Low temperature process for depositing oxide layers by photochemical vapor deposition

Claim 2

A process for depositing a layer of an oxide of a chosen material on the surface of a selected substrate by chemical vapor deposition comprising the steps of: (a) providing said substrate; and (b) exposing said substrate to a selected vapor phase reactant in the presence of photochemically generated neutral oxygen atoms, whereby said oxygen atoms react with said vapor phase reactant to form said oxide which deposits as said layer on said substrate and said neutral oxygen atoms are formed in a manner which avoids damage to said substrate due to charge bombardment or radiation bombardment of said substrate.

Claim 3

The process set forth in claim 1 wherein: (a) said vapor phase reactant is silane (SiH 4 ); and (b) said oxide is silicon dioxide, silicon monoxide, or a mixture thereof.

Claim 4

The process set forth in claim 1 wherein said vapor phase reactant contains an element selected from the group consisting of silicon, germanium, gallium, boron, indium, aluminum, titanium, tungsten, and hafnium.

Claim 5

The process set forth in claim 1 wherein said exposing further includes being performed in the presence of photochemically generated neutral dopant atoms or particles and said oxide incorporates said dopant atoms.

Claim 6

The process set forth in claim 1 wherein said exposing further includes being performed in the presence of a precursor containing selected dopant atoms and said oxide incorporates said dopant atoms.

Claim 7

A process for depositing a layer of an oxide of a chosen material on the surface of a selected substrate by chemical vapor deposition comprising the steps of: (a) providing said substrate; and (b) exposing said substrate to a selected vapor phase reactant in the presence of photochemically generated neutral oxygen atoms, said neutral oxygen atoms being formed by the mercury photosensitized dissociation of a chosen chemically unreactive oxygen-containing precursor, whereby said neutral oxygen atoms react with said vapor phase reactant to form said oxide which deposits as said layer on said substrate and said neutral oxygen atoms are formed in a manner which avoids damage to said substrate due to charge bombardment or radiation bombardment of said substrate.

Claim 8

A process for depositing a layer of an oxide of a chosen material on the surface of a selected substrate by chemical vapor deposition comprising the steps of: (a) providing said substrate; and (b) exposing said substrate to a selected vapor phase reactant in the presence of photochemically generated neutral oxygen atoms, said neutral oxygen atoms being formed by the mercury photosensitized dissociation of a chosen chemically unreactive oxygen-containing precursor, whereby said neutral oxygen atoms react with said vapor phase reactant to form said oxide which deposits as said layer on said substrate and said neutral oxygen atoms are formed in a manner which avoids damage to said substrate due to charge bombardment or radiation bombardment of said substrate.

Claim 9

The process set forth in claim 6 wherein said chemically unreactive oxygen-containing precursor is selected from the group consisting of: nitrous oxide; nitrogen dioxide; and molecular oxygen under selected pressure and flow rate conditions.

Claim 10

The process set forth in claim 6 wherein: (a) said chemically unreactive oxygen-containing precursor is nitrous oxide (N 2 O); (b) said vapor phase reactant is silane (SiH 4 ); (c) said exposing is performed in a static photochemical reactor system; (d) the reactant gas pressures of said SiH 4 and said N 2 O are 3 millimeters and 12 millimeters of mercury, respectively and said oxide is silicon monoxide (SiO); and (e) the temperature of said process is maintained at a selected temperature within the range of 30° C. to 200° C.

Claim 11

The process set forth in claim 6 wherein: (a) said chemically unreactive oxygen-containing precursor is nitrous oxide (N 2 O); (b) said vapor phase reactant is silane (SiH 4 ); (c) said exposing is performed in a static photochemical reactor system; (d) the reactant gas pressures of said SiH 4 and said N 2 O are 3.0 millimeters and 30 millimeters of mercury, respectively and said oxide is silicon dioxide (SiO 2 ); and (e) the temperature of said process is maintained at a selected temperature within the range of 30° C. to 200° C.

