US3681171A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for producing a multilayer printed circuit plate assembly
Assignee: Hitachi Ltd
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Filing: 1969-08-07
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Granted: 1972-08-01
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Expires: 1989-08-07
Abstract
Abstract A METHOD AND APPARATUS FOR PRODUCING A MULTILAYER PRINTED CIRCUIT PLATE ASSEMBLY CONSISTING OF A LAMINATE OF A PLURALITY OF PRINTED CIRCUIT PLATES, EACH HAVING CIRCUITS FORMED ON ONE OR BOTH SURFACES THEREOF BY ETCHING, AND AT LEAST ONE ADHESIVE LAYER INTERPOSED BETWEEN ADJACENT ONES OF SAID PRINTED CIRCUIT PLATES, IN WHICH AN AIR-TIGHT SEALED CHAMBER IS FORMED ENCLOSING SAID LAMINATE BY MEANS OF A VACUUM PACKING JIG MEANS AND SAID LAMINATE IS COMPRESSED AND HEATED IN SAID SEALED CHAMBER WHILE EXHAUSTING AIR FROM SAID SEALED CHAMBER BY A VACUUM PUMP, WHEREBY THE FORMATION OF AIR BUBBLES IN EACH ADHESIVE LAYER IN THE PROCESS OF COMPRESSION AND HEATING IS PREVENTED.
Inventors
- 👤 Toku Hojo
- 👤 Toshio Sasaki
- 👤 Hiroshi Motojima
- 👤 Hideaki Sasaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 15:36
CPC Classifications
B; B29; B29C; B29C43/00; B29C43/32; B29C43/36; B29C43/3607; B29C43/56; B32; B32B; B32B37/00; B32B37/0007; H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; B29C2791/00; B29C2791/004; B29C2791/006; B32B2309/00; B32B2309/60; B32B2309/68; B32B2457/00; B32B2457/08; H05K2203/00; H05K2203/06; H05K2203/068
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-08-01 | 1976-01-31 | 1976-08-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-08-01 | 1980-01-31 | 1980-08-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-08-01 | 1984-01-31 | 1984-08-01 | $7700.00 | Window Closed / Lapsed |