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US3559285A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of forming leads for attachment to semi-conductor devices

Assignee: Jade Corp
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Filing: 1968-01-08
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Granted: 1971-02-02
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Expires: 1988-01-08
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Abstract

Abstract A METHOD OF ATTACHING LEADS TO A SEMI-CONDUCTOR DEVICE INCLUDES THE STEPS OF INLAYING A CONTACTING METAL COMPATIBLE WITH A SEMI-CONDUCTOR ELEMENT ALONG A METAL STRIP, UPSETTING THE METAL STRIP AT SPACED PORTIONS THEREALONG SO AS TO PROVIDE A DEPRESSION ON ONE SIDE AND AN UPSTANDING PORTION ON THE OPPOSITE SIDE OF THE METAL STRIP, REMOVING THE UPSTANDING PORTION SO THAT THE INLAY AND STRIP IS SUBSTANTIALLY REDUCED IN THICKNESS AT SAID SPACED PORTIONS, AND THEN STAMPING THE STRIP AT SAID SPACED PORTIONS TO DEFINE THE INTEGRAL CANTILEVER LEADS HAVING THE CONTACTING METAL ON THEIR EXPOSED ENDS.

Inventors

  • 👤 John Edward Kauffman

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 13:43
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/01; H10W70/04; H10W70/048; H10W70/421; H10W70/424; H10W72/00; H10W72/30; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49799

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1974-02-01 1974-08-03 1975-02-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1978-02-01 1978-08-03 1979-02-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1982-02-01 1982-08-03 1983-02-02 $7700.00 Window Closed / Lapsed

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