Claim 12

The process set forth in claim 6 wherein: (a) said chemically unreactive oxygen-containing precursor is nitrous oxide (N 2 O); (b) said vapor phase reactant is silane (SiH 4 ); (c) said exposing is performed in a continuous flow photochemical reactor system; (d) the reactant gas flow rates of said SiH 4 and said N 2 O are 2 standard cubic centimeters per minute (sccm) and 10 sccm, respectively and said oxide is silicon monoxide (SiO); and (e) the temperature of said process is maintained at a selected temperature within the range of 30° C. to 200° C.

Claim 13

The process set forth in claim 6 wherein: (a) said chemically unreactive oxygen-containing precursor is nitrous oxide (N 2 O); (b) said vapor phase reactant is silane (SiH 4 ); (c) said exposing is performed in a continuous flow photochemical reactor system; (d) the reactant gas flow rates of said SiH 4 and said N 2 O are 2 standard cubic centimeters per minute (sccm) and 50 sccm, respectively and said oxide is silicon dioxide (SiO 2 ); and (e) the temperature of said process is maintained at a selected temperature within the range of 30° C. to 200° C.

Claim 14

A process for depositing a layer of an oxide of a chosen material on the surface of a selected substrate by chemical vapor deposition comprising the steps of: (a) providing said substrate; and (b) exposing said substrate to a selected vapor phase reactant in the presence of photochemically generated neutral oxygen atoms, said neutral oxygen atoms being formed by exposing a chosen oxygen-containing precursor to radiation of a selected wavelength which causes the direct dissociation of said precursor to form said neutral oxygen atoms, whereby said neutral oxygen atoms react with said vapor phase reactant to form said oxide which deposits as said layer on said substrate, and said neutral oxygen atoms are formed in a manner which avoids damage to said substrate due to charge bombardment or radiation bombardment of said substrate.

Claim 15

A process for depositing a layer of an oxide of a chosen material on the surface of a selected substrate by chemical vapor deposition comprising the steps of: (a) providing said substrate; and (b) exposing said substrate to a selected vapor phase reactant in the presence of photochemically generated neutral oxygen atoms, said neutral oxygen atoms being formed by exposing a chosen oxygen-containing precursor to radiation of a selected wavelength which causes the direct dissociation of said precursor to form said neutral oxygen atoms, whereby said neutral oxygen atoms react with said vapor phase reactant to form said oxide which deposits as said layer on said substrate, and said neutral oxygen atoms are formed in a manner which avoids damage to said substrate due to charge bombardment or radiation bombardment of said substrate.

Claim 16

The process set forth in claim 12 wherein said oxygen-containing precursor is selected from the group consisting of nitrous oxide (N 2 O); nitrogen dioxide (NO 2 ); and molecular oxygen (O 2 ) under selected pressure and flow rate conditions.

Claim 17

The process set forth in claim 12 wherein: (a) said oxygen-containing precursor is nitrous oxide (N 2 O); and (b) said selected wavelength is within the range of 1750-1950 A.

Claim 18

The process set forth in claim 14 wherein: (a) said vapor phase reactant is silane (SiH 4 ); (b) the reactant gas flow rates of said SiH 4 and said N 2 O are 2 standard cubic centimeters per minute (sccm) and 60 sccm, respectively; (c) said oxide is silicon dioxide (SiO 2 ); and (d) the temperature of said process is maintained at a selected temperature within the range of 30° C. to 200° C.

Claim 19

The process set forth in claim 12 wherein: (a) said oxygen-containing precursor is molecular oxygen (O 2 ), and said molecular oxygen has nitrogen (N 2 ) mixed therewith; (b) said selected wavelength of said radiation is 1849 A (c) said vapor phase reactant is silane (SiH 4 ); (d) said exposing is performed at a pressure within the range of 0-5 Torr; and (e) the reactant gas flow rates of said SiH 4 , said O 2 , and said N 2 are 1, 20, and 80 standard cubic centimeters per minute, respectively.

