US3650454A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Device for bonding with a compliant medium
Assignee: AT&T Inc
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Filing: 1969-11-21
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Granted: 1972-03-21
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Expires: 1989-11-21
Abstract
Abstract The bonding of two workpieces by ultrasonic or thermocompression techniques requires the use of a rigid bonding tip or ram to transmit the bonding energy, whether it be vibratory, mechanical and/or thermal. In time, such a rigid medium is subject to wear, to mis-alignment and to pickup of material from the workpieces, the latter causing the upper workpiece to stick to the tip. Further, such a rigid medium cannot be used reliably to make a number of bonds simultaneously, because minor size differences in the workpieces can prevent a good couple for energy transmission from being established to every workpiece. It has been discovered that a compliant or deformable medium can be employed to hold the workpieces during bonding. By deforming around the workpieces, the compliant medium eliminates the problem of size differences, as well as wear, mis-alignment and the like, and a good bond is achieved in each instance. In one aspect, the bonding energy is transmitted through the compliant medium to make the bond. In a second aspect, the bonding energy is transmitted through the support for the workpieces. The quality of individual bonds is improved because, for a given set of bonding conditions, there is less deformation of the workpieces than with conventional techniques. The invention is particularly applicable to the bonding of beam-lead transistors and integrated circuits to substrates, to bonding a plurality of leads to integrated circuit and thin film devices, and to bonding brittle single crystal chips to substrates.
Inventors
- 👤 Alexander Coucoulas
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-22 18:20
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; B; B23; B23K; B23K20/00; B23K20/10; H10W; H10W99/00; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/072; H10W72/07251; H10W72/20; H10W72/251; H10W72/252; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
143 words
A machine for simultaneously bonding a plurality of small metallic leads to the metallic land areas of a substrate comprising: a support including a flat surface for carrying the substrate; a compliant medium adapted to cover all of said leads, the compliant medium having a property of deforming completely about the exposed portions of said leads when subjected to a predetermined pressure; means for clamping said compliant medium and said leads to said substrate on said flat surface; and an ultrasonic horn coupled into the machine to apply ultrasonic vibrations to the desired bond areas in a direction parallel to said flat surface and simultaneously apply said predetermineD pressure through the compliant medium so as to deform the compliant medium completely about the exposed portions of the leads and hold the leads in place while bonding the leads to the desired bond areas.
Claim 2
Dependent Claim
143 words
A machine for simultaneously bonding a plurality of small metallic leads to the metallic land areas of a substrate comprising: a support including a flat surface for carrying the substrate; a compliant medium adapted to cover all of said leads, the compliant medium having a property of deforming completely about the exposed portions of said leads when subjected to a predetermined pressure; means for clamping said compliant medium and said leads to said substrate on said flat surface; and an ultrasonic horn coupled into the machine to apply ultrasonic vibrations to the desired bond areas in a direction parallel to said flat surface and simultaneously apply said predetermineD pressure through the compliant medium so as to deform the compliant medium completely about the exposed portions of the leads and hold the leads in place while bonding the leads to the desired bond areas.
Claim 3
Dependent Claim
143 words
A machine for simultaneously bonding a plurality of small metallic leads to the metallic land areas of a substrate comprising: a support including a flat surface for carrying the substrate; a lead frame to which said leads are attached, said frame being make of a metal or alloy having an adherent oxide film thereon and having a property of deforming completely about the exposed portions of the leads when subjected to a predetermined pressure sufficient to bond the leads to the land areas: and a heated ram clamping the compliant medium and the leads to the substrate on said flat surface and supplying mechanical compression energy at said predetermined pressure through the compliant medium and to the desired bond areas to deform the compliant medium completely about the exposed portions of the leads so as to hold the leads in place during bonding.
Claim 4
Dependent Claim
143 words
A machine for simultaneously bonding a plurality of small metallic leads to the metallic land areas of a substrate comprising: a support including a flat surface for carrying the substrate; a lead frame to which said leads are attached, said frame being make of a metal or alloy having an adherent oxide film thereon and having a property of deforming completely about the exposed portions of the leads when subjected to a predetermined pressure sufficient to bond the leads to the land areas: and a heated ram clamping the compliant medium and the leads to the substrate on said flat surface and supplying mechanical compression energy at said predetermined pressure through the compliant medium and to the desired bond areas to deform the compliant medium completely about the exposed portions of the leads so as to hold the leads in place during bonding.
Claim 5
Dependent Claim
24 words
The machine as claimed in claim 34, wherein said clamping means comprises an elastically deformable body adapted to be pressed down onto said leads.
