Socket panel for integrated circuit modules

Claim 1

A SOCKET PANEL FOR A PLURALITY OF MULTIPLE-PRONGED INTEGRATED CIRCUIT MODULES COMPRISING: AN ELECTRICAL INSULATION PANEL HAVING OPPOSITE MAJOR FACES AND HAVING A PLURALITY OF GROUPS OF OPENINGS EXTENDING THROUGH THE PANEL BETWEEN SAID MAJOR FACES AND POSITIONED TO RECEIVE THE PRONGS OF RESPECTIVE INTEGRATED CIRCUIT MODULES; A PLURALITY OF SIMILAR GROUPS OF SOCKET MEMBERS SEATED RESPECTIVELY IN SAID OPENINGS IN THE PANEL, EACH OF SAID SOCKET MEMBERS PRESENTING A PRONG-RECEIVING RECESS WHICH IS OPEN AT ONE OF SAID MAJOR FACES OF THE PANEL AND A PROJECTING TERMINAL POST AT THE OPPOSITE MAJOR FACE OF THE PANEL; BROAD AREA ELECTRICALLY-CONDUCTIVE LAYERS ON THE RESPECTIVE OPPOSITE MAJOR FACES OF SAID PANEL; A FIRST ONE OF THE SOCKET MEMBERS IN EACH GROUP THEREOF BEING CONNECTED CONDUCTIVELY TO THE ELECTRICALLY-CONDUCTIVE LAYER ON ONE OF SAID MAJOR FACES OF THE PANEL TO PROVIDE A POWER POTENTIAL CONNECTION FOR THE INTEGRATED CIRCUIT MODULE CONNECTED TO THAT GROUP OF SOCKET MEMBERS; AND A SECOND ONE OF THE SOCKET MEMBERS IN EACH GROUP THEREOF BEING CONNECTED CONDUCTIVELY TO THE ELECTRICALLY-CONDUCTIVE LAYER ON THE OPPOSITE MAJOR FACE OF THE PANEL TO PROVIDE A GROUND CONNECTION FOR THE RESPECTIVE INTEGRATED CIRCUIT MODULE; SAID ELECTRICALLY-CONDUCTIVE LAYERS BEING SPACED FROM AND ELECTRICALLY SEPARATE FROM, SAID SOCKET MEMBERS EXCEPT AT SAID POWER POTENTIAL AND GROUND CONNECTION.