Claim 20

A process for depositing a layer of a chosen oxide containing a selected dopant material on the surface of a selected substrate by chemical vapor deposition comprising: (a) providing said substrate; (b) exposing said substrate to a selected vapor phase reactant in the presence of a selected dopant-containing precursor and in the presence of photochemically generated neutral oxygen atoms, whereby said oxygen atoms react with said vapor phase reactant and said dopant-containing precursor to form said oxide containing said selected dopant material which deposits as said layer on said substrate, and said neutral oxygen atoms are formed from a chosen chemically unreactive oxygen-containing precursor in a manner which avoids damage to said substrate due to charge bombardment or radiation bombardment of said substrate.

Claim 21

A process for depositing a layer of a chosen oxide containing a selected dopant material on the surface of a selected substrate by chemical vapor deposition comprising: (a) providing said substrate; (b) exposing said substrate to a selected vapor phase reactant in the presence of a selected dopant-containing precursor and in the presence of photochemically generated neutral oxygen atoms, whereby said oxygen atoms react with said vapor phase reactant and said dopant-containing precursor to form said oxide containing said selected dopant material which deposits as said layer on said substrate, and said neutral oxygen atoms are formed from a chosen chemically unreactive oxygen-containing precursor in a manner which avoids damage to said substrate due to charge bombardment or radiation bombardment of said substrate.

Claim 22

The process set forth in claim 17 wherein said dopant-containing precursor is selected from the group consisting of phosphine (PH 3 ), diborane (B 2 H 6 ), arsine (AsH 3 ), stibine (SbH 3 ), hydrogen selenide (H 2 Se), hydrogen sulfide (H 2 S), and hydrogen telluride (H 2 Te).

Claim 23

The process set forth in claim 17 wherein said vapor phase reactant contains an element selected from the group consisting of silicon, germanium, gallium, boron, indium, aluminum, titanium, tungsten, and hafnium.

Claim 24

The process set forth in claim 17 wherein: (a) said oxygen-containing precursor is nitrous oxide (N 2 O); (b) said dopant-containing precursor is phosphine (PH 3 ); (c) said vapor phase reactant is silane (SiH 4 ); and (d) said oxide is silicon dioxide (SiO 2 ) doped with phosphorus (P).

Claim 25

A process for depositing a layer of a chosen oxide containing a selected dopant material on the surface of a selected substrate by chemical vapor deposition comprising the steps of: (a) providing said substrate; and (b) exposing said substrate to a selected vapor phase reactant in the presence of neutral oxygen atoms and neutral atoms or particles of said dopant material, said oxygen atoms and said atoms or particles of said dopant material being simultaneously generated by a mercury-photosensitized photochemical process, whereby said neutral oxygen atoms and said neutral atoms or particles of said dopant material react with said vapor phase reactant to form said oxide containing said selected dopant material which deposits as said layer on said substrate, and said neutral oxygen atoms and said neutral atoms of said dopant material are formed in a manner which avoids damage to said substrate due to charge bombardment or radiation bombardment of said substrate.

Claim 26

A process for depositing a layer of a chosen oxide containing a selected dopant material on the surface of a selected substrate by chemical vapor deposition comprising the steps of: (a) providing said substrate; and (b) exposing said substrate to a selected vapor phase reactant in the presence of neutral oxygen atoms and neutral atoms or particles of said dopant material, said oxygen atoms and said atoms or particles of said dopant material being simultaneously generated by a mercury-photosensitized photochemical process, whereby said neutral oxygen atoms and said neutral atoms or particles of said dopant material react with said vapor phase reactant to form said oxide containing said selected dopant material which deposits as said layer on said substrate, and said neutral oxygen atoms and said neutral atoms of said dopant material are formed in a manner which avoids damage to said substrate due to charge bombardment or radiation bombardment of said substrate.

Claim 27

The process set forth in claim 21 wherein: (a) said neutral oxygen atoms are formed by the mercury photosensitized dissociation of a chosen chemically unreactive oxygen-containing precursor; and (b) said neutral atoms or particles of said dopant material are formed by the mercury photosensitized dissociation of a selected dopant-containing precursor.

