US3679941A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Composite integrated circuits including semiconductor chips mounted on a common substrate with connections made through a dielectric encapsulator
Assignee: General Electric Co
•
Filing: 1969-09-22
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Granted: 1972-07-25
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Expires: 1989-09-22
Abstract
Abstract Integrated circuits in which individual semiconductor chips, exhibiting diverse electrical and compositional characteristics, may in combination with thin or thick film passive components be applied to a single supporting electric substrate. The chips and conductive patterns deposited on the substrate being encapsulated in a dielectric material, with electrical connections made to said chips and conductive patterns through openings formed in said dielectric layer.
Inventors
- 👤 Donald J Lacombe
- 👤 Guy L Babcock
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 19:17
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/099; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W90/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
25 words
An integrated circuit structure as set forth in claim 1 wherein a conductive pattern is provided overlaying said substrate, regions of which provide said terminals.
Claim 2
Dependent Claim
17 words
An integrated circuit structure as in claim 2 wherein said metallizations of conductive material are film formations.
Claim 3
Dependent Claim
32 words
An integrated structure as in claim 3 wherein said terminal regions are comprised of mesa structures which are superimposed on said conductive pattern and constructed to the level of said contact electrodes.
Claim 4
Dependent Claim
28 words
An integrated circuit structure as in claim 3 wherein said metallizations of conductive material have a thickness within a range of about one micron to about one mil.
Claim 5
Dependent Claim
27 words
An integrated circuit structure as in claim 3 wherein said semiconductor chip is bonded directly to said dielectric substrate and overlayed by a layer of flourinated plastic.
Claim 6
Dependent Claim
29 words
An integrated circuit structure as in claim 3 wherein said semiconductor chip is embedded in a layer of fluorinated plastic and overlayed by a further layer of fluorinated plastic.
Claim 7
Dependent Claim
43 words
An integrated circuit structure as in claim 3 wherein said semiconductor chip has additional contact electrodes on the face opposite said one face, said conductive pattern having additional end terminal regions extendIng beneath said chip and directly connected to said additional contact electrodes.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-07-25 | 1976-01-24 | 1976-07-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-07-25 | 1980-01-24 | 1980-07-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-07-25 | 1984-01-24 | 1984-07-25 | $7700.00 | Window Closed / Lapsed |