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US3798145A Expired / Lapsed US ⏱️ 0.0 years remaining

Technique for reducing interdiffusion rates and inhibiting metallic compound formation between titanium and platinum

Assignee: AT&T Inc
•
Filing: 1972-05-30
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Granted: 1974-03-19
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Expires: 1992-05-30
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Abstract

Abstract A TECHNIQUE FOR REDUCING THE INTERDIFFUSION RATES AND INHIBITING INTERMETALLIC COMPOUND FORMATION BETWEEN THIN FILM TITANIUM-PLATINUM METALLIZATIONS INVOLVES INCORPORATING A TITANIUM NITRIDE LAYER INTERMEDIATE THE TITANIUM AND PLATIINUM.

Inventors

  • 👤 P Fournier

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 19:40
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/43; C; C23; C23C; C23C28/00; H10D; H10D99/00; H10P; H10P95/00; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12535; Y10T428/12576; Y10T428/12583

Claims Analysis

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References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1977-03-18 1977-09-17 1978-03-19 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1981-03-18 1981-09-17 1982-03-19 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1985-03-18 1985-09-17 1986-03-19 $7700.00 Window Closed / Lapsed

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