US4411057A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing a laser source with stamped support
Assignee: Thales SA
•
Filing: 1981-10-20
•
Granted: 1983-10-25
•
Expires: 2001-10-20
Abstract
Abstract The invention relates to laser sources using a semiconductor chip from which the radiation is collected by an optical fiber. In accordance with the invention there is provided a laser source in which the support for the semiconductor chip and the optical fiber is metallic. The support is stamped with an impression comprising a seat for the semiconductor chip and at least one groove for accommodating the optical fiber. The invention is applicable to radiation sources used in optical telecommunication systems.
Inventors
- 👤 Eugene Duda
- 👤 Claude Tondu
- 👤 Alain Maumy
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 11:20
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4202; G02B6/4204; G02B6/4219; G02B6/422; G02B6/4226; Y; Y10; Y10S; Y10S29/00; Y10S29/037
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
145 words
A method of manufacturing a semiconductor laser source including a laser chip and at least one optical fiber for collecting the radiation supplied from said laser chip on a support made of a cold-malleable metal of high thermal conductivity, said method comprising the steps of: stamping, in a single operation, said support to permanently deform said support to have on a surface of said support, a flattened area and at least one Vee-shaped groove, acting as a recess for said optical fiber; disposing said chip on said flattened area; and disposing said at least one optical fiber in said at least one Vee-shaped groove, said stamping step forming said flattened area at such a depth below said surface and said Vee-shaped groove at such a width and depth below said surface that light emitted from said chip is directed to said at least one fiber.
Claim 2
Independent Claim
145 words
A method of manufacturing a semiconductor laser source including a laser chip and at least one optical fiber for collecting the radiation supplied from said laser chip on a support made of a cold-malleable metal of high thermal conductivity, said method comprising the steps of: stamping, in a single operation, said support to permanently deform said support to have on a surface of said support, a flattened area and at least one Vee-shaped groove, acting as a recess for said optical fiber; disposing said chip on said flattened area; and disposing said at least one optical fiber in said at least one Vee-shaped groove, said stamping step forming said flattened area at such a depth below said surface and said Vee-shaped groove at such a width and depth below said surface that light emitted from said chip is directed to said at least one fiber.
Claim 3
Independent Claim
193 words
A method of manufacturing a semiconductor laser source including a laser chip and at least two optical fibers for collecting the radiation supplied from said laser chip on a support made of a cold-malleable metal of high thermal conductivity, said method comprising the steps of: stamping, in a single operation, said support to permanently deform said support to have on a surface of said support, a flattened area and at least first and second Vee-shaped grooves, said first Vee-shaped groove being disposed between said flattened area and said second Vee-shaped groove; said first Vee-shaped groove being disposed between said flattened area and said second Vee-shaped groove; disposing said chip on said flattened area; disposing one of said at least two optical fibers in said first Vee-shaped groove; and disposing another of said at least two optical fibers in said second Vee-shaped groove, said stamping step forming said flattened area at such a depth below said surface and said Vee-shaped grooves at such a width and depth below said surface that light emitted from said chip is directed to first said one fiber acting as a cylindrical lens and then to said another fiber.
Claim 4
Independent Claim
193 words
A method of manufacturing a semiconductor laser source including a laser chip and at least two optical fibers for collecting the radiation supplied from said laser chip on a support made of a cold-malleable metal of high thermal conductivity, said method comprising the steps of: stamping, in a single operation, said support to permanently deform said support to have on a surface of said support, a flattened area and at least first and second Vee-shaped grooves, said first Vee-shaped groove being disposed between said flattened area and said second Vee-shaped groove; said first Vee-shaped groove being disposed between said flattened area and said second Vee-shaped groove; disposing said chip on said flattened area; disposing one of said at least two optical fibers in said first Vee-shaped groove; and disposing another of said at least two optical fibers in said second Vee-shaped groove, said stamping step forming said flattened area at such a depth below said surface and said Vee-shaped grooves at such a width and depth below said surface that light emitted from said chip is directed to first said one fiber acting as a cylindrical lens and then to said another fiber.
References Cited (Backward Citations)
US436187A
Cited
US3840889A
Cited
US4027521A
Cited
JPS523391A
Cited
US4156206A
Cited
US4186994A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-10-24 | 1987-04-25 | 1987-10-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-10-24 | 1991-04-25 | 1991-10-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-10-24 | 1995-04-25 | 1995-10-25 | $7700.00 | Window Closed / Lapsed |