US3857993A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Beam lead semiconductor package
Assignee: Raytheon Co
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Filing: 1973-11-21
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Granted: 1974-12-31
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Expires: 1993-11-21
Abstract
Abstract A beam lead semiconductor package in which a plurality of leads are sealed through an aperture in the upper surface of a header by an insulating seal, with the ends of the leads being substantially coplanar with the upper surface of the header and a beam lead semiconductor device having at least one of the beams bonded to the upper surface of the header and a plurality of the other beams bonded to the leads whereby the beam lead device is rigidly supported with respect to the header and a cap is hermetically sealed over the header.
Inventors
- 👤 P Gregory
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 18:01
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/132; H10W76/15; H10W76/153; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
82 words
A semiconductor device package comprising: a metal header structure having a surface with an aperture therein; and a plurality of leads supported in said aperture and insulated from said structure with one end of each of said leads being substantially coplanar with said surface, wherein said header structure supports a semiconductor device haing a plurality of beam leads extending outwardly therefrom, the outwardly extending ends of said beam leads being bonded respectively to each of said lead ends and to said surface.
Claim 2
Dependent Claim
82 words
A semiconductor device package comprising: a metal header structure having a surface with an aperture therein; and a plurality of leads supported in said aperture and insulated from said structure with one end of each of said leads being substantially coplanar with said surface, wherein said header structure supports a semiconductor device haing a plurality of beam leads extending outwardly therefrom, the outwardly extending ends of said beam leads being bonded respectively to each of said lead ends and to said surface.
Claim 3
Dependent Claim
22 words
The package in accordance with claim 1 wherein a cover is bonded to said header structure enclosing said beam lead semiconductor device.
Claim 4
Dependent Claim
20 words
The package in accordance with claim 2 wherein the edges of said semiconductor device lie substantially in the crystallographic plane.
Claim 5
Dependent Claim
24 words
The package in accordance with claim 3 wherein said leads and said header are formed substantially of an alloy of iron, nickel, and cobalt.
Claim 6
Independent Claim
105 words
The method of forming a seminconductor beam lead package assembly comprising the steps of: forming a cup-shaped header with an aperture in a wall thereof; forming an assembly comprising at least one conductive lead in said cup-shaped header extending into said aperture and bonded to and insulated from said header through an insulating body forming a planar surface of said header and an end of said lead supporting a semiconductor device having a plurality of beam leads extending outwardly therefrom on said surface, with different ones of said beam leads of said device respectively connected to the ends of said leads and said header surface.
Claim 7
Independent Claim
105 words
The method of forming a seminconductor beam lead package assembly comprising the steps of: forming a cup-shaped header with an aperture in a wall thereof; forming an assembly comprising at least one conductive lead in said cup-shaped header extending into said aperture and bonded to and insulated from said header through an insulating body forming a planar surface of said header and an end of said lead supporting a semiconductor device having a plurality of beam leads extending outwardly therefrom on said surface, with different ones of said beam leads of said device respectively connected to the ends of said leads and said header surface.
Claim 8
Dependent Claim
25 words
The method in accordance with claim 5 wherein said step of forming said assembly includes the step of forming said insulating body from glass powder.
Claim 9
Dependent Claim
25 words
The method in accordance with claim 6 further including the step of forming said header and lead-in members are formed of the same metallic material.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-12-30 | 1978-07-01 | 1978-12-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-12-30 | 1982-07-01 | 1982-12-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-12-30 | 1986-07-01 | 1986-12-31 | $7700.00 | Window Closed / Lapsed |