US4377436A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Plasma-assisted etch process with endpoint detection
Assignee: AT&T Inc
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Filing: 1981-11-05
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Granted: 1983-03-22
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Expires: 2001-11-05
Abstract
Abstract Endpoint detection during plasma-assisted etching is signalled by cessation or onset of spatially confined luminescence resulting from an etch reaction product. Sensitivity of the system is aided by an optically focused detector which selectively detects such fluorescence as associated with one or a small number of lithographic features.
Inventors
- 👤 Vincent M. Donnelly
- 👤 Daniel L. Flamm
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 18:53
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/32; H01J37/32917; H01J37/32935; G; G01; G01N; G01N21/00; G01N21/75; G01N21/76
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
225 words
Process for fabrication of an article comprising at least one operation during which the article undergoing fabrication comprises a layer of first material to be etched in at least one preselected region, the layer of first material being overlying a second material to be retained, the first material being etched primarily by a chemical reaction with at least one reactive species produced by a plasma within a plasma reactor, the plasma resulting from imposition of an electrical field across a vapor medium between electrodes, the etching being monitored by means including detection of electromagnetic radiation emitted by an excited species formed as a consequence of a chemical interaction between a species and article material in the preselected region, the means comprising optical path means for illuminating a detector with such radiation, and detector output means, characterized in that (a) the optical path means sense substantially only radiation emitted from within a restricted first volume of space adjacent the preselected region, with a contrast of at least 50%, the volume having lateral dimensions less than about 10 mm, and (b) the processing conditions are chosen to result in confinement of the excited species formed as a consequence of the chemical interaction to a second volume of space close to the preselected region, with at least a part of the first volume being within the second volume.
Claim 2
Dependent Claim
225 words
Process for fabrication of an article comprising at least one operation during which the article undergoing fabrication comprises a layer of first material to be etched in at least one preselected region, the layer of first material being overlying a second material to be retained, the first material being etched primarily by a chemical reaction with at least one reactive species produced by a plasma within a plasma reactor, the plasma resulting from imposition of an electrical field across a vapor medium between electrodes, the etching being monitored by means including detection of electromagnetic radiation emitted by an excited species formed as a consequence of a chemical interaction between a species and article material in the preselected region, the means comprising optical path means for illuminating a detector with such radiation, and detector output means, characterized in that (a) the optical path means sense substantially only radiation emitted from within a restricted first volume of space adjacent the preselected region, with a contrast of at least 50%, the volume having lateral dimensions less than about 10 mm, and (b) the processing conditions are chosen to result in confinement of the excited species formed as a consequence of the chemical interaction to a second volume of space close to the preselected region, with at least a part of the first volume being within the second volume.
Claim 3
Dependent Claim
22 words
Process of claim 1 in which the layer of first material is partially masked, with the bared regions comprising the preselected region.
Claim 4
Dependent Claim
13 words
Process of claim 1 in which the optical path means includes focusing means.
Claim 5
Dependent Claim
22 words
Process of claim 3 in which the focusing means has a point of focus about 1 mm of the first material surface.
Claim 6
Dependent Claim
26 words
Process of claim 4 in which the field of view at the first material surface has a maximum lateral dimension of less than about 1 mm.
Claim 7
Dependent Claim
16 words
Process of claim 5 in which the maximum lateral dimension is less than about 10 μm.
Claim 8
Dependent Claim
18 words
Process of claim 1 in which the optical path means includes filter means for preferentially transmitting the radiation.
Claim 9
Dependent Claim
16 words
Process of claim 1 in which said first material or said second material comprises elemental silicon.
Claim 10
Dependent Claim
29 words
Process of claim 8 in which the optical path means includes a bandpass filter for selectively transmitting radiation within a continuum peaking at a wavelength of approximately 632 nm.
Claim 11
Dependent Claim
16 words
Process of claim 8 in which the article undergoing fabrication is etched within the plasma reactor.
Claim 12
Dependent Claim
17 words
Process of claim 8 in which the article undergoing fabrication is etched downstream of the plasma reactor.
Claim 13
Dependent Claim
12 words
Process of claim 8 in which the first material comprises elemental silicon.
Claim 14
Dependent Claim
22 words
Process of claim 12 in which the detection means serves to signal etching endpoint due to reduction in amplitude of the radiation.
Claim 15
Dependent Claim
12 words
Process of claim 8 in which said second material comprises elemental silicon.
Claim 16
Dependent Claim
22 words
Process of claim 14 in which the detection means serves to signal etching endpoint due to increase in amplitude of said radiation.
Claim 17
Dependent Claim
41 words
Process of claim 1 in which the restricted volume substantially corresponds with the preselected region, the region including a small number of features including a feature of a minimum dimension which is the minimum dimension for all features to be etched.
Claim 18
Dependent Claim
14 words
Process of claim 16 in which the preselected region includes only a single feature.
Claim 19
Dependent Claim
27 words
Process of claim 1 in which the radiation is luminescence, with the emitting particle species being a product of the etching reaction which is excited during formation.
Claim 20
Dependent Claim
30 words
Process of claim 1 in which the radiation is luminescence, with the emitting particle species being excited by an event subsequent to formation of reaction product of the etching reaction.
Claim 21
Dependent Claim
25 words
Process of claim 1, in which the chosen processing conditions comprise a pressure within the plasma reactor between about 0.01 Torr and about 20 Torr.
Claim 22
Dependent Claim
40 words
Process of claim 20, in which the chosen processing conditions further comprise detection of the radiation from a transition having a relatively short lifetime such that the second volume of space extends at most several millimeters from the preselected region.
Claim 23
Dependent Claim
37 words
Process of claim 1, in which the restricted first volume substantially corresponds with the preselected region, the region comprising at least one feature which etches at a rate slower than the average etch rate of first material.
Claim 24
Dependent Claim
22 words
Process of claim 22 in which the lower etch rate is an artifact of the etch process as practiced within the apparatus.
Claim 25
Dependent Claim
19 words
Process of claim 22 in which the lower etch rate is at least partially due to small feature size.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-03-21 | 1986-09-20 | 1987-03-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-03-21 | 1990-09-20 | 1991-03-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-03-21 | 1994-09-20 | 1995-03-22 | $7700.00 | Window Closed / Lapsed |