Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
200 words
A process for producing a laser emitting two wavelengths, comprising the steps of: providing a semiconductor substrate; producing on said substrate by epitaxy a first double heterostructure comprising a first confinement layer, a first active layer having a first composition, a second confinement layer, a first contact layer and a first upper metal coating; etching said first double heterostructure up to said substrate through a mask having openings in the form of strips, this etching operation leading to strips of said double heterostructure, said strips being separated by etched portions; producing on said substrate in the said etched portions a second double heterostructure with a third confinement layer, a second active layer having a second composition different from the first, a fourth confinement layer, a second contact layer and a second upper metal coating, said layers of said first double heterostructure and said layers of said second double heterostructure having the same height with respect to said substrate; carrying out a first etching of a first groove between a strip of said first heterostructure and said second double heterostructure, said groove being etched up to said first and second active layers; and undergoing a proton bombardment into said first groove.
Claim 2
Dependent Claim
200 words
A process for producing a laser emitting two wavelengths, comprising the steps of: providing a semiconductor substrate; producing on said substrate by epitaxy a first double heterostructure comprising a first confinement layer, a first active layer having a first composition, a second confinement layer, a first contact layer and a first upper metal coating; etching said first double heterostructure up to said substrate through a mask having openings in the form of strips, this etching operation leading to strips of said double heterostructure, said strips being separated by etched portions; producing on said substrate in the said etched portions a second double heterostructure with a third confinement layer, a second active layer having a second composition different from the first, a fourth confinement layer, a second contact layer and a second upper metal coating, said layers of said first double heterostructure and said layers of said second double heterostructure having the same height with respect to said substrate; carrying out a first etching of a first groove between a strip of said first heterostructure and said second double heterostructure, said groove being etched up to said first and second active layers; and undergoing a proton bombardment into said first groove.
Claim 3
Dependent Claim
40 words
A process according to claim 1, wherein the etching operation of said first double heterostructure comprises the step of etching said first upper metal coating and etching the said first double heterostructure through the thus etched first upper metal coating.
Claim 4
Dependent Claim
35 words
A process according to claim 1, wherein said first double heterostructure has a <011> orientation, the etching operation of said first double heterostructure being carried out through a mask having openings parallel to said orientation.
Claim 5
Dependent Claim
48 words
A process according to claim 1, wherein a second etching operation is carried out through said first and second double heterostructure up to said first and third confinement layers, said second etching providing a second groove perpendicular to said first groove and providing a mirror for the lasers.