Monolitic band-pass filter using piezoelectric cantilevers

Claim 1

A device comprising a plurality of cantilever plates arranged in a series format from a first plate down to a last plate; each plate containing a piezoelectric element; conducting elements on each plate sandwiching each piezoelectric element; each of the series of plates except the first plate having the conducting elements adapted to be connected to an output signal of a preceding plate; and said piezoelectric elements and said conducting elements coupling each plate in a series fashion such that the strain caused by a deflection of a preceding plate will be transfered as an electrical signal to the next plate and so on down to the last plate; all plates are all identical to each other and have a resonant frequency; whereby a signal input to the first plate at this resonant frequency will pass through the device substantially unattenuated; and a signal input to the first plate which is not at this resonant frequency will be attenuated in its passage through the device; said piezoelectric element and said conducting elements are formed from thin film continuous layers; said layers being deposited on a silicon substrate; said silicon substrate and said layers being selectively removed to produce the cantilever plates; and a further polysilicon layer sandwiched by thermal oxide layers is placed between the continuous layers and said silicon substrate so as to give greater mechanical integrity to each plate.

Claim 2

A device comprising a plurality of cantilever plates arranged in a series format from a first plate down to a last plate; each plate containing a piezoelectric element; conducting elements on each plate sandwiching each piezoelectric element; each of the series of plates except the first plate having the conducting elements adapted to be connected to an output signal of a preceding plate; and said piezoelectric elements and said conducting elements coupling each plate in a series fashion such that the strain caused by a deflection of a preceding plate will be transfered as an electrical signal to the next plate and so on down to the last plate; all plates are all identical to each other and have a resonant frequency; whereby a signal input to the first plate at this resonant frequency will pass through the device substantially unattenuated; and a signal input to the first plate which is not at this resonant frequency will be attenuated in its passage through the device; said piezoelectric element and said conducting elements are formed from thin film continuous layers; said layers being deposited on a silicon substrate; said silicon substrate and said layers being selectively removed to produce the cantilever plates; and a further polysilicon layer sandwiched by thermal oxide layers is placed between the continuous layers and said silicon substrate so as to give greater mechanical integrity to each plate.

Claim 3

A device comprising a plurality of cantilever plates arranged in a series format from a first plate down to a last plate; each plate containing first and second piezoelectric element; conducting elements on each plate sandwiching each piezoelectric element; each of the series of plates except the first plate having the conducting elements adapted to connect the first piezoelectric element to an output signal from a second piezoelectric of a preceding plate; said first piezoelectric element of each plate causing the plate to flex and cause a strain in the second piezoelectric element; said piezoelectric elements and said conducting elements coupling each plate in a series fashion such that the strain caused by a deflection of a preceding plate will be transferred as an electrical signal to the next plate and so on down to the last plate; all plates are all identical to each other and have a resonant frequency; whereby a signal input to the first plate at this resonant frequency will pass through the device substantially unattenuated; a signal input to the first plate which is not at this resonant frequency will be attenuated in its passage through the device; said piezoelectric element and said conducting elements are formed from thin film continuous layers; said layers being deposited on a silicon substrate; said silicon substrate and said layers being selectively removed to produce the cantilever plates; and a further polysilicon layer sandwiched by thermal oxide layers is placed between the continuous layers and said silicon substrate so as to give greater mechanical integrity to each plate.

Claim 4

A device comprising a plurality of cantilever plates arranged in a series format from a first plate down to a last plate; each plate containing first and second piezoelectric element; conducting elements on each plate sandwiching each piezoelectric element; each of the series of plates except the first plate having the conducting elements adapted to connect the first piezoelectric element to an output signal from a second piezoelectric of a preceding plate; said first piezoelectric element of each plate causing the plate to flex and cause a strain in the second piezoelectric element; said piezoelectric elements and said conducting elements coupling each plate in a series fashion such that the strain caused by a deflection of a preceding plate will be transferred as an electrical signal to the next plate and so on down to the last plate; all plates are all identical to each other and have a resonant frequency; whereby a signal input to the first plate at this resonant frequency will pass through the device substantially unattenuated; a signal input to the first plate which is not at this resonant frequency will be attenuated in its passage through the device; said piezoelectric element and said conducting elements are formed from thin film continuous layers; said layers being deposited on a silicon substrate; said silicon substrate and said layers being selectively removed to produce the cantilever plates; and a further polysilicon layer sandwiched by thermal oxide layers is placed between the continuous layers and said silicon substrate so as to give greater mechanical integrity to each plate.