Heating and cooling system for molds

Claim 1

IN COMBINATION WITH A DEVICE TO BE HEATED AND COOLED, SAID DEVICE HAVING A PASSAGEWAY THERETHROUGH, AN ARRANGEMENT FOR HEATING AND COOLING SAID DEVICE COMPRISING A FIRST HYDRAULIC SYSTEM, A SECOND HYDRAULIC SYSTEM, MEANS FOR SELECTIVELY CONNECTING SAID SYSTEMS TO SAID PASSAGEWAY, A BYPASS IN EACH OF SAID SYSTEMS FOR BYPASSING SAID PASSAGEWAY, SAID MEANS FOR SELECTIVELY CONNECTING SAID SYSTEMS TO SAID PASSAGEWAY INCLUDING VALVE MEANS FOR ALTERNATELY AND INDIVIDUALLY CONNECTING SAID SYSTERMS TO SAID PASSAGEWAY AND PREVENTING FLOW THROUGH THE BYPASS OF THE SYSTEM SO CONNECTED TO SAID PASSAGEWAY WHILE SIMULTANEOUSLY CONNECTING THE OTHER OF SAID SYSTEMS TO THE BYPASS OF SAID OTHER SYSTEM AND PREVENTING FLOW FROM SAID OTHER SYSTEM THROUGH SAID PASSAGEWAY, A LIQUID MATERIAL SAID MATERIAL BEING PRESSED IN BOTH OF SAID SYSTEMS, PUMP MEANS FOR CONTINUOUSLY CIRCULATING SAID FLUID IN SAID SYSTEMS AT SUBSTANTIALLY EQUAL PRESSURE HEADS IN SAID SYSTEMS, MEANS FOR HEATING SAID LIQUID MATERIAL IN ONE OF SAID SYSTEMS, MEANS FOR COLLING SAID LIQUID MATERIAL IN THE OTHER OF SAID SYSTEMS, AND MEANS FOR SIMULTANEOUSLY PRESSURIZING SAID LIQUID MATERIAL IN BOTH OF SAID SYSTEMS TO SUBSTANTIALLY EQUAL PRESSURE SUFFICIENT TO PREVENT VAPORATION OF SAID LIQUID MATERIAL, WHEREBY SAID LIQUID MATERIAL IN SAID PASSAGEWAY CAUSES HEATING AND COOLING OF SAID DEVICE.