Claim 28

The process set forth in claim 22 wherein said oxygen-containing precursor is selected from the group consisting of: nitrous oxide (N 2 O); nitrogen dioxide (NO 2 ); and molecular oxygen (O 2 ) under selected pressure and flow rate conditions.

Claim 29

A process for depositing a layer of chosen oxide containing a selected dopant material on the surface of a selected substrate by chemical vapor deposition comprising: (a) providing said substrate; (b) exposing said substrate to a selected vapor phase reactant in the presence of a selected dopant-containing precursor and neutral oxygen atoms, said neutral oxygen atoms being formed by exposing a chosen chemically unreactive oxygen-containing precursor to radiation of a selected wavelength to cause the direct dissociation of said oxygen-containing precursor to form said neutral oxygen atoms, whereby said neutral oxygen atoms react with said vapor phase reactant and said dopant-containing precursor to form said oxide containing said selected dopant material which deposits as said layer on said substrate, and said neutral oxygen atoms are formed in a manner which avoids damage to said substrate due to charge bombardment or radiation bombardment of said substrate.

Claim 30

A process for depositing a layer of chosen oxide containing a selected dopant material on the surface of a selected substrate by chemical vapor deposition comprising: (a) providing said substrate; (b) exposing said substrate to a selected vapor phase reactant in the presence of a selected dopant-containing precursor and neutral oxygen atoms, said neutral oxygen atoms being formed by exposing a chosen chemically unreactive oxygen-containing precursor to radiation of a selected wavelength to cause the direct dissociation of said oxygen-containing precursor to form said neutral oxygen atoms, whereby said neutral oxygen atoms react with said vapor phase reactant and said dopant-containing precursor to form said oxide containing said selected dopant material which deposits as said layer on said substrate, and said neutral oxygen atoms are formed in a manner which avoids damage to said substrate due to charge bombardment or radiation bombardment of said substrate.

Claim 31

The process set forth in claim 24 wherein said oxygen-containing precursor is selected from the group consisting of: nitrous oxide (N 2 O); nitrogen dioxide (NO 2 ); and molecular oxygen (O 2 ) under selected pressure and flow rate conditions.

Claim 32

The process set forth in claim 24 which includes the direct dissociation of said dopant-containing precursor by exposure to said radiation of said selected wavelength, to form a neutral particle of said dopant-containing precursor which reacts with said neutral oxygen atoms and and said vapor phase reactant.

Claim 33

A process for depositing a layer of a chosen oxide on a selected substrate while simultaneously minimizing damage to said substrate due to charge bombardment or radiation bombardment of said substrate, which comprises: (a) passing a selected vapor phase reactant over a surface of said substrate; (b) photochemically generating neutral oxygen atoms in the presence of said vapor phase reactant; and (c) reacting said neutral oxygen atoms with said vapor phase reactant to form said chosen oxide, whereby said oxide deposits as said layer on said substrate and said neutral oxygen atoms are formed in a manner which avoids damage to said substrate due to said charge bombardment or said radiation bombardment of said substrate.

Claim 34

A process for depositing a layer of a chosen oxide on a selected substrate while simultaneously minimizing damage to said substrate due to charge bombardment or radiation bombardment of said substrate, which comprises: (a) passing a selected vapor phase reactant over a surface of said substrate; (b) photochemically generating neutral oxygen atoms in the presence of said vapor phase reactant; and (c) reacting said neutral oxygen atoms with said vapor phase reactant to form said chosen oxide, whereby said oxide deposits as said layer on said substrate and said neutral oxygen atoms are formed in a manner which avoids damage to said substrate due to said charge bombardment or said radiation bombardment of said substrate.

Claim 35

The process defined in claim 27 wherein the photochemical generation of said neutral oxygen atoms includes either the mercury-photosensitized dissociation of a selected oxygen-containing precursor in the presence of said vapor phase reactant or the direct impingement of said precursor with radiation of a selected wavelength sufficient to cause the direct dissociation of said precursor to form said neutral oxygen atoms.

