multifunctional cationic polymer containing at least two available cationic moieties and wherein said composition has a pH value of between about 0 and about 3, and then activating the surface by treating it with a colloidal solution containing palladium chloride, stannous chloride and HCl.

Claim 22

Dependent Claim 101 words

Method for conditioning at least one surface of a dielectric substrate of a thermosetting or thermoplastic resin or of a glass for eliminating resist blistering from subsequently applied photoresist and for the electroless plating of conductive metal thereon comprising: bringing into contact said at least one surface with a composition containing H 2 SO 4 and a multifunctional cationic polymer containing at least two available cationic moieties and wherein said composition has a pH value of between about 0 and about 3, and then activating the surface by treating it with a colloidal solution containing palladium chloride, stannous chloride and HCl.

Claim 23

Dependent Claim 37 words

Method according to claim 19 wherein a polymer of polyacrylamide forming the inert backbone and functionally active tetra alkyl ammonium compounds in a H 2 SO 4 solution is used for contacting said at least one surface.

Claim 24

Dependent Claim 32 words

Method according to claim 20 wherein an about 0.05 to about 0.5 weight percent solution of the polymer in H 2 SO 4 is used for contacting said at least one surface.

Claim 25

Dependent Claim 30 words

Method according to claim 20 wherein a polymer of polyacrylamide and betamethacryloxyethyltrimethylammonium methyl sulphate in an H 2 SO 4 solution is used for contacting said at least one surface.

Claim 26

Dependent Claim 131 words

Method according to claim 19 wherein the surface brought into contact with the cationic polymer is activated with a colloidal solution prepared from a mixture formed by mixing a solution of SnCl 2 .2H 2 O in 37% HCl and a solution of PdCl 2 in diluted HCl, boiling for two hours and adding a surfactant and containing per liter of solution about 600 grs of SnCl 2 .2H 2 O, about 10 grs of PdCl 2 , about 650 ml of 37% HCl and 0.7 gr of a surfactant, by diluting fixed amounts of said mixture with deionized water, the colloidal solution containing per liter 1.2-2.25 grs of PdCl 2 , 80-150 grs of SnCl 2 .2H 2 O, 85-160 ml of 37% HCl and 0.09-0.16 gr of the surfactant.

Claim 27

Dependent Claim 131 words

Method according to claim 20 wherein the surface brought into contact with the cationic polymer is activated with a colloidal solution prepared from a mixture formed by mixing a solution of SnCl 2 .2H 2 O in 37% HCl and a solution of PdCl 2 in diluted HCl, boiling for two hours and adding a surfactant and containing per liter of solution about 600 grs of SnCl 2 .2H 2 O, about 10 grs of PdCl 2 , about 650 ml of 37% HCl and 0.7 gr of a surfactant, by diluting fixed amounts of said mixture with deionized water, the colloidal solution containing per liter 1.2-2.25 grs of PdCl 2 , 80-150 grs of SnCl 2 .2H 2 O, 85-160 ml of 37% HCl and 0.09-0.16 gr of the surfactant.

Claim 28

Dependent Claim 131 words

Method according to claim 21 wherein the surface brought into contact with the cationic polymer is activated with a colloidal solution prepared from a mixture formed by mixing a solution of SnCl 2 .2H 2 O in 37% HCl and a solution of PdCl 2 in diluted HCl, boiling for two hours and adding a surfactant and containing per liter of solution about 600 grs of SnCl 2 .2H 2 O, about 10 grs of PdCl 2 , about 650 ml of 37% HCl and 0.7 gr of a surfactant, by diluting fixed amounts of said mixture with deionized water, the colloidal solution containing per liter 1.2-2.25 grs of PdCl 2 , 80-150 grs of SnCl 2 .2H 2 O, 85-160 ml of 37% HCl and 0.09-0.16 gr of the surfactant.

Claim 29

Dependent Claim 131 words

Method according to claim 22 wherein the surface brought into contact with the cationic polymer is activated with a colloidal solution prepared from a mixture formed by mixing a solution of SnCl 2 .2H 2 O in 37% HCl and a solution of PdCl 2 in diluted HCl, boiling for two hours and adding a surfactant and containing per liter of solution about 600 grs of SnCl 2 .2H 2 O, about 10 grs of PdCl 2 , about 650 ml of 37% HCl and 0.7 gr of a surfactant, by diluting fixed amounts of said mixture with deionized water, the colloidal solution containing per liter 1.2-2.25 grs of PdCl 2 , 80-150 grs of SnCl 2 .2H 2 O, 85-160 ml of 37% HCl and 0.09-0.16 gr of the surfactant.

Claim 30

Dependent Claim 21 words

Method according to claim 19 wherein the at least one surface of a dielectric is conditioned for electroless plating of copper.

Claim 31

Dependent Claim 37 words

Method according to claim 27, wherein a polymer of polyacrylamide forming the inert backbone and functionally active tetra alkyl ammonium compounds in a H 2 SO 4 solution is used for contacting said at least one surface.

Claim 32

Dependent Claim 32 words

Method according to claim 28 wherein an about 0.05 to about 0.5 weight percent solution of the polymer in H 2 SO 4 is used for contacting said at least one surface.

Claim 33

Dependent Claim 30 words

Method according to claim 28 wherein a polymer of polyacrylamide and betamethacryloxyethyltrimethylammonium methyl sulphate in an H 2 SO 4 solution is used for contacting said at least one surface.

