LED fiber optic connector

Claim 1

In a bonded optical connection of an optical and flexible waveguide and an edge emitting, chip form light emitting diode (LED), together with electrical connection means for the LED, the improvement consisting of: said LED including a leading edge and an opposed trailing edge, said LED further including a pair of conductive surfaces and an emitting edge, each of which extend from said leading edge to said trailing edge, said electrical connection means includes a flexible insulative substrate having a first surface and a second surface separated by the thickness of said substrate, an H-shaped slot provided through said substrate providing a pair of opposed segments of said substrate wherein each of said segments is bonded on three sides by said slot, a layer of conductive material provided on said substrate second surface and at least partially covering each of said segments, thereby providing an electrical circuit along said segments which is interrupted by said slot, said LED being mounted in said slot with said leading edge thereof projecting outwardly of said substrate first surface and with said trailing edge disposed within said slot and positioned in a range either between said substrate first and second surface or flush with either said substrate first and second surfaces, said conductive material layer on said segments engaging corresponding LED conductive surfaces, said substrate segments being resiliently deflected by said LED outwardly of the plane of the remainder of said substrate and said segments resiliently biasing said conductive material layer into engagement with said LED conductive surfaces, said optical waveguide having an end abutting said LED emitting edge, said optical waveguide having an end portion immediately adjacent said end thereof mounted against said substrate first surface, and a single quantity of light transmitting encapsulant material bonding to said optical waveguide and said LED emitting edge to form an optical junction, said light transmitting encapsulant material also bonding to said LED and said conductive metal layer to secure said LED mechanically as well as electrically to said conductive metal layer, said light transmitting encapsulant material also bonding to said LED and said substrate segments and the remainder of said substrate and said end portion of said optical waveguide to form an integral unit of low profile projecting outwardly of only said substrate first surface without interfering with the flexibility of either said substrate or said waveguide.