Method of manufacturing circuit board connectors

Claim 1

A METHOF OF MANUFACTURING ELECTRICAL CIRCUIT BOARD CONNECTORS INTEGRAL WITH AT LEAST ONE CIRCUIT MOUNTED ON A POSITIONER BOARD AND PROJECTING THEREFROM COMPRISING THE STEPS OF: BONDING AN ALUMINUM SHEET DISPOSED BETWEEN TWO SHEETS OF A BONDING AGENT TO A POSITIONER BOARD HAVING A COPPER CLAD ON THE UNBONDED SIDE THEREOF, THE ALUMINUM SHEET HAVING A THICKNESS OF THE DESIRED CONNECTOR HEIGHT; FORMING APERTURES THROUGH THE BONDED ASSEMBLY AT THE LOCATIONS OF THE DESIRED PROJECTING, INTEGRAL CONNECTORS, THE APERTURES HAVING A SIZE LARGER THAN THE INSIDE DIAMETER OF THE DESIRED CONNECTORS; ELECTRO-COPPER PLATING THE EXPOSED ALUMINUM SURFACES IN THE APERTURES TO A DESIRED THICKNESS; ELECTROLESS COPPER PLATING ALL SURFACES OF THE ASSEMBLY TO A DESIRED THICKNESS; NICKEL PLATING ALL EXPOSED COPPER SURFACES INCLUDING THE COPPER PLATED APERTURES TO FORM NICKEL CONNECTORS TEREIN; APPLYING A DRY FILM PHOTO RESIST LAYER TO THE TOP AND BOTTOM SURFACES TO THE NICKEL PLATE ASSEMBLY, THE PHOTO RESIST HAVING CEHMICAL ETCHANT RESISTANT PORTIONS OVER THE APERTURES AND DEFINING AN ELECTRICAL CIRCUIT ON THE NICKEL CLAD POSITIONER BOARD AND CHEMICAL ETCHANT SUSCEPTIBLE PORTIONS OVER THE REMAINDER THEREOF; CHEMICALLY ETCHING THE ASSEMBLY TO REMOVE ALL OF THE EXPOSED NICKEL AND COPPER THEREFROM REMOVING THE CHEMICAL ETCHANT RESISTANT PORTIONS OF THE PHOTO RESIST TO EXPOSED THE APERTURES AND THE ELECTRICAL CIRCUIT ON THE POSITIONER BOARD; REMOVING THE BOTTOM BONDING AGENT SHEET AND ANY COPPER OR NICKEL PLATING THEREON TO EXPOSE THE BOTTOM OF THE ALUMINUM SHEET; DISSOLVING THE ALUMINUM SHEET TO EXPOSED THE NICKEL CONNECTORS PROJECTING FROM THE POSITIONER BOARD; AND REMOVING THE EZPOSED COPPER PLATING FROM THE OUTSIDE OF 7 THE PROJECTING NICKEL CONNECTORS.

Claim 12

A method of manufacturing electrical circuit board connectors integral with at least one circuit mounted on a positioner board and projecting therefrom comprising the steps of: bonding a positioner board having a copper clad on the unbonded side thereof to an aluminum sheet with at Least one sheet of a bonding agent, the aluminum sheet having a thickness of the desired connector height; forming apertures through the bonded assembly at the locations of the desired projecting, integral connectors, the apertures having a size larger than the inside diameter of the desired connectors; copper plating all surfaces of the assembly including the aperture surfaces to a desired thickness; nickel plating all exposed copper surfaces including the aperture surfaces to form elongated nickel connectors therein; applying a dry film photo resist layer to the top and bottom surfaces of the nickel plated assembly, the photo resist having chemical etchant resistant portions over the apertures and defining an electrical circuit on the nickel clad positioner board and chemical etchant susceptible portions over the remainder thereof; chemically etching the assembly to remove all of the exposed nickel and copper therefrom; removing the chemical etchant resistant portions of the photo resist to expose the apertures and the electrical circuit on the positioner board; removing the aluminum sheet and any bonding agent sheets and any copper or nickel plating below the aluminum sheet to expose the nickel connectors projecting from the positioner board; and removing the exposed copper plating from the outside of the projecting nickel connectors.

Claim 13

A method of manufacturing electrical circuit board connectors integral with at least one circuit mounted on a positioner board and projecting therefrom comprising the steps of: bonding a positioner board having a copper clad on the unbonded side thereof to an aluminum sheet with at Least one sheet of a bonding agent, the aluminum sheet having a thickness of the desired connector height; forming apertures through the bonded assembly at the locations of the desired projecting, integral connectors, the apertures having a size larger than the inside diameter of the desired connectors; copper plating all surfaces of the assembly including the aperture surfaces to a desired thickness; nickel plating all exposed copper surfaces including the aperture surfaces to form elongated nickel connectors therein; applying a dry film photo resist layer to the top and bottom surfaces of the nickel plated assembly, the photo resist having chemical etchant resistant portions over the apertures and defining an electrical circuit on the nickel clad positioner board and chemical etchant susceptible portions over the remainder thereof; chemically etching the assembly to remove all of the exposed nickel and copper therefrom; removing the chemical etchant resistant portions of the photo resist to expose the apertures and the electrical circuit on the positioner board; removing the aluminum sheet and any bonding agent sheets and any copper or nickel plating below the aluminum sheet to expose the nickel connectors projecting from the positioner board; and removing the exposed copper plating from the outside of the projecting nickel connectors.

