US4394419A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Printed circuit material
Assignee: OAK MATERIALS GROUP Inc A CORP OF DELAWARE
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Filing: 1981-06-12
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Granted: 1983-07-19
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Expires: 2001-06-12
Abstract
Abstract A product useful in the manufacture of printed circuits includes a carrier layer of copper having a thickness on the order of about 10-15 microns. A thin layer of copper having a thickness in the range of 1-12 microns, and which will provide the conductive path for the printed circuit, is secured to the copper carrier by an intermediate metallic layer positioned therebetween and secured to both layers of copper. The intermediate layer has a thickness in the range of 0.1-2.0 microns and is selected from the group consisting of nickel, a nickel-tin alloy, a nickel-iron alloy, lead and a tin-lead alloy. The intermediate layer adheres sufficiently to the thin layer of copper to prevent removal thereof during the etching process which removes the carrier layer of copper. The described thin metallic foil is bonded upon opposite sides of a suitable dielectric which may be a reinforced or non-reinforced epoxy or any one of a number of other suitable materials for forming the core of a printed circuit board. The core in fact may be formed of one or more printed circuits previously formed to provide what is known in the trade as a multilayer printed circuit board. The process for manufacture of a printed circuit board includes the steps of removing at least the copper carrier and in many applications the intermediate metallic layer protecting the thin layer of copper attached to the dielectric and formation of a circuit using the thin copper layer.
Inventors
- 👤 Jiri K. Konicek
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 17:19
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K3/00; H05K3/02; H05K3/022; H05K3/025; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0152; H05K2203/03; H05K2203/0376; H05K2203/07; H05K2203/0703; H05K2203/0726; H05K3/06; H05K3/061; H05K3/062; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3473; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12431; Y10T428/12438; Y10T428/12493; Y10T428/12535; Y10T428/12556; Y10T428/12569; Y10T428/12687; Y10T428/12694; Y10T428/12701; Y10T428/12708; Y10T428/12715; Y10T428/12771; Y10T428/12861; Y10T428/12903; Y10T428/1291; Y10T428/12944; Y10T428/12951; Y10T428/31504; Y10T428/31511; Y10T428/31515; Y10T428/31522; Y10T428/31529
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
128 words
A product useful in the manufacture of printed circuits including, (a) a carrier layer of copper fully removable by etching and having a thickness on the order of about 10-35 microns, (b) a thin layer of copper having a thickness in the range of 1-12 microns to be used in the formation of electrical circuit paths, and (c) an intermediate metallic layer positioned between the (a) and (b) layers and secured thereto, said intermediate layer having a thickness in the range of 0.1-2.0 microns and being selected from the group consisting of nickel, a nickel-tin alloy, a nickel-iron alloy, lead, and a tin-lead alloy, said intermediate layer adhering sufficiently to the (b) layer of copper to prevent removal thereof by an etchant removing the (a) layer of copper.
Claim 2
Dependent Claim
128 words
A product useful in the manufacture of printed circuits including, (a) a carrier layer of copper fully removable by etching and having a thickness on the order of about 10-35 microns, (b) a thin layer of copper having a thickness in the range of 1-12 microns to be used in the formation of electrical circuit paths, and (c) an intermediate metallic layer positioned between the (a) and (b) layers and secured thereto, said intermediate layer having a thickness in the range of 0.1-2.0 microns and being selected from the group consisting of nickel, a nickel-tin alloy, a nickel-iron alloy, lead, and a tin-lead alloy, said intermediate layer adhering sufficiently to the (b) layer of copper to prevent removal thereof by an etchant removing the (a) layer of copper.
Claim 3
Dependent Claim
14 words
The product of claim 1 further characterized in that said intermediate layer is nickel.
Claim 4
Dependent Claim
23 words
The product of claim 1 further characterized in that said thin layer of copper has a thickness in the range of 5-9 mircons.
Claim 5
Dependent Claim
24 words
The product of claim 1 further characterized by an adhesion promoting and passivating treatment layer on the outer surface of the thin copper layer.
Claim 6
Dependent Claim
165 words
A product useful in the manufacture of printed circuits comprising a dielectric material core and a metallic foil adhered to opposite sides thereof, said metallic foil including, (a) a carrier layer of copper fully removable by etching and having a thickness on the order of about 10-35 microns, (b) a thin layer of copper having a thickness in the range of 1-12 microns to be used in the formation of electrical circuit paths, with an adhesion promoting and passivating layer on the outer surface which surface is attached to the dielectric material core, and (c) an intermediate metallic layer positioned between the (a) and (b) layers and secured thereto, said intermediate layer having a thickness in the range of 0.1-2.0 microns and being selected from the group consisting of nickel, a nickel-tin alloy, a nickel-iron alloy, lead, and a tin-lead alloy, said intermediate layer adhering sufficiently to the (b) layer of copper to prevent removal thereof by an etchant removing the (a) layer of copper.
Claim 7
Dependent Claim
165 words
A product useful in the manufacture of printed circuits comprising a dielectric material core and a metallic foil adhered to opposite sides thereof, said metallic foil including, (a) a carrier layer of copper fully removable by etching and having a thickness on the order of about 10-35 microns, (b) a thin layer of copper having a thickness in the range of 1-12 microns to be used in the formation of electrical circuit paths, with an adhesion promoting and passivating layer on the outer surface which surface is attached to the dielectric material core, and (c) an intermediate metallic layer positioned between the (a) and (b) layers and secured thereto, said intermediate layer having a thickness in the range of 0.1-2.0 microns and being selected from the group consisting of nickel, a nickel-tin alloy, a nickel-iron alloy, lead, and a tin-lead alloy, said intermediate layer adhering sufficiently to the (b) layer of copper to prevent removal thereof by an etchant removing the (a) layer of copper.
Claim 8
Dependent Claim
17 words
The product of claim 5 further characterized in that said core consists of a reinforced epoxy laminate.
Claim 9
Dependent Claim
14 words
The product of claim 5 further characterized in that said core includes a polyimide.
Claim 10
Dependent Claim
14 words
The product of claim 5 further characterized in that said core includes a polyester.
Claim 11
Dependent Claim
14 words
The product of claim 5 further characterized in that said core includes a polytetrafluoroethylene.
Claim 12
Dependent Claim
17 words
The product of claim 5 further characterized in that said core is formed of a non-reinforced dielectric.
References Cited (Backward Citations)
US3990926A
Cited
USRE29820E
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-07-18 | 1987-01-17 | 1987-07-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-07-18 | 1991-01-17 | 1991-07-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-07-18 | 1995-01-17 | 1995-07-19 | $7700.00 | Window Closed / Lapsed |