US4329419A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Polymeric heat resistant photopolymerizable composition for semiconductors and capacitors
Assignee: EIDP Inc
•
Filing: 1980-09-03
•
Granted: 1982-05-11
•
Expires: 2000-09-03
Abstract
Abstract A polymeric heat resistant photopolymerizable composition of a polyamide ester resin containing photopolymerizable groups useful for forming relief structures on electrical devices such as capacitors, integrated circuits and semiconductors; a solution of the composition is applied to a substrate such as a coated silicon wafer which forms an electrical device, dried to form a film, the film is exposed to radiation through a pattern and photopolymerized; the unexposed and unpolymerized part of the film is dissolved off and the resulting relief structure is baked to form a polyimide structure with sharp definition and has good mechanical, chemical and electrical properties; to reduce radiation exposure time and increase the rate of photopolymerization the following constituents are used in the composition: a radiation sensitive polymerizable polyfunctional acrylate compound and a photopolymerization initiator of an aromatic biimidazole.
Inventors
- 👤 David L. Goff
- 👤 Edward L. Yuan
- 👤 Stephen Proskow
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 12:46
CPC Classifications
G; G03; G03C; G03C5/00; C; C08; C08F; C08F290/00; C08F290/08; C08F290/14; C08F290/145; G03F; G03F7/00; G03F7/004; G03F7/027; G03F7/032; G03F7/037
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
49 words
An improved radiation polymerizable composition consisting essentially of (a) a polyamide ester resin containing photopolymerizable groups; (b) a solvent for the resin; (c) radiation sensitive polymerizable polyfunctional acrylate compound and (d) photopolymerization initiator of an aromatic biimidazole; wherein the polyamide ester resin upon heating converts to a polyimide resin.
Claim 2
Dependent Claim
49 words
An improved radiation polymerizable composition consisting essentially of (a) a polyamide ester resin containing photopolymerizable groups; (b) a solvent for the resin; (c) radiation sensitive polymerizable polyfunctional acrylate compound and (d) photopolymerization initiator of an aromatic biimidazole; wherein the polyamide ester resin upon heating converts to a polyimide resin.
Claim 3
Dependent Claim
74 words
The improved composition of claim 1 in which the polyamide ester resin comprises the following structure: ##STR2## wherein→denotes isomerism, R is an aromatic radical, R 1 is an organic radical containing a photo polymerizable olefinic double bond, R 2 is an aromatic, aliphatic or cycloaliphatic radical and n is a positive integer sufficiently large to provide the resin with a weight average molecular weight of about 5,000 to 75,000 determined by gel permeation chromatography.
Claim 4
Dependent Claim
33 words
The composition of claim 2 in which the polyamide ester resin comprises R from pyromellitic dianhydride, R 1 from hydroxy alkyl methacrylate or hydroxy alkyl acrylate and R 2 from an aromatic diamine.
Claim 5
Dependent Claim
61 words
The composition of claim 2 in which the polymerizable polyfunctional acrylate is selected from the group consisting of trimethylol propane trimethacrylate, trimethylol propane triacrylate, trimethylol propane ethoxylate trimethacrylate, trimethylol propane ethoxylate triacrylate, trimethylol propane polyethoxylate trimethacylate, trimethylol propane polyethoxylate triacrylate, pentaerythritol triacrylate, polyethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol dimethyacrylate, polymethylene diacrylate, polymethylene dimethyacrylate, trimethylene glycol dimethacrylate and mixtures thereof.
Claim 6
Dependent Claim
9 words
The composition of claim 2 containing a leuco dye.
Claim 7
Dependent Claim
15 words
The composition of claim 5 in which the leuco dye is an alkyl amino-aromatic alkane.
Claim 8
Dependent Claim
18 words
The composition of claim 4 or 5 in which the photopolymerization initiator is bis(2-o-chlorophenyl-4,5-diphenyl imidazolyl) or bis[2-o-chloro-phenyl-4,5-di(m-methoxyphenyl imidazolyl].
Claim 9
Dependent Claim
10 words
The composition of claim 4 or 5 containing a photosensitizer.
Claim 10
Dependent Claim
58 words
The composition of claim 2 in which the polyamide ester resin is of pyromellitic dianhydride esterified with hydroxyethyl methacrylate and reacted with oxydianiline, the polyfunctional acrylate compound is trimethylol propane polyethyoxylate having a weight average molecular weight of about 500-1500, the photopolymerization initiator is bis(2-o-chlorophenyl-4,5-diphenyl imidazolyl), and the composition contains tris(diethylamino-o-tolyl) methane, and a photosensitizer of tetramethyldiamino benzophenone.
Claim 11
Dependent Claim
52 words
The composition of claim 2 in which the polyamide ester is of pyromellitic dianhydride, esterified with hydroxyl ethyl methacrylate and reacted with oxydianiline, the polyfunctional acrylate is trimethylol propane trimethacrylate or trimethylol propane triacrylate, the polymerization initiator is bis(2-o-chlorophenyl-4,5-diphenyl imidazolyl) and the composition contains tris(diethylamino-o-tolyl) methane and a photosensitizer of tetramethyldiamino benzophenone.
References Cited (Backward Citations)
US3784557A
Cited
US3594410A
Cited
US3380831A
Cited
US3479185A
Cited
US3552973A
Cited
US3623870A
Cited
US3957512A
Cited
US3953877A
Cited
US4040831A
Cited
US4093461A
Cited
US4188224A
Cited
US4117196A
Cited
US4132812A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-05-10 | 1985-11-09 | 1986-05-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-05-10 | 1989-11-09 | 1990-05-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-05-10 | 1993-11-09 | 1994-05-11 | $7700.00 | Window Closed / Lapsed |