Claim 34

Dependent Claim 131 words

Method according to claim 27 wherein the surface brought into contact with the cationic polymer is activated with a colloidal solution prepared from a mixture formed by mixing a solution of SnCl 2 .2H 2 O in 37% HCl and a solution of PdCl 2 in diluted HCl, boiling for two hours and adding a surfactant and containing per liter of solution about 600 grs of SnCl 2 .2H 2 O, about 10 grs of PdCl 2 , about 650 ml of 37% HCl and 0.7 gr of a surfactant, by diluting fixed amounts of said mixture with deionized water, the colloidal solution containing per liter 1.2-2.25 grs of PdCl 2 , 80-150 grs of SnCl 2 .2H 2 O, 85-160 ml of 37% HCl and 0.09-0.16 gr of the surfactant.

Claim 35

Dependent Claim 131 words

Method according to claim 28 wherein the surface brought into contact with the cationic copolymer is activated with a colloidal solution prepared from a mixture formed by mixing a solution of SnCl 2 .2H 2 O in 37% HCl and a solution of PdCl 2 in diluted HCl, boiling for two hours and adding a surfactant and containing per liter of solution about 600 grs of SnCl 2 .2H 2 O, about 10 grs of PdCl 2 , about 650 ml of 37% HCl and 0.7 gr of a surfactant, by diluting fixed amounts of said mixture with deionized water, the colloidal solution containing per liter 1.2-2.25 grs of PdCl 2 , 80-150 grs of SnCl 2 .2H 2 O, 85-160 ml of 37% HCl and 0.09-0.16 gr of the surfactant.

Claim 36

Dependent Claim 131 words

Method according to claim 29 wherein the surface brought into contact with the cationic polymer is activated with a colloidal solution prepared from a mixture formed by mixing a solution of SnCl 2 .2H 2 O in 37% HCl and a solution of PdCl 2 in diluted HCl, boiling for two hours and adding a surfactant and containing per liter of solution about 600 grs of SnCl 2 .2H 2 O, about 10 grs of PdCl 2 , about 650 ml of 37% HCl and 0.7 gr of a surfactant, by diluting fixed amounts of said mixture with deionized water, the colloidal solution containing per liter 1.2-2.25 grs of PdCl 2 , 80-150 grs of SnCl 2 .2H 2 O, 85-160 ml of 37% HCl and 0.09-0.16 gr of the surfactant.

Claim 37

Dependent Claim 131 words

Method according to claim 30 wherein the surface brought into contact with the cationic polymer is activated with a colloidal solution prepared from a mixture formed by mixing a solution of SnCl 2 .2H 2 O in 37% HCl and a solution of PdCl 2 in diluted HCl, boiling for two hours and adding a surfactant and containing per liter of solution about 600 grs of SnCl 2 .2H 2 O, about 10 grs of PdCl 2 , about 650 ml of 37% HCl and 0.7 gr of a surfactant, by diluting fixed amounts of said mixture with deionized water, the colloidal solution containing per liter 1.2-2.5 grs of PdCl 2 , 80-150 grs of SnCl 2 .2H 2 O, 85-160 ml of 37% HCl and 0.09-0.16 gr of the surfactant.

Claim 38

Dependent Claim 48 words

The method of claim 1 wherein an aqueous solution of about 0.01% to about 1% by weight of the copolymer in H 2 SO 4 with the solution have a pH value of between about 0 and about 2 is used for contacting said at least one surface.

Claim 39

Dependent Claim 14 words

The method of claim 1 wherein the pH of said composition is about 1.

Claim 40

Dependent Claim 26 words

The method of claim 35 wherein the H 2 SO 4 is present in said composition in amounts of about 2% to about 4% by weight.

Claim 41

Dependent Claim 26 words

The method of claim 1 wherein the H 2 SO 4 is present in said composition in amounts of about 2% to about 4% by weight.

Claim 42

Dependent Claim 48 words

The method of claim 11 wherein an aqueous solution of about 0.01% to about 1% by weight of the copolymer in H 2 SO 4 with the solution have a pH value of between about 0 and about 2 is used for contacting said at least one surface.

Claim 43

Dependent Claim 14 words

The method of claim 11 wherein the pH of said composition is about 1.

Claim 44

Dependent Claim 26 words

The method of claim 39 wherein the H 2 SO 4 is present in said composition in amounts of about 2% to about 4% by weight.

Claim 45

Dependent Claim 26 words

The method of claim 11 wherein the H 2 SO 4 is present in said composition in amounts of about 2% to about 4% by weight.

Claim 46

Dependent Claim 48 words

The method of claim 19 wherein an aqueous solution of about 0.01% to about 1% by weight of the copolymer in H 2 SO 4 with the solution have a pH value of between about 0 and about 2 is used for contacting said at least one surface.

Claim 47

Dependent Claim 14 words

The method of claim 19 wherein the pH of said composition is about 1.

Claim 48

Dependent Claim 26 words

The method of claim 43 wherein the H 2 SO 4 is present in said composition in amounts of about 2% to about 4% by weight.

Claim 49

Dependent Claim 26 words

The method of claim 19 wherein the H 2 SO 4 is present in said composition in amounts of about 2% to about 4% by weight.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1988-11-18	1989-05-20	1989-11-19	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	1992-11-18	1993-05-20	1993-11-19	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	1996-11-18	1997-05-20	1997-11-19	$7700.00	Window Closed / Lapsed

Method for conditioning a surface of a dielectric substrate for electroless plating

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