US3573973A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High speed additive circuit process
Assignee: International Business Machines Corp
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Filing: 1967-11-13
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Granted: 1971-04-06
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Expires: 1987-11-13
Abstract
Abstract A HIGH SPEED ADDITIVE CIRCUIT PROCESS FOR MANUFACTURE OF CIRCUIT LINES UPON A POLYESTER OR POLYIMIDE SUBSTRATE, INCLUDING THROUGH-HOLES THEREIN, COMPRISING THE STEPS OF CLEANING, SENSITIZING, ACTIVATING, PRINTING A NEGATIVE FACSIMILE, OF THE FINAL DESIRED PATTERN OVER THE ACTIVATED SURFACE, HEAT SETTING, ELECTROLESS NICKEL PLATING, CURING, AND FINAL CONDUCTIVE COATING BY FLOW SOLDERING. ONLY ONE STEP MAY EXCEED ONE MINUTE IN TIME. TEMPERATURES AND TIME AT TEMPERATURE DETAILS ARE INCLUDED. CONDUCTIVE LINES AS FINE AS 2 MILS WIDE ON 4 MIL CENTERS MAY BE MADE BY THIS PROCESS.
Inventors
- 👤 John S Drotar
- 👤 Arden A Parker
- 👤 Keith A Snyder
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 18:03
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28; C23C18/285; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/184; H05K3/38; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2203/00; H05K2203/04; H05K2203/044; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K2203/11; H05K2203/1105; H05K2203/14; H05K2203/1407; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468
Claims Analysis
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References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-04-05 | 1974-10-05 | 1975-04-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-04-05 | 1978-10-05 | 1979-04-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-04-05 | 1982-10-05 | 1983-04-06 | $7700.00 | Window Closed / Lapsed |