Ground clip for semi-conductor package

Claim 1

A single-piece ground clip for use in combination with a semi-conductor package, said package including a base member and integrated circuit chip carried on said base member and a plurality of leads extending downwardly from the periphery of said base member, said leads connected electrically to respective components of said chip, said ground clip comprising: a. a cover member formed of electrically conductive material sized to overlay said base member; b. skirt members formed integrally with said cover member and depending downwardly therefrom adapted to make electrical contact with each of said plurality of leads to maintain each of said leads at the same potential while said clip is engaged with said package; and c. means for detachably securing said ground clip to said semiconductor package such that the leads of said semi-conductor package can be electrically connected in the final intended circuit while said leads are still grounded by contact with said skirt members, said means comprising portions of said skirt members biased inwardly to make sliding frictional contact with said leads, allowing said leads to be exposed for connection in said final circuit and then allowing said ground clip to be detached from said semi-conductor package after said connection is effected.