Micro-circuit device

Abstract

Abstract A microcircuit device such as a printed circuit or an integrated circuit is described wherein the thickness of insulation between two crossing conductive bodies can be substantially decreased as compared to the corresponding thickness in known like devices. In the case for example, such as magnetic coupled film memory devices wherein a low temperature insulating material can be employed and wherein such insulating material is subject to surface tension effects, this is achieved by retaining the photoresist layer on the surface of the metal magnetic bodies resting on the substrate and etching the magnetic bodies to the point where the width of the upper surfaces of the conducting bodies are equal to the width of the nonconductive resist used in the etching or where there is a slight undercut under their retained respective photoresist layers, i.e., the layer on each body extends beyond the perimeter of the surface of the bodies. Such photoresist layer protects sharp metal corners or, in the latter case, provides an umbrella effect in that it extends beyond the sharp edges of the magnetic bodies, the latter being potential areas for electrical shorts. In the case where conductive bodies are employed which generate high temperatures or which have to withstand high service temperatures and wherein correspondingly high temperature insulating materials have to be used or in which it is desired to have very thin hard insulations such as are produced in the use of inorganic insulations, glasses and the like, the aforementioned ''''umbrella'''' effect is provided by a layer of high temperature insulating materials of organic or inorganic compositions on the conducting body''s surface rather than the layer of photoresist material. In this latter case, the insulation thickness can be much thinner than the commonly accepted rule of thumb thickness which is twice that of the conducting bodies for conducting bodies of 30000A. or thicker and even greater such as four or five to one for conducting bodies considerably thinner than 3000A. (for example, 200 to 500A. thick).

Inventors

• 👤 Lubomyr T Romankiw

Bibliographic Details