US3967366A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of contacting contact points of a semiconductor body
Assignee: Telefunken Electronic GmbH
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Filing: 1974-03-22
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Granted: 1976-07-06
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Expires: 1994-03-22
Abstract
Abstract A method of contacting contact points of a semiconductor body comprises first attaching the semicoductor body to a heat conducting portion of a first frame with inwardly directed tongues directed towards the contact points, positioning a second frame with inwardly directed tongues engaging with their ends, the contact points, the second frame also engaging the first frame, attaching the frames and semiconductor body together at the engagement points and thereafter separating each of the two frames to provide insulated leads to the contact points.
Inventors
- 👤 Georg Birglechner
- 👤 Leonard Botzenhardt
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 16:43
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/60; H10W70/00; H10W70/40; H10W70/421; H10W70/442; H10W70/461; H10W70/464; H10W70/466; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/651; H10W72/652; H10W72/655; H10W74/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
237 words
A method for contacting integrated circuits accommodated in a semiconductor body by means of a first contacting frame which has a plurality of contacting tongues starting from said frame and projecting inwardly and of a second smaller contacting frame, likewise with a plurality of contacting tongues projecting inwardly, comprising: securing said semiconductor body with its rear side to a carrier part arranged centrally in said first contacting frame; thereafter aligning said second frame relative to said semiconductor body so that the free ends of the tongues of said second frame can be connected to the connection electrodes of said semiconductor body and the frame itself, or parts of the tongues abutting at the frame, can be connected to the free ends of said contacting tongues of said first frame; producing all the connection points of the second frame and its tongues to the tongues of said first frame and said connection electrodes; thereafter separating said second frame by cutting the portions thereof extending between the tongues of said first frame so that said tongues of said first frame are separated from each other at their said free ends; surrounding said semiconductor body and said connection points by a housing; and subsequently separating said first frame so that said tongues of said first frame form connection lines to the integrated semiconductor circuit, which connection lines are insulated from each other and lead into the interior of said housing.
Claim 2
Independent Claim
237 words
A method for contacting integrated circuits accommodated in a semiconductor body by means of a first contacting frame which has a plurality of contacting tongues starting from said frame and projecting inwardly and of a second smaller contacting frame, likewise with a plurality of contacting tongues projecting inwardly, comprising: securing said semiconductor body with its rear side to a carrier part arranged centrally in said first contacting frame; thereafter aligning said second frame relative to said semiconductor body so that the free ends of the tongues of said second frame can be connected to the connection electrodes of said semiconductor body and the frame itself, or parts of the tongues abutting at the frame, can be connected to the free ends of said contacting tongues of said first frame; producing all the connection points of the second frame and its tongues to the tongues of said first frame and said connection electrodes; thereafter separating said second frame by cutting the portions thereof extending between the tongues of said first frame so that said tongues of said first frame are separated from each other at their said free ends; surrounding said semiconductor body and said connection points by a housing; and subsequently separating said first frame so that said tongues of said first frame form connection lines to the integrated semiconductor circuit, which connection lines are insulated from each other and lead into the interior of said housing.
Claim 3
Dependent Claim
25 words
A method as defined in claim 1, wherein said contacting frames with said tongues are etched in a large number in a continuous metal strip.
Claim 4
Dependent Claim
38 words
A method as defined in claim 1, wherein said second contacting frame is so etched into a metal strip that said frame remains connected only by narrow webs with outer side and transverse webs of said metal strip.
Claim 5
Dependent Claim
45 words
A method as defined in claim 1, wherein said contacting tongues of said second frame are so pre-embossed that, as a result of their course, the height difference between the connection electrodes of said semiconductor body and said tongues of said first frame is equalized.
Claim 6
Dependent Claim
33 words
A method as defined in claim 1, wherein the carrier part accommodating said semiconductor body is so constructed that heat resulting in said semiconductor body can be rapidly dispersed through said carrier part.
Claim 7
Dependent Claim
36 words
A method as defined in claim 5, wherein said carrier part is centrally disposed in the interior of said first frame and connects together two side parts of said first frame which lie opposite each other.
Claim 8
Dependent Claim
72 words
A method as defined in claim 1, wherein after producing all the connection points in any sequence, said step of separating said second frame further includes, after cutting the parts of said second frame extending between said tongues of said first frame, bending the parts of said second frame projecting over the edges of said tongues of said first frame around the adjacent side of the associated tongue of said first frame.
Claim 9
Dependent Claim
47 words
A method as defined in claim 1, wherein said contacting frames and their tongues are tinned, and wherein said step of producing all of the connection points comprises soldering the second frame and its tongues to the tongues of said first frame and said connection electrodes respectively.
Claim 10
Dependent Claim
27 words
A method as defined in claim 1, wherein said housing is formed by casting plastics around or spraying plastics onto said semiconductor body and said connection points.
Claim 11
Independent Claim
172 words
A method for contacting contact points of a semiconductor body comprising the steps of: attaching said semiconductor body to a heat conducting portion of a first frame having inwardly projecting tongues directed towards said contact points on said semiconductor body, positioning a second frame, having a closed outer portion and a plurality of inwardly projecting tongues, with the ends of these said tongues in engagement with said contact points of said semiconductor body and with at least said closed outer portions of said second frame in engagement with said tongues of said first frame, attaching said second frame by its engaging parts to said semiconductor body and to said first frame, cutting said outer portion of said second frame at positions between said tongues of said first frame to separate said tongues of said second frame, and render them extensions of said tongues of said first frame, and separating said first frame to separate said tongues of said first frame to provide insulated lines to said contact points of said semiconductor body.
Claim 12
Independent Claim
172 words
A method for contacting contact points of a semiconductor body comprising the steps of: attaching said semiconductor body to a heat conducting portion of a first frame having inwardly projecting tongues directed towards said contact points on said semiconductor body, positioning a second frame, having a closed outer portion and a plurality of inwardly projecting tongues, with the ends of these said tongues in engagement with said contact points of said semiconductor body and with at least said closed outer portions of said second frame in engagement with said tongues of said first frame, attaching said second frame by its engaging parts to said semiconductor body and to said first frame, cutting said outer portion of said second frame at positions between said tongues of said first frame to separate said tongues of said second frame, and render them extensions of said tongues of said first frame, and separating said first frame to separate said tongues of said first frame to provide insulated lines to said contact points of said semiconductor body.
Claim 13
Dependent Claim
36 words
A method as defined in claim 10, and comprising, after separating said second frame embedding said semiconductor body, said second frame and part of said first frame in a housing prior to separating said second frame.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-07-06 | 1980-01-05 | 1980-07-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-07-06 | 1984-01-05 | 1984-07-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-07-06 | 1988-01-05 | 1988-07-06 | $7700.00 | Window Closed / Lapsed |