← Back to Patent Explorer
US3597660A Expired / Lapsed US ⏱️ 0.0 years remaining

High-density circuits connector

Assignee: International Business Machines Corp
•
Filing: 1969-12-10
•
Granted: 1971-08-03
•
Expires: 1989-12-10
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A high-density circuits connector assembly for interconnecting the edge conductors of module circuit boards with the I/O (input/output) circuits conductors of a cabling network of a data processing system. The connector assembly comprises signal and ground overlays formed by printed circuit techniques to provide conductive copper paths affixed to a flexible thin layer of polyimide material which are registered and attached at the edges of the module boards. An interconnecting contact pressure is achieved by a force mechanism comprising a resilient pad directly in contact with the overlays and a pressure-applying mechanism. The overlays function as a matched impedance I/O connector for interconnecting the module circuits boards with the other circuits wiring of a data processing system.

Inventors

  • 👤 Stanley M Jensen
  • 👤 Thomas J Kopl
  • 👤 Vincent P Subik
  • 👤 Henry R Tatko
  • 👤 Gordon L Williams

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 17:37
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/36; H05K3/361; H05K3/365; H05K7/00; H05K7/02; H05K7/10; H05K7/1053

Claims Analysis

Total Claims: 32
Claim 1
Independent Claim 153 words
Modular data processing apparatus comprising, in combination: a. a base frame structure adapted to receive and hold a modular circuit board assembly and including a plurality of conductive pads thereon connected with cabling wires of the data processing system, b. a modular circuit board assembly including: 1. a plurality of integral electrical circuit network modules mounted thereon, 2. a predetermined pattern of electrical circuit lines interconnected with the integral circuit modules and terminating at the edges of the circuit board, 3. a flexible substrate matErial having a plurality of circuit conductive paths thereon with one end thereof attached to the terminal ends of the surface lines at the edges of the circuit board, the other ends being arranged to overlie and make electrical contact with the conductive pads attached to the base frame structure, and, c. a pressure-applying means adapted to apply forces to the flexible substrate material for interconnecting cooperative conductive elements.
Claim 2
Dependent Claim 153 words
Modular data processing apparatus comprising, in combination: a. a base frame structure adapted to receive and hold a modular circuit board assembly and including a plurality of conductive pads thereon connected with cabling wires of the data processing system, b. a modular circuit board assembly including: 1. a plurality of integral electrical circuit network modules mounted thereon, 2. a predetermined pattern of electrical circuit lines interconnected with the integral circuit modules and terminating at the edges of the circuit board, 3. a flexible substrate matErial having a plurality of circuit conductive paths thereon with one end thereof attached to the terminal ends of the surface lines at the edges of the circuit board, the other ends being arranged to overlie and make electrical contact with the conductive pads attached to the base frame structure, and, c. a pressure-applying means adapted to apply forces to the flexible substrate material for interconnecting cooperative conductive elements.
Claim 3
Dependent Claim 22 words
a predetermined pattern of electrical circuit lines interconnected with the integral circuit modules and terminating at the edges of the circuit board,
Claim 4
Dependent Claim 22 words
a predetermined pattern of electrical circuit lines interconnected with the integral circuit modules and terminating at the edges of the circuit board,
Claim 5
Dependent Claim 9 words
a fiRst rigid member for holding the resilient pad,
Claim 6
Dependent Claim 9 words
a fiRst rigid member for holding the resilient pad,
Claim 7
Dependent Claim 27 words
a predetermined pattern of electrical circuit lines including signal input, signal output lines and ground lines terminating at or near the peripheral edge of the circuit board,
Claim 8
Dependent Claim 27 words
a predetermined pattern of electrical circuit lines including signal input, signal output lines and ground lines terminating at or near the peripheral edge of the circuit board,
Claim 9
Dependent Claim 12 words
a plurality of guide pins, b. a modular circuit board assembly including:
Claim 10
Dependent Claim 12 words
a plurality of guide pins, b. a modular circuit board assembly including:
Claim 11
Dependent Claim 27 words
a predetermined pattern of electrical circuit lines including signal input, signal output lines and ground lines terminating at or near the peripheral edge of the circuit board,
Claim 12
Dependent Claim 27 words
a predetermined pattern of electrical circuit lines including signal input, signal output lines and ground lines terminating at or near the peripheral edge of the circuit board,
Claim 13
Dependent Claim 34 words
Modular data processing apparatus according to claim 1 wherein the pressure-applying mechanism includes a resilient pad positionable in an overlying manner upon the flexible substrate for more uniformly applying pressures to interconnecting conductive elements.
Claim 14
Dependent Claim 72 words
a flexible substrate matErial having a plurality of circuit conductive paths thereon with one end thereof attached to the terminal ends of the surface lines at the edges of the circuit board, the other ends being arranged to overlie and make electrical contact with the conductive pads attached to the base frame structure, and, c. a pressure-applying means adapted to apply forces to the flexible substrate material for interconnecting cooperative conductive elements.
Claim 15
Dependent Claim 72 words
