US4460916A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ceramic substrate with integrated circuit bonded thereon
Assignee: Fujitsu Ltd
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Filing: 1982-10-21
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Granted: 1984-07-17
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Expires: 2002-10-21
Abstract
Abstract A ceramic substrate, suitable for use as a circuit substrate on which integrated circuit chips are bonded, which consists essentially of, based on the weight of the substrate, 0.5˜5.0% by weight of MgO, and 95.0˜99.5% by weight of the total of Al 2 O 3 and SiO 2 , the proportion of the Al 2 O 3 to the SiO 2 being in the range from 50:50 to 80:20 by weight.
Inventors
- 👤 Kaoru Hashimoto
- 👤 Koichi Niwa
- 👤 Kyohei Murakawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 19:37
CPC Classifications
H; H01; H01B; H01B3/00; H01B3/02; H01B3/12; C; C04; C04B; C04B35/00; C04B35/01; C04B35/16; C04B35/18; C04B35/195; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0306
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
141 words
An electronic device comprising as main components an integrated circuit silicon chip bonded on a ceramic substrate, which consists essentially of, based on the weight of the substrate, 0.5˜5.0% by weight of MgO and 95.0˜99.5% by weight of the total of Al 2 O 3 and SiO 2 , the proportion of the Al 2 O 3 to the SiO 2 being in the range from 50:50 to 80:20 by weight said ceramic substrate exhibiting a structure in which the grain boundaries between the mullite crystals (3Al 2 O 3 .2SiO 2 ) are filled with cordierite (2MgO.2Al 2 O 3 .5SiO 2 ), said substrate having a thermal expansion coefficient of 3.8˜3.9×10 -6 /°C. from room temperature to 500° C., which coefficient is close to that of the silicon chip, viz. 2.5˜3.5×10 -6 /°C. from room temperature to 500° C.
Claim 2
Dependent Claim
141 words
An electronic device comprising as main components an integrated circuit silicon chip bonded on a ceramic substrate, which consists essentially of, based on the weight of the substrate, 0.5˜5.0% by weight of MgO and 95.0˜99.5% by weight of the total of Al 2 O 3 and SiO 2 , the proportion of the Al 2 O 3 to the SiO 2 being in the range from 50:50 to 80:20 by weight said ceramic substrate exhibiting a structure in which the grain boundaries between the mullite crystals (3Al 2 O 3 .2SiO 2 ) are filled with cordierite (2MgO.2Al 2 O 3 .5SiO 2 ), said substrate having a thermal expansion coefficient of 3.8˜3.9×10 -6 /°C. from room temperature to 500° C., which coefficient is close to that of the silicon chip, viz. 2.5˜3.5×10 -6 /°C. from room temperature to 500° C.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-07-17 | 1988-01-16 | 1988-07-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-07-17 | 1992-01-16 | 1992-07-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-07-17 | 1996-01-16 | 1996-07-17 | $7700.00 | Window Closed / Lapsed |