Carrier element for IC-modules

Claim 1

An integrated circuit chip carrier element suitable for use in cards providing data to data sensors applied to the card, said carrier element comprising: an integrated circuit semiconductor chip having a plurality of terminals lying on the exterior of said chip and being generally flush with its surface; a thin, flexible carrier film having first and second surfaces, said integrated circuit semiconductor chip being positioned proximate to said second surface of said film so that the periphery of the integrated circuit chip defines a corresponding peripheral outline of said chip in said film, said film having a plurality of openings spaced along said outline of said integrated circuit semiconductor chip on said film, at least a portion of each of said openings lying outside said outline; and a plurality of leads, each having first and second ends and an intermediate portion between said ends, said first ends being affixed to said first surface of said film and comprising contact elements for receiving the data sensors, said contact elements lying on said first surface substantially within the outline of said integrated circuit semiconductor chip on said film, said intermediate portions of said leads extending through said openings, and said second ends of said leads being connected to said integrated circuit semiconductor chip terminals.