Cap for hermetically sealed semiconductor

Claim 1

A HEADER FOR AN ENVELOPE ADAPTED TO ENCLOSE A SEMICONDUCTOR, SAID HEADER COMPRISING: (A) AN ELECTRICALLY INSULATING HEAT CONDUCTING FIRST ELEMENT HAVING A FIRST FACE AND A SECOND FACE OPPOSITE SAID FIRST FACE, (B) SAID FIRST FACE OF SAID FIRST ELEMENT ADAPTED TO BE PLACED IN HEAT CONDUCTING RELATION TO SAID SEMICONDUCTOR, (C) A HEAT CONDUCTING SECOND ELEMENT ADJACENT AND SUBSTANTIALLY COEXTENSIVE WITH THE SECOND FACE OF SAID FIRST ELEMENT AND IN HEAT CONDUCTING RELATION THEREWITH, (D) AT LEAST ONE LEAD EXTENDING FROM A POINT OUTSIDE SAID ENVELOPE TO A POINT WITHIN THE PERIMETER OF THE SECOND FACE OF SAID FIRST ELEMENT, SAID LEAD BEING SUBSTANTIALLY PARALLEL TO THE SECOND FACE OF SAID FIRST ELEMENT, SAID LEAD FURTHER EXTENDING THROUGH SAID FIRST ELEMENT FROM THE SECOND FACE THEREOF TO THE FIRST FACE THEREOF AND ADAPTED TO BE SECURED IN ELECTRICAL CONTACT WITH A PORTION OF SAID SEMICONDUCTOR, (E) AT LEAST ONE SLOT IN SAID SECOND ELEMENT EXTENDING INWARDLY FROM THE PERIMETER THEREOF, SAID SLOT PROVIDING A RECESS FOR ONE LEAD, (F) THE DEPTH OF SAID SLOT BEING GREATER THAN THE THICKNESS OF SAID LEAD.