Resinous compositions having high electroconductivity containing Cu and metal salts

Claim 2

AN ELECTROCONDUCTIVE RESINOUS COMPOSITION COMPRISING A RESINOUS MATERIAL HAVING A VOLUME RESISTIVITY GREATER THAN 10**6 OHM-CM AS THE MATRIX HAVING DISPERSED THEREIN A FINELY DIVIDED, COPPER METAL-CONTAINING SOLID WHEREIN COPPER METAL CONSTITUTES AT LEAST 50 VOLUME PERCENT OF THE SOLID IF COPPER METAL IS DISTRIBUTED THROUGHOUT THE SOLID AND AT LEAST 10 VOLUME PERCENT IF THE COPPER METAL FORMS AN ESSENTIALLY CONTINUOUS LAYER COVERING THE PARTICLE SURFACES OF THE SOLID AND A SALT SELECTED FROM THE GROUP CONSISTING OF CHLORIDES, BROMIDES, BICARBONATES, TETRABORATES AND CARBOXYLATES OF THE ALKALI METALS, CALCIUM ZINC, LEAD, SILVER, AND COPPER AND THE FLUORIDES OF SODIUM AND POTASSIUM, SAID SOLID AND SALT BEING PRESENT IN AMOUNTS SUFFICIENT TO REDUCE THE VOLUME RESISTIVITY OF SAID COMPOSITION BELOW 10**4 OHM-CM.

Claim 3

The composition of claim 1 wherein the amount of said solid is within the range from about 4 to about 50 volume percent and the amount of the salt is within the range from about 0.03 to about 5 volume percent, both percentages being based on the volume of the composition.

Claim 4

The composition of claim 1 wherein the solid contains at least 70 volume percent copper.

Claim 5

The composition of claim 3 wherein the solid is a metallic solid comprising at least 90 volume percent copper and up to about 10 volume percent zinc.

Claim 6

The composition of claim 1 wherein the solid has an average particle size in the range from about 0.01 to about 150 microns.

Claim 7

The composition of claim 1 wherein the salt is a zinc chloride.

Claim 8

The composition of claim 1 wherein the salt is zinc bromide.

Claim 9

The composition of claim 1 wherein the salt is a carboxylate having 1 to 20 carbon atoms.

Claim 10

The composition of claim 1 wherein the resinous material is a normally solid, thermoplastic polymer.

Claim 11

The composition of claim 9 wherein the polymer is an polymer of an aliphatic Alpha -monoolefin.

Claim 12

The composition of claim 10 wherein the polymer is a blend of polyethylene and an ethylene/vinyl acetate copolymer.

Claim 13

The composition of claim 1 comprising a resinous material as the matrix selected from the group consisting of normally solid thermoplastic polymers of aliphatic Alpha -monoolefins, vinyl halides, esters of Alpha , Beta -ethylenically unsaturated carboxylic acids, Alpha , Beta -ethylenically unsaturated carboxylic acids, monovinylidene aromatic carbocyclic monomers, conjugated dienes, ethylenically unsaturated nitriles, ethylenically unsaturated amines, ethylenically unsaturated ethers, and ethylenicalLy unsaturated ketones, cellulosic polymers, polyamines, polyamides, polyesters, polycarbonates and silicone rubbers having dispersed therein a finely divided, copper metal-containing solid having an average particle size in the range from about 0.01 to about 150 microns and selected from the group consisting of copper and metal alloys of copper and zinc, aluminum, bismuth, silver, iron, nickel or gold and said salt of claim 1, said copper metal-containing solid and salt being present in amounts sufficient to reduce the volume resistivity of said composition below 104 ohm-cm.

Claim 14

The composition of claim 1 comprising a resinous material as the matrix selected from the group consisting of normally solid, thermoplastic polymers of ethylene, propylene, butene-1, isobutene, vinyl chloride, vinylidene chloride, ethyl acrylate, methyl methacrylate, styrene, Alpha -methyl-styrene, ar-(t-butyl)styrene, vinyl benzyl quarternary ammonium compounds, butadiene, isoprene, acrylonitrile, vinyl pyridine, and methyl vinyl ketone; polymers of ethyl cullulose and methyl cellulose; polyethyleneimine; nylon, and poly(ethylene terephthalate) having dispersed therein from about 4 to about 50 volume percent based on the composition of a particulate solid of copper or a metal alloy of at least 70 volume percent copper and the remainder of zinc, aluminum, bismuth, silver, iron, nickel or gold, said particulate solid having an average particle size from about 0.01 to 150 microns and from about 0.03 to about 5 volume percent based on the composition of said salt of Claim 1 provided that said copper-metal containing solid and salt are present in amounts sufficient to reduce the volume resistivity of said composition below 104 ohm-cm.

Claim 15

The composition of claim 1 comprising a resinous material as matrix selected from the group consisting of polyethylene, ethylene/vinyl acetate copolymer, ethylene/acrylic acid copolymer, ethylene/butene-1 copolymer, polyvinyl chloride, polyvinylidene chloride, vinyl chloride/vinylidene chloride copolymer, vinylidene chloride/acrylonitrile copolymer and chlorinated polyethylene having dispersed therein from about 4 to about 50 volume percent based on the composition of copper or brass in the form of a particulate solid having an average particle size of from about 1 to 15 microns and from about 0.1 to about 3 volume percent based on the composition of a salt selected from the group consisting of zinc bromide, zinc chloride, zinc stearate, zinc acetate, sodium chloride, lithium bromide, potassium chloride, calcium chloride, lead (II) chloride and lithium chloride, provided that said particulate solid and salt are present in amounts sufficient to reduce the volume resistivity of said composition to 10116 1 ohm-cm.