Claim 23

A method of manufacturing electrical circuit board connectors integral with more than one layer of circuit mounted on a positioner board and projecting therefrom comprising the steps of: bonding a positioner board having a copper sheet clad on one side thereof and a copper circuit on the other side thereof to an aluminum sheet with two sheets of a bonding agent disposed between the copper circuitry side of the positioner board and the aluminum sheet and a sheet of bonding agent on the opposite side of the aluminum sheet, the aluminum sheet having a thickness of the desired connector height; forming apertures through the bonded assembly at the locations of the desired projecting, integral connectors, the apertures having a size larger than the inside diameter of the desired connectors; electro-copper plating the exposed aluminum surfaces in the apertures to a desired thickness; electroless copper plating all surfaces of the assembly to a desired thickness; nickel plating all exposed copper including the copper plated apertures to form elongated nickel connectors therein; applying a dry film photo resist layer to the top and bottom surfaces of the nickel plated assembly, the photo resist having chemical etchant resistant portions over the apertures and defining an electrical circUit on the nickel clad positioner board and chemical etchant susceptible portions over the remainder thereof; chemically etching the assembly to remove all of the exposed nickel and copper therefrom; removing the chemical etchant resistant portions of the photo resist to expose the apertures and the electrical circuit on the positioner board; removing the bottom bonding agent sheet and any copper or nickel plating thereon to expose the bottom of the aluminum sheet; dissolving the aluminum sheet to expose the nickel connectors projecting from the positioner board; and removing the exposed copper plating from the outside of the projecting nickel connectors.

Claim 24

A method of manufacturing electrical circuit board connectors integral with more than one layer of circuit mounted on a positioner board and projecting therefrom comprising the steps of: bonding a positioner board having a copper sheet clad on one side thereof and a copper circuit on the other side thereof to an aluminum sheet with two sheets of a bonding agent disposed between the copper circuitry side of the positioner board and the aluminum sheet and a sheet of bonding agent on the opposite side of the aluminum sheet, the aluminum sheet having a thickness of the desired connector height; forming apertures through the bonded assembly at the locations of the desired projecting, integral connectors, the apertures having a size larger than the inside diameter of the desired connectors; electro-copper plating the exposed aluminum surfaces in the apertures to a desired thickness; electroless copper plating all surfaces of the assembly to a desired thickness; nickel plating all exposed copper including the copper plated apertures to form elongated nickel connectors therein; applying a dry film photo resist layer to the top and bottom surfaces of the nickel plated assembly, the photo resist having chemical etchant resistant portions over the apertures and defining an electrical circUit on the nickel clad positioner board and chemical etchant susceptible portions over the remainder thereof; chemically etching the assembly to remove all of the exposed nickel and copper therefrom; removing the chemical etchant resistant portions of the photo resist to expose the apertures and the electrical circuit on the positioner board; removing the bottom bonding agent sheet and any copper or nickel plating thereon to expose the bottom of the aluminum sheet; dissolving the aluminum sheet to expose the nickel connectors projecting from the positioner board; and removing the exposed copper plating from the outside of the projecting nickel connectors.

Claim 33

A method of manufacturing electrical circuit board connectors integral with at least one circuit mounted on a positioner board and projecting therefrom comprising the steps of: bonding an aluminum sheet disposed between two sheets of a B stage glass epoxy bonding agent to an A stage glass epoxy positioner board having a copper clad on the unbonded side thereof, the aluminum sheet having a thickness of the desired connector height; drilling apertures through the bonded assembly at the locations of the desired projecting integral connectors, the drilled apertures having a size larger than the inside diameter of the desired connectors; electro-copper plating the exposed aluminum surfaces in the drilled apertures to a desired thickness; sensitizing the exposed glass epoxy surfaces in the drilled apertures; electroless copper plating all surfaces of the assembly to a desired thickness; nickel plating all exposed copper including the copper plated apertures to form elongated nickel connectors therein to the desired connector thickness; applying a dry film photo resist layer to the top and bottom surfaces of the nickel plated assembly; developing the photoresist material into chemical etchant resistant areas over the apertures and defining an electrical circuit on the nickel clad positioner board and chemical etchant susceptible areas over the remainder thereof; chemically etching the assembly to remove all of the exposed nickel and copper therefrom; removing the chemical etchant resistant areas of the photo resist material to expose the apertures and the electrical circuit on the positioner board; sanding the bottom bonding agent sheet and any copper or nickel plating thereon from the assembly to expose the bottom of the aluminum sheet; dissolving the aluminum sheet to expose the nickel connectors projecting from the positioner board; and removing the exposed copper plating from the outside of the projecting nickel connectors.