Claim 36

The process defined in claim 27 wherein said reacting of said neutral oxygen atoms with said vapor phase reactant includes being performed in the presence of a precursor containing selected dopant atoms, and said oxide incorporates said dopant atoms.

Claim 37

A low-temperature, charge-free process for depositing a layer of an oxide of a chosen material on the surface of a selected substrate while simultaneously avoiding damage to said substrate comprising exposing said substrate to a selected vapor phase reactant in the presence of neutral, charge-free oxygen atoms formed in a manner which avoids the generation of charged particles or high energy radiation, to bring about the reaction of said oxygen atoms with said vapor phase reactant to form said oxide which deposits as said layer on said substrate, while simultaneously avoiding said damage to said substrate due to said charged particles or said high energy radiation.

Claim 38

A low-temperature, charge-free process for depositing a layer of an oxide of a chosen material on the surface of a selected substrate while simultaneously avoiding damage to said substrate comprising exposing said substrate to a selected vapor phase reactant in the presence of neutral, charge-free oxygen atoms formed in a manner which avoids the generation of charged particles or high energy radiation, to bring about the reaction of said oxygen atoms with said vapor phase reactant to form said oxide which deposits as said layer on said substrate, while simultaneously avoiding said damage to said substrate due to said charged particles or said high energy radiation.

Claim 39

A process for depositing an oxide layer of a chosen material on the surface of a selected substrate which comprises: exposing said surface to a selected vapor phase reactant in the presence of neutral, charge-free oxygen atoms and thereby reacting said oxygen atoms with said reactant in a manner sufficient to form said oxide on said surface of said substrate.

Claim 40

A process for depositing an oxide layer of a chosen material on the surface of a selected substrate which comprises: exposing said surface to a selected vapor phase reactant in the presence of neutral, charge-free oxygen atoms and thereby reacting said oxygen atoms with said reactant in a manner sufficient to form said oxide on said surface of said substrate.

Claim 41

The process set forth in claim 31 wherein said neutral, charge-free oxygen atoms are formed by mercury photosensitized dissociation of a chosen chemically unreactive oxygen-containing precursor.

Claim 42

The process set forth in claim 31 wherein said neutral, charge-free oxygen atoms are formed by exposing a chosen oxygen-containing precursor to radiation of a selected wavelength to cause the direct dissociation of said precursor to form said oxygen atoms.

Claim 43

The process set forth in claim 31 wherein said reaction occurs at a temperature in the range of 30° C. to 300° C.

Claim 44

A process for depositing a layer of a chosen oxide containing a selected dopant material on the surface of a selected substrate which comprises exposing said surface to a selected vapor phase reactant in the presence of a selected dopant-containing precursor and in the presence of neutral, charge-free oxygen atoms and thereby reacting said oxygen atoms with said vapor phase reactant and said dopant-containing precursor in a manner sufficient to form said oxide containing said dopant material, which deposits as said layer on said surface of said substrate.

Claim 45

A process for depositing a layer of a chosen oxide containing a selected dopant material on the surface of a selected substrate which comprises exposing said surface to a selected vapor phase reactant in the presence of a selected dopant-containing precursor and in the presence of neutral, charge-free oxygen atoms and thereby reacting said oxygen atoms with said vapor phase reactant and said dopant-containing precursor in a manner sufficient to form said oxide containing said dopant material, which deposits as said layer on said surface of said substrate.

Claim 46

An article of manufacture comprising a chosen substrate having a layer of a selected oxide formed on the surface of said substrate, wherein said layer of said oxide is formed by the process of claim 31.

Claim 47

The article set forth in claim 36 wherein said substrate is selected from the group consisting of a semiconductor material and a metal.

Claim 48

A semiconductor device comprising a substrate of a chosen semiconductor material and a layer of a selected oxide formed on the surface of said substrate characterized in that said layer of said oxide is formed by the process of claim 37 whereby damage to said substrate during the formation of said layer of said oxide is minimized.

Claim 49

The semiconductor device set forth in claim 38 which further comprises a gate structure formed on the surface of said layer of said oxide wherein said layer of said oxide provides an insulating layer between said substrate and said gate structure.