a flexible substrate matErial having a plurality of circuit conductive paths thereon with one end thereof attached to the terminal ends of the surface lines at the edges of the circuit board, the other ends being arranged to overlie and make electrical contact with the conductive pads attached to the base frame structure, and, c. a pressure-applying means adapted to apply forces to the flexible substrate material for interconnecting cooperative conductive elements.
Claim 16
Dependent Claim 24 words
Modular data processing apparatus comprising, in combination: a. a base frame structure adapted to receive and hold a modular circuit board assembly and including:
Claim 17
Dependent Claim 24 words
Modular data processing apparatus comprising, in combination: a. a base frame structure adapted to receive and hold a modular circuit board assembly and including:
Claim 18
Dependent Claim 95 words
a thin, flexible substrate of polyimide material and having a plurality of printed circuit conductive paths thereon with one end thereof attached to the terminal ends of the circuit lines at the peripheral edge of the circuit board, the other ends being arranged to overlie and make electrical contact with the conductive pads attached to the base frame structure, c. a pressure-applying mechanism adapted to apply forces to interconnecting conductive elements, and d. means for securing the pressure-applying mechanism relative to the base frame structure and including means for transferring pressures to the pressure-applying mechanism.
Claim 19
Dependent Claim 95 words
a thin, flexible substrate of polyimide material and having a plurality of printed circuit conductive paths thereon with one end thereof attached to the terminal ends of the circuit lines at the peripheral edge of the circuit board, the other ends being arranged to overlie and make electrical contact with the conductive pads attached to the base frame structure, c. a pressure-applying mechanism adapted to apply forces to interconnecting conductive elements, and d. means for securing the pressure-applying mechanism relative to the base frame structure and including means for transferring pressures to the pressure-applying mechanism.
Claim 20
Dependent Claim 64 words
a thin, flexible substrate of polyimide material and having a plurality of printed circuit conductive paths thereon with one end thereof attached to the terminal ends of the circuit lines at the peripheral edge of the circuit board, the other ends being arranged to overlie and make electrical contact with the conductive pads attached to the base frame structure, c. a pressure-applying mechanism including:
Claim 21
Dependent Claim 64 words
a thin, flexible substrate of polyimide material and having a plurality of printed circuit conductive paths thereon with one end thereof attached to the terminal ends of the circuit lines at the peripheral edge of the circuit board, the other ends being arranged to overlie and make electrical contact with the conductive pads attached to the base frame structure, c. a pressure-applying mechanism including:
Claim 22
Dependent Claim 15 words
A second rigid member slidably supported on mounting studs attached to the first rigid member,
Claim 23
Dependent Claim 15 words
A second rigid member slidably supported on mounting studs attached to the first rigid member,
Claim 24
Dependent Claim 18 words
a plurality of coil springs arranged in a line and contained between the first and second rigid members,
Claim 25
Dependent Claim 18 words
a plurality of coil springs arranged in a line and contained between the first and second rigid members,
Claim 26
Dependent Claim 34 words
Modular data processing apparatus according to claim 3 wherein the pressure-applying mechanism includes a resilient pad positionable in an overlying manner upon the flexible substrate for more uniformly applying pressures to interconnecting conductive elements.
Claim 27
Dependent Claim 55 words
Modular data processing apparatus according to claim 4 additionally including: a. a first rigid member for holding the resilient pad, b. a second rigid member slidably supported on mounting studs attached to the first rigid member, c. a plurality of coil springs arranged in a line and contained between the first and second rigid members.
Claim 28
Dependent Claim 47 words
the first rigid member having an extension at each end and with a guide hole therein adapted to be slidably positioned on the guide pins attached to the base frame structure, and d. means for securing the pressure-applying mechanism relative to the base frame structure and including:
Claim 29
Dependent Claim 47 words
the first rigid member having an extension at each end and with a guide hole therein adapted to be slidably positioned on the guide pins attached to the base frame structure, and d. means for securing the pressure-applying mechanism relative to the base frame structure and including:
Claim 30
Dependent Claim 40 words
Modular data processing apparatus according to claim 5 wherein the first rigid member having an extension at each end and with a guide hole therein adapted to be slidably positioned on the guide pins attached to the base frame structure.
Claim 31
Dependent Claim 24 words
Modular data processing apparatus comprising, in combination: a. a base frame structure adapted to receive and hold a modular circuit board assembly and including:
Claim 32
Dependent Claim 24 words
Modular data processing apparatus comprising, in combination: a. a base frame structure adapted to receive and hold a modular circuit board assembly and including:

References Cited (Backward Citations)

US3418534A Cited
US3376479A Cited
US3499220A Cited
US3500289A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1974-08-02 1975-02-01 1975-08-03 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1978-08-02 1979-02-01 1979-08-03 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1982-08-02 1983-02-01 1983-08-03 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag