US3679472A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for bonding a metal pattern to a substrate
Assignee: AT&T Inc
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Filing: 1970-07-16
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Granted: 1972-07-25
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Expires: 1990-07-16
Abstract
Abstract THE BOND BETWEEN A METAL FILM AND A SUBSTRATE IS INCREASED BY EMPLOYING AN INTERMEDIATE LAYER WHICH EFFECTS A TENACIOUS BOND TO THE SUBSTRATE. THE PROPENSITY OF SUCH AN INTERMEDIATE LAYER TO BE EXTREMELY DIFFICULT, IF NOT IMPOSSIBLE, TO ETCH WITHOUT DELETERIOUSLY DAMAGING THE FILM IS ELIMINATED BY USING A DISCONTINUOUS INTERMEDIATE LAYER. ELECTROPLATING OF THE METAL FILM IS FACILITRATED BY DEPOSITING A CONTINUOUS CONDUCTIVE COATING WHICH CAN BE ETCHED WITHOUT DELETERIOUS DAMAGE TO THE METAL FILM ONTO THE DISCONTINUOUS INTERMEDIATE LAYER.
Inventors
- 👤 Gerald E Crosby
- 👤 Daniel J Shanefield
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 15:30
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1605; C23C18/1633; C23C18/1646; C23C18/165; C23C18/1653; C23C18/1689; H01; H01B; H01B1/00; H05K3/108; H10; H10N; H10N97/00; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0338; H05K2201/0344; H05K2203/00; H05K2203/12; H05K2203/121; H05K3/22; H05K3/24; H05K3/245
Claims Analysis
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References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-07-25 | 1976-01-24 | 1976-07-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-07-25 | 1980-01-24 | 1980-07-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-07-25 | 1984-01-24 | 1984-07-25 | $7700.00 | Window Closed / Lapsed |