Patent DE957897C successfully refreshed from Google Patents.
US4058431A
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US
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Method of etching copper and copper alloys
Assignee: Hollmuller Hans Maschinenbau GmbH and Co
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Filing: 1975-10-20
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Granted: 1977-11-15
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Expires: 1995-10-20
Abstract
Abstract A method of etching copper and copper alloys by means of an ammoniacal etching solution containing chloride ions and for regenerating this etching solution during this etching process by adding an ammoniacal compound, for example, in the form of ammonium hydroxide or ammonia gas, as well as hydrochloric acid and water to the etching solution in accordance with continuous measurements of the pH-value and the specific gravity of the etching solution.
Inventors
- 👤 Rainer Haas
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 19:10
CPC Classifications
C; C23; C23F; C23F1/00; C23F1/46; Y; Y10; Y10T; Y10T137/00; Y10T137/0318; Y10T137/0324; Y10T137/0329
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
112 words
A method of etching copper and copper alloys, comprising the steps of: treating copper or a copper alloy with an etching medium consisting of an ammoniacal etching solution containing chloride ions, thereby producing a copper-I compound; regenerating the copper-I compound by reacting therewith a chloro compound and by the addition of water to said solution at a rate controlled in dependence upon the rate of formation of said copper-I compounds, the regeneration rate being controlled at least in part by monitoring the specific gravity of the solution; and supplying to said solution as amount of ammoniacal compound such that the pH value of the latter is maintained at about 8.5 to 10.0.
Claim 2
Independent Claim
112 words
A method of etching copper and copper alloys, comprising the steps of: treating copper or a copper alloy with an etching medium consisting of an ammoniacal etching solution containing chloride ions, thereby producing a copper-I compound; regenerating the copper-I compound by reacting therewith a chloro compound and by the addition of water to said solution at a rate controlled in dependence upon the rate of formation of said copper-I compounds, the regeneration rate being controlled at least in part by monitoring the specific gravity of the solution; and supplying to said solution as amount of ammoniacal compound such that the pH value of the latter is maintained at about 8.5 to 10.0.
Claim 3
Dependent Claim
36 words
The method defined in claim 1 wherein the addition of at least one of said chloro and ammoniacal compounds to the solution is carried out in part as a function of the color of the solution.
Claim 4
Dependent Claim
36 words
The method defined in claim 1 wherein the addition of at least one of said chloro and ammoniacal compounds to the solution is carried out in part as a function of the pH of the solution.
Claim 5
Dependent Claim
40 words
The method defined in claim 1 wherein said ammoniacal compound selected from the group which consists of ammonium hydroxide and ammonia gas, said chloro compound being selected from the group which consists of hydrogen chloride, ammonium chloride and sodium chloride.
Claim 6
Dependent Claim
29 words
The method defined in claim 4 wherein the copper content per liter of the etching medium is maintained at a substantially constant value by the addition thereto of water.
Claim 7
Dependent Claim
25 words
The method defined in claim 5 wherein the molar ratio of the chloro compound to the ammoniacal compound is maintained at substantially 1 to 2.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1980-11-14 | 1981-05-16 | 1981-11-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1984-11-14 | 1985-05-16 | 1985-11-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1988-11-14 | 1989-05-16 | 1989-11-15 | $7700.00 | Window Closed / Lapsed |