Carrier for a leadless integrated circuit chip

Claim 2

A mobile carrier for a leadless integrated circuit chip, said chip having an upper surface with a plurality of spaced electrical contact pads, said carrier comprising: a body having an upper and lower surface, a plurality of side walls, a cavity extending inwardly from the upper surface, said cavity being laterally bounded by the body and large enough to accomodate a chip with its contact pads substantially fully exposed from the top, and a floor at the lower end of the cavity for supporting a chip, one of said side walls having an access opening extending inwardly to the cavity to permit the introduction of a chip into the cavity through the access opening with the bottom of the chip supported by the cavity floor and its upper surface substantially exposed, a plurality of projections formed integrally with the carrier body and extending into the upper portion of the cavity to block the upward removal of a chip located within the cavity and the downward placement of a chip into the cavity from above the carrier, said projections being vertically aligned with spaces on the chip between the contact pads, and thereby enabling the contact pads to be probed from above, and a spring means supported on said body and normally extending into said cavity in blocking relationship to the access openings to at least partially block the introduction of a chip into the cavity, said spring means being movable to a position permitting the introduction or removal of a chip through the access opening, and when released bearing against a chip in the cavity under a spring bias to hold the chip in a fixed position within the cavity.

Claim 3

The leadless chip carrier of claim 1, said spring means comprising a stiffly flexible arm having a chip engaging head, said arm being carried on said body with its head normally extending through an opening in a lateral wall of the cavity to a position bearing against and retaining a chip therein, said body including a recess to accommodate flexing of the arm away from its normal position so as to enable a chip to be introduced into the cavity.

Claim 4

The leadless chip carrier of claim 2, said body being formed from a stiffly flexible material, and said arm being formed integrally with and cantilevered from the body.

Claim 5

The leadless chip carrier of claim 1, designed for a generally rectangular chip, wherein the cavity is similarly generally rectangular and of slightly larger dimensions than the chip, said projections extending from a plurality of the corners of the cavity.

Claim 6

The leadless chip carrier of claims 1 or 2, said body being formed with an industry standard outer geometry to facilitate automatic handling of the carrier in testing and processing operations.

Claim 7

The leadless chip carrier of claims 1 or 2, said chip supporting floor having an opening therein to facilitate environmental temperature equalization between the upper and lower surfaces of a chip held in the carrier.

Claim 8

A mobile carrier for a leadless integrated circuit chip, said chip having an upper surface with a plurality of spaced electrical contact pads, said carrier comprising: a body having upper and lower surfaces, a plurality of side walls, a cavity extending inwardly from the upper surface, said cavity being laterally bounded by the body and large enough to accomodate a chip with its contact pads substantially fully exposed from the top, and a floor at the lower end of the cavity for supporting a chip, one of said side walls having an access opening extending inwardly to the cavity to permit the introduction of a chip into the cavity through the access opening with the bottom of the chip supported by the cavity floor and its upper surface exposed, a recess formed in a portion of the body lateral to the access opening, said recess opening into the cavity adjacent the access opening, a cantilevered arm formed from a stiffly flexible material extending from the body through the recess and into the cavity in the vicinity of the access opening, said arm being angularly oriented so as to assume a flexed position bearing against a chip placed in the cavity and retaining the chip under flexed spring tension within the cavity, said recess providing space for flexing the arm outward from the cavity to permit the introduction or removal of a chip, and blocking means carried on the body and projecting into the upper portion of the cavity for blocking the upward movement of a chip placed in the cavity and the downward placement of a chip into the cavity from above the carrier, said blocking means being vertically positioned substantially only over portions of the chip not occupied by a contact pad.

Claim 9

A mobile carrier for a leadless integrated circuit chip, said chip having an upper surface with a plurality of spaced electrical contact pads, said carrier comprising: a body having upper and lower surfaces, a plurality of side walls, a cavity extending inwardly from the upper surface, said cavity being laterally bounded by the body and large enough to accomodate a chip with its contact pads substantially fully exposed from the top, and a floor at the lower end of the cavity for supporting a chip, one of said side walls having an access opening extending inwardly to the cavity to permit the introduction of a chip into the cavity through the access opening with the bottom of the chip supported by the cavity floor and its upper surface exposed, a recess formed in a portion of the body lateral to the access opening, said recess opening into the cavity adjacent the access opening, a cantilevered arm formed from a stiffly flexible material extending from the body through the recess and into the cavity in the vicinity of the access opening, said arm being angularly oriented so as to assume a flexed position bearing against a chip placed in the cavity and retaining the chip under flexed spring tension within the cavity, said recess providing space for flexing the arm outward from the cavity to permit the introduction or removal of a chip, and blocking means carried on the body and projecting into the upper portion of the cavity for blocking the upward movement of a chip placed in the cavity and the downward placement of a chip into the cavity from above the carrier, said blocking means being vertically positioned substantially only over portions of the chip not occupied by a contact pad.

Claim 10

The leadless chip carrier of claim 7, said recess being separated from the cavity by a divider wall, said divider wall extending toward the body wall with the chip opening but terminating short of said wall to leave a gap therebetween, said arm extending through the recess and having a head which protrudes through the gap to bear against a chip in the cavity.

Claim 11

The leadless chip carrier of claim 8, said arm comprising a generally L-shaped member with its base protruding through the gap.

Claim 12

The leadless chip carrier of claim 8, adapted for a generally rectangular chip with electrical contact pads spaced from its corners, said cavity similarly being generally rectangular and slightly larger in dimension than said chip, the head of said stiffly flexible arm protruding through said gap in the dividing wall to bear against a corner of the chip, and said blocking means comprising three tabs extending from the body into the cavity slightly over the other three chip corners, respectively.

Claim 13

The leadless chip carrier of claim 7, adapted for a generally rectangular chip with electrical contact pads spaced from its corners, said cavity similarly being generally rectangular and slightly larger than said chip, and said blocking means comprising a plurality of tabs extending from the body into the cavity from a plurality of the cavity corners.

Claim 14

The leadless chip carrier of claims 7 or 8, said body being formed from a stiffly flexible material and said spring arm being formed integrally therewith.