US3753053A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor assembly
Assignee: RCA Corp
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Filing: 1972-10-30
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Granted: 1973-08-14
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Expires: 1992-10-30
Abstract
Abstract A semiconductor assembly for use with a high frequency semiconductor device is presented which uses at least one standoff having a conductive surface which overhangs the semiconductor device and which has pressure-absorbing contacts mounted thereon thereby protecting the semiconductor from direct pressure while providing for electrical contact to the semiconductor and allowing for very short leads from the stand-off to the semiconductor device.
Inventors
- 👤 G Swartz
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 12:37
CPC Classifications
H; H10; H10W; H10W72/00; H10W40/00; H10W40/10; H10W72/20
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
63 words
A semiconductor assembly comprising: a. a base, b. a semiconductor device mounted on said base, c. at least one insulating stand-off closely spaced to said semiconductor device and having an electrically conductive contact surface overhanging said semiconductor device, d. a pressure-absorbing contact mounted on said contact surface, and e. means electrically connecting said contact surface on said insulating stand-off to said semiconductor device.
Claim 2
Dependent Claim
63 words
A semiconductor assembly comprising: a. a base, b. a semiconductor device mounted on said base, c. at least one insulating stand-off closely spaced to said semiconductor device and having an electrically conductive contact surface overhanging said semiconductor device, d. a pressure-absorbing contact mounted on said contact surface, and e. means electrically connecting said contact surface on said insulating stand-off to said semiconductor device.
Claim 3
Dependent Claim
13 words
The semiconductor assembly of claim 1 wherein said base comprises a heat sink.
Claim 4
Dependent Claim
20 words
The semiconductor assembly of claim 1 wherein said base is electrically conductive and is electrically connected to said semiconductor device.
Claim 5
Dependent Claim
20 words
The semiconductor assembly of claim 1 further comprising a mounting structure upon which said base and said stand-off are mounted.
Claim 6
Dependent Claim
31 words
The semiconductor assembly of claim 4 wherein said base is a heat sink and said base and said mounting structure are electrically conductive and are electrically connected to said semiconductor device.
Claim 7
Dependent Claim
59 words
The semiconductor assembly of claim 5 wherein said insulating stand-off is substantially shaped like a truncated cone with a planar surface having the smaller area mounted on said mounting structure whereby the sloping side walls of said truncated cone are adjacent said base and the planar surface having the larger area of said truncated cone overhangs said semiconductor device.
Claim 8
Dependent Claim
31 words
The semiconductor assembly of claim 6 in which the planar surface of said truncated cone having the larger area is made electrically conductive by the deposition of a conductive metal thereon.
Claim 9
Dependent Claim
11 words
The semiconductor assembly of claim 7 including two such insulating stand-offs.
Claim 10
Dependent Claim
27 words
The semiconductor assembly of claim 1 wherein said means connecting said contact surface on said insulating stand-off to said semiconductor device comprises an electrically conductive contact ribbon.
Claim 11
Dependent Claim
21 words
The semiconductor assembly of claim 9 wherein said pressure-absorbing contact extends further from said contact surface than does said contact ribbon.
Claim 12
Dependent Claim
26 words
The semiconductor assembly of claim 10 wherein said pressure-absorbing contact is an electrically conductive ball having a greater diameter than the thickness of said contact ribbon.
Claim 13
Dependent Claim
26 words
The semiconductor assembly of claim 10 wherein said pressure-absorbing contact is an electrically conductive wire having a greater diameter than the thickness of said contact ribbon.
Claim 14
Dependent Claim
26 words
The semiconductor assembly of claim 1 wherein said means connecting said contact surface on said insulating stand-off to said semiconductor device comprises an electrically conductive wire.
Claim 15
Dependent Claim
20 words
The semiconductor assembly of claim 13 wherein said pressure-absorbing contact has a greater diameter than does said electrically conductive wire.
Claim 16
Dependent Claim
27 words
The semiconductor assembly of claim 14 wherein said pressure-absorbing contact is an electrically conductive wire having a diameter which is larger than the diameter of said wire.
Claim 17
Dependent Claim
26 words
The semiconductor assembly of claim 14 wherein said pressure-absorbing contact is an electrically conductive ball having a diameter which is larger than that of said wire.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-08-13 | 1977-02-12 | 1977-08-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-08-13 | 1981-02-12 | 1981-08-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-08-13 | 1985-02-12 | 1985-08-14 | $7700.00 | Window Closed / Lapsed |