Claim 6
Dependent Claim
128 words
A bonding device, comprising: a bonding tool; means for supporting a first workpiece in alignment with said bonding tool with a second workpiece aligned with at least one bonding site on said first workpiece; a compliant medium adapted to engage at least those portions of the second workpiece to be bonded to bonding sites on the first workpiece, the compliant medium having a property of deforming to a substantially greater degree than either workpiece when subjected to compressive pressure and having a thickness substantially greater than the height of said second workpiece; and means for applying mechanical compression energy to said workpieces to deform said compliant medium substantially more than said workpieces and compliantly bond portions of said second workpiece to associated bonding sites on said first workpiece.
Claim 7
Dependent Claim
128 words
A bonding device, comprising: a bonding tool; means for supporting a first workpiece in alignment with said bonding tool with a second workpiece aligned with at least one bonding site on said first workpiece; a compliant medium adapted to engage at least those portions of the second workpiece to be bonded to bonding sites on the first workpiece, the compliant medium having a property of deforming to a substantially greater degree than either workpiece when subjected to compressive pressure and having a thickness substantially greater than the height of said second workpiece; and means for applying mechanical compression energy to said workpieces to deform said compliant medium substantially more than said workpieces and compliantly bond portions of said second workpiece to associated bonding sites on said first workpiece.
Claim 8
Dependent Claim
42 words
The bonding device of claim 4 wherein said means for applying mechanical compression energy to said workpiece includes means for heating said bonding tool to apply thermal energy to said workpieces simultaneously with the application to the workpieces of mechanical compression energy.
Claim 9
Dependent Claim
35 words
The bonding device of claim 4 wherein said means for applying mechanical compression energy to said workpiece includes an ultrasonic horn coupled into the device to vibrate one of said workpieces relative to the other.
Claim 10
Dependent Claim
19 words
The bonding device of claim 4 wherein said compliant medium is located at the tip of said bonding tool.
Claim 11
Dependent Claim
48 words
The bonding device of claim 4 wherein said first workpiece has a plurality of land areas, said second workpiece has a plurality of leads extending therefrom to be bonded to associated land areas, and said compliant medium comprises a lead frame to which said second workpiece is attached.
Claim 12
Dependent Claim
136 words
A bonding device, comprising: a bonding tool; means for heating said bonding tool; a compliant medium adapted to receive the body of a beam-lead device while engaging selected leads extending from the beam-lead device, said compliant medium being located at the tip of said bonding tool, the compliant medium having a property of deforming to a substantially greater degree than the leads when subjected to compressive pressure and having a thickness substantially greater than the height of the leads and the body of the beam-lead device; means for supporting a substrate having a plurality of land areas thereon in alignment with the leads of the beam-lead device so that selected leads are aligned with associated land areas; and means for clamping said compliant medium, beam-land device and substrate between said bonding tool and said support means.
Claim 13
Dependent Claim
136 words
A bonding device, comprising: a bonding tool; means for heating said bonding tool; a compliant medium adapted to receive the body of a beam-lead device while engaging selected leads extending from the beam-lead device, said compliant medium being located at the tip of said bonding tool, the compliant medium having a property of deforming to a substantially greater degree than the leads when subjected to compressive pressure and having a thickness substantially greater than the height of the leads and the body of the beam-lead device; means for supporting a substrate having a plurality of land areas thereon in alignment with the leads of the beam-lead device so that selected leads are aligned with associated land areas; and means for clamping said compliant medium, beam-land device and substrate between said bonding tool and said support means.
Claim 14
Dependent Claim
122 words
A bonding device, comprising: a bonding tool; means for heating said bonding tool; a compliant medium adapted To engage leads extending from at least one beam-lead device, the compliant medium having a property of deforming to a substantially greater degree than the leads when subjected to compressive pressure and having a thickness substantially greater than the height of the leads; means for aligning said compliant medium with said bonding tool; means for supporting a substrate having a plurality of land areas thereon in alignment with the leads of each beam-lead device so that selected leads are aligned with associated land areas; and means for clamping said compliant member, each beam-lead device and said substrate between said bonding tool and said support means.
Claim 15
Dependent Claim
122 words
A bonding device, comprising: a bonding tool; means for heating said bonding tool; a compliant medium adapted To engage leads extending from at least one beam-lead device, the compliant medium having a property of deforming to a substantially greater degree than the leads when subjected to compressive pressure and having a thickness substantially greater than the height of the leads; means for aligning said compliant medium with said bonding tool; means for supporting a substrate having a plurality of land areas thereon in alignment with the leads of each beam-lead device so that selected leads are aligned with associated land areas; and means for clamping said compliant member, each beam-lead device and said substrate between said bonding tool and said support means.