Claim 34

A method of manufacturing electrical circuit board connectors integral with at least one circuit mounted on a positioner board and projecting therefrom comprising the steps of: bonding an aluminum sheet disposed between two sheets of a B stage glass epoxy bonding agent to an A stage glass epoxy positioner board having a copper clad on the unbonded side thereof, the aluminum sheet having a thickness of the desired connector height; drilling apertures through the bonded assembly at the locations of the desired projecting integral connectors, the drilled apertures having a size larger than the inside diameter of the desired connectors; electro-copper plating the exposed aluminum surfaces in the drilled apertures to a desired thickness; sensitizing the exposed glass epoxy surfaces in the drilled apertures; electroless copper plating all surfaces of the assembly to a desired thickness; nickel plating all exposed copper including the copper plated apertures to form elongated nickel connectors therein to the desired connector thickness; applying a dry film photo resist layer to the top and bottom surfaces of the nickel plated assembly; developing the photoresist material into chemical etchant resistant areas over the apertures and defining an electrical circuit on the nickel clad positioner board and chemical etchant susceptible areas over the remainder thereof; chemically etching the assembly to remove all of the exposed nickel and copper therefrom; removing the chemical etchant resistant areas of the photo resist material to expose the apertures and the electrical circuit on the positioner board; sanding the bottom bonding agent sheet and any copper or nickel plating thereon from the assembly to expose the bottom of the aluminum sheet; dissolving the aluminum sheet to expose the nickel connectors projecting from the positioner board; and removing the exposed copper plating from the outside of the projecting nickel connectors.

Claim 41

A method of manufacturing electrical circuit board connectors integral with at least one circuit mounted on a positioner board and projecting therefrom comprising the steps of: bonding an aluminum sheet disposed between two sheets of B stage glass epoxy bonding agent to an A stage glass epoxy positioner board having a copper clad on the unbonded side thereof, the aluminum sheet having a thickness of the desired connector height; drilling apertures through the bonded assembly at the locations of the desired projecting integral connectors, the drilled apertures having a size about 0.014 inches larger than the desired inside diameter of the projecting integral connectors; electro-copper plating the exposed aluminum surfaces in the drilled apertures to a thickness of about 0.0006 inches; sensitizing the exposed glass epoxy surfaces in the drilled apertures; electroless copper plating all surfaces of the assembly to a thickness of about 0.0001 inches; nickel plating all exposed copper including the copper plated apertures to form elongated nickel connectors therein to a connector thickness of about 0.004 inches; applying a dry film photo resist layer to the top and bottom surfaces of the nickel plated assembly; developing the photoresist material into chemical etchant resistant areas over the apertures and defining an electrical circuit on the nickel clad positioner board and chemical etchant susceptible areas over the remainder thereof; chemically etching the assembly to remove all of the exposed nickel and copper therefrom; removing the chemical etchant resistant areas of the photo resist material to expose the apertures and the electrical circuit on the positioner board; sanding the bottom bonding agent sheet and any copper or nickel plating thereon from the assembly to expose the bottom of the aluminum sheet; dissolving the aluminum sheet in a sodium hydroxide solution to expose the nickel connectors projecting from the positioner board; removing the exposed copper plating from the outside of the projecting nickel connectors by immersing the assembly in a copper stripping solution; and forming a solder coating on the projecting nickel connectors.

Claim 42

A method of manufacturing electrical circuit board connectors integral with at least one circuit mounted on a positioner board and projecting therefrom comprising the steps of: bonding an aluminum sheet disposed between two sheets of B stage glass epoxy bonding agent to an A stage glass epoxy positioner board having a copper clad on the unbonded side thereof, the aluminum sheet having a thickness of the desired connector height; drilling apertures through the bonded assembly at the locations of the desired projecting integral connectors, the drilled apertures having a size about 0.014 inches larger than the desired inside diameter of the projecting integral connectors; electro-copper plating the exposed aluminum surfaces in the drilled apertures to a thickness of about 0.0006 inches; sensitizing the exposed glass epoxy surfaces in the drilled apertures; electroless copper plating all surfaces of the assembly to a thickness of about 0.0001 inches; nickel plating all exposed copper including the copper plated apertures to form elongated nickel connectors therein to a connector thickness of about 0.004 inches; applying a dry film photo resist layer to the top and bottom surfaces of the nickel plated assembly; developing the photoresist material into chemical etchant resistant areas over the apertures and defining an electrical circuit on the nickel clad positioner board and chemical etchant susceptible areas over the remainder thereof; chemically etching the assembly to remove all of the exposed nickel and copper therefrom; removing the chemical etchant resistant areas of the photo resist material to expose the apertures and the electrical circuit on the positioner board; sanding the bottom bonding agent sheet and any copper or nickel plating thereon from the assembly to expose the bottom of the aluminum sheet; dissolving the aluminum sheet in a sodium hydroxide solution to expose the nickel connectors projecting from the positioner board; removing the exposed copper plating from the outside of the projecting nickel connectors by immersing the assembly in a copper stripping solution; and forming a solder coating on the projecting nickel connectors.