US3354542A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Enclosing a metal support with a printed circuit containing envelope
Assignee: AT&T Inc
•
Filing: 1965-05-10
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Granted: 1967-11-28
•
Expires: 1985-05-10
Abstract
No abstract record available.
Inventors
- 👤 Joseph C Mallia
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 16:37
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4084; H05K3/44; H05K3/445; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0108; H05K2203/0195; H05K2203/02; H05K2203/0221; H05K2203/03; H05K2203/0323; H05K2203/06; H05K2203/068; H05K3/02; H05K3/06; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1056; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165; Y10T29/49167; Y10T29/49826; Y10T29/49833
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
120 words
THE METHOD OF MAKING A PRINTED CIRCUIT BOARD COMPRISING: PROVIDING A METAL SUBSTRATE HAVING A PLURALITY OF HOLES EXTENDING THERETHROUGH, INSERTING THE METAL SUBSTRATE INTO A DIELECTRIC ENVELOPE SUPPORTING AN ELECTRICAL CIRCUIT TO AT LEAST ONE SIDE THEREOF SO THAT THE POSITIONS OF THE LAND AREAS OF THE ELECTRICAL CIRCUIT CORRESPONDING WITH THE POSITIONS OF THE HOLES IN THE SUBSTRATE, BONDING THE DIELECTRIC MATERIAL TO THE METAL SUBSTRATE, FORMING THE DIELECTRIC MATERIAL ABOUT THE WALLS OF THE HOLES, AND PERMANENTLY DEFORMING AND FORCING PORTIONS OF THE LAND AREAS TO EXTEND INTO THE HOLES, SEALING THE OPEN END OF THE ENVELOPE TO COMPLETELY ENCLOSE THE SUBSTRATE WITHIN THE ENVELOPE, AND TRIMMING THE ENDS OF THE ENVELOPE TO ELIMINATE EXCESS DIELECTRIC MATERIAL.
Claim 2
Independent Claim
120 words
THE METHOD OF MAKING A PRINTED CIRCUIT BOARD COMPRISING: PROVIDING A METAL SUBSTRATE HAVING A PLURALITY OF HOLES EXTENDING THERETHROUGH, INSERTING THE METAL SUBSTRATE INTO A DIELECTRIC ENVELOPE SUPPORTING AN ELECTRICAL CIRCUIT TO AT LEAST ONE SIDE THEREOF SO THAT THE POSITIONS OF THE LAND AREAS OF THE ELECTRICAL CIRCUIT CORRESPONDING WITH THE POSITIONS OF THE HOLES IN THE SUBSTRATE, BONDING THE DIELECTRIC MATERIAL TO THE METAL SUBSTRATE, FORMING THE DIELECTRIC MATERIAL ABOUT THE WALLS OF THE HOLES, AND PERMANENTLY DEFORMING AND FORCING PORTIONS OF THE LAND AREAS TO EXTEND INTO THE HOLES, SEALING THE OPEN END OF THE ENVELOPE TO COMPLETELY ENCLOSE THE SUBSTRATE WITHIN THE ENVELOPE, AND TRIMMING THE ENDS OF THE ENVELOPE TO ELIMINATE EXCESS DIELECTRIC MATERIAL.
References Cited (Backward Citations)
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US2829081A
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US3165672A
Cited
US3051019A
Cited
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US3263023A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1970-11-27 | 1971-05-29 | 1971-11-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1974-11-27 | 1975-05-29 | 1975-11-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1978-11-27 | 1979-05-29 | 1979-11-28 | $7700.00 | Window Closed / Lapsed |