Claim 16
Independent Claim
136 words
A device for bonding a lead to a substrate having a land area, the device comprising: a bonding tool; means for supporting the substrate with the land area in alignment with said bonding tool and with the lead aligned with the land area; a compliant medium composed of a metal or alloy having an adherent oxide film thereon and adapted to engage the lead, the compliant medium having a property of deforming completely about the exposed portion of the lead when subjected to a predetermined pressure sufficient to bond the lead to the land area; and means for applying mechanical compression energy to the lead at said predetermined pressure through the compliant medium to deform the compliant medium completely about the exposed portion of the lead so as to hold the lead in place during bonding.
Claim 17
Independent Claim
136 words
A device for bonding a lead to a substrate having a land area, the device comprising: a bonding tool; means for supporting the substrate with the land area in alignment with said bonding tool and with the lead aligned with the land area; a compliant medium composed of a metal or alloy having an adherent oxide film thereon and adapted to engage the lead, the compliant medium having a property of deforming completely about the exposed portion of the lead when subjected to a predetermined pressure sufficient to bond the lead to the land area; and means for applying mechanical compression energy to the lead at said predetermined pressure through the compliant medium to deform the compliant medium completely about the exposed portion of the lead so as to hold the lead in place during bonding.
Claim 18
Dependent Claim
118 words
A machine for simultaneously bonding a plurality of small metallic leads of a given height to the metallic land areas of a substrate comprising: a support including a flat surface for carrying the substrate; a compliant medium adapted to cover all of the leads, the compliant medium having a property of deforming to a substantially greater degree than the leads when subjected to compressive pressure and having a thickness substantially greater than said given height of the leads; means for clamping the compliant medium and the leads to the substrate on said flat surface; and energy source means for supplying mechanical compression energy to the desired bond areas to deform the compliant medium substantially more than the leads.
Claim 19
Dependent Claim
118 words
A machine for simultaneously bonding a plurality of small metallic leads of a given height to the metallic land areas of a substrate comprising: a support including a flat surface for carrying the substrate; a compliant medium adapted to cover all of the leads, the compliant medium having a property of deforming to a substantially greater degree than the leads when subjected to compressive pressure and having a thickness substantially greater than said given height of the leads; means for clamping the compliant medium and the leads to the substrate on said flat surface; and energy source means for supplying mechanical compression energy to the desired bond areas to deform the compliant medium substantially more than the leads.
Claim 20
Dependent Claim
17 words
The machine as claimed in claim 12, wherein said compliant medium is mounted on said clamping means.
Claim 21
Dependent Claim
85 words
The machine as claimed in claim 12, wherein said compliant medium has a property of deforming completely about the exposed portions of said leads when subjected to a predetermined pressure sufficient to bond the leads to the land areas and wherein said energy source means comprise means for applying said predetermined pressure through the compliant medium and to the desired bond area to deform the compliant medium completely about the exposed portions of the leads so as to hold the leads in place during bonding.
Claim 22
Dependent Claim
124 words
A machine for bonding a metallic lead to a metallic land area of a substrate comprising: a flat support for the substrate; a compliant medium composed of a metal or alloy having an adherent oxide film thereon and adapted to cover the lead, the compliant medium having a property of deforming to a substantially greater degree than the lead when subjected to compressive pressure; means for clamping the compliant medium and the lead to the substrate on said support; and energy source means for supplying sufficient mechanical compression energy to deform the compliant medium completely about the exposed portion of the lead and applying sufficient bonding energy to the desired bond area through the deformed compliant medium to bond the lead to the substrate.
Claim 23
Dependent Claim
124 words
A machine for bonding a metallic lead to a metallic land area of a substrate comprising: a flat support for the substrate; a compliant medium composed of a metal or alloy having an adherent oxide film thereon and adapted to cover the lead, the compliant medium having a property of deforming to a substantially greater degree than the lead when subjected to compressive pressure; means for clamping the compliant medium and the lead to the substrate on said support; and energy source means for supplying sufficient mechanical compression energy to deform the compliant medium completely about the exposed portion of the lead and applying sufficient bonding energy to the desired bond area through the deformed compliant medium to bond the lead to the substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-03-21 | 1975-09-20 | 1976-03-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-03-21 | 1979-09-20 | 1980-03-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-03-21 | 1983-09-20 | 1984-03-21 | $7700.00 | Window Closed / Lapsed |