Control apparatus and photomechanical processes for producing such

Claim 1

THE METHOD OF PRODUCING A PRINTED CIRCUIT WHICH COMPRISES THE FOLLOWING STEPS: DEPOSITING A FILM OF BERYLLIUM COPPER ON A SUBSTRATE; APPLYING A FIRST PHOTOSENSITIVE FILM TO FULLY COVER SAID BERYLLIUM COPPER FILM; APPLYING LIGHT TO SAID FRIST PHOTOSENSITIVE FILM TO EXPOSE ALL AREAS OTHER THAN THAT TO BE USED FOR THE COMBINED AREAS OF THE CONDUCTIVE PATHS AND THE RESISTIVE PATHS BY THE USE OF A POSITIVE PHOTOGRAPHIC FILM MASK; REMOVING SAID UNEXPOSED PORTIONS OF SAID FIRST PHOTOSENSITIVE FILM; ETCHING ALL UNPROTECTRED AREAS OF SAID BERYLLIUM COPPER NOT COVERED BY SAID EXPOSED PHOTOSENSITIVE FILM TO COMPLETELY REMOVE SAID UNPROTECTED AREAS; REMOVING SAID EXPOSED PHOTOSENSITIVE FILM; DEPOSITING A FILM OF NICKEL CHROMIUM ALLOY ON SAID REMAINING SUBSTRATE AND BERYLLIUM COPPER; UNDERETCHING SAID NICKEL CHROMIUM ALLOY SUPPORTED BY SAID BERYLLIUM COPPER TO LEAVE ONLY SAID NICKEL CHROMIUM ALLOY DEPOSITED DIRECTLY UPON SAID SUBSTRATE AND TO REMOVE SAID NICKEL CHROMIUM ALLOY PREVIOUSLY SUPPORTED BY SAID BERYLLIUM COPPER; DEPOSITNG A FILM OF ALUMINUM UPON SAID SUBSTRATE AND SAID NICKEL CHROMIUM ALLOY; DEPOSITNG A FILM OF COPPER UPON SAID FILM OF ALUMINUM, SAID ALUMINUM PREVENTING INTERACTION AND THUS CHANGE OF RESISTANCE BETWEEN SAID COPPER AND SAID NICKEL CHROMIUM ALLOY; COATING SAID FILM OF COPPER WITH A SECOND FILM OF PHOTOSENSITIVE MATERIAL; APPLYING LIGHT TO EXPOSE SAID AREAS TO BE USED AS CONDUCTIVE PATHS THROUGH THE USE OF A NEGATIVE FILM MASK; REMOVING SAID UNEXPOSED PORTIONS OF SAID SECOND PHOTOSENSITIVE FILM; ETCHING SAID UNPROTECTED COPPER AND ALUMINUM TO LEAVE NICKEL CHROMIUM ALLOY PATHS IN AREAS TO BE USED AS RESISTANCE MEANS AND TO LEAVE PATHS COMPOSED OF NICKEL CHROMIUM ALLOY, ALUMINUM, COPPER, AND EXPOSED PHOTOSENSITIVE MATERIAL IN AREAS TO BE USED AS CONDUCTIVE PATHS; AND REMOVING SAID REMAINING EXPOSED PHOTOSENSITIVE MATERIAL TO FORM A FINISHED PRINTED CIRCUIT MEANS.

Claim 2

THE METHOD OF PRODUCING A PRINTED CIRCUIT WHICH COMPRISES THE FOLLOWING STEPS: DEPOSITING A FILM OF BERYLLIUM COPPER ON A SUBSTRATE; APPLYING A FIRST PHOTOSENSITIVE FILM TO FULLY COVER SAID BERYLLIUM COPPER FILM; APPLYING LIGHT TO SAID FRIST PHOTOSENSITIVE FILM TO EXPOSE ALL AREAS OTHER THAN THAT TO BE USED FOR THE COMBINED AREAS OF THE CONDUCTIVE PATHS AND THE RESISTIVE PATHS BY THE USE OF A POSITIVE PHOTOGRAPHIC FILM MASK; REMOVING SAID UNEXPOSED PORTIONS OF SAID FIRST PHOTOSENSITIVE FILM; ETCHING ALL UNPROTECTRED AREAS OF SAID BERYLLIUM COPPER NOT COVERED BY SAID EXPOSED PHOTOSENSITIVE FILM TO COMPLETELY REMOVE SAID UNPROTECTED AREAS; REMOVING SAID EXPOSED PHOTOSENSITIVE FILM; DEPOSITING A FILM OF NICKEL CHROMIUM ALLOY ON SAID REMAINING SUBSTRATE AND BERYLLIUM COPPER; UNDERETCHING SAID NICKEL CHROMIUM ALLOY SUPPORTED BY SAID BERYLLIUM COPPER TO LEAVE ONLY SAID NICKEL CHROMIUM ALLOY DEPOSITED DIRECTLY UPON SAID SUBSTRATE AND TO REMOVE SAID NICKEL CHROMIUM ALLOY PREVIOUSLY SUPPORTED BY SAID BERYLLIUM COPPER; DEPOSITNG A FILM OF ALUMINUM UPON SAID SUBSTRATE AND SAID NICKEL CHROMIUM ALLOY; DEPOSITNG A FILM OF COPPER UPON SAID FILM OF ALUMINUM, SAID ALUMINUM PREVENTING INTERACTION AND THUS CHANGE OF RESISTANCE BETWEEN SAID COPPER AND SAID NICKEL CHROMIUM ALLOY; COATING SAID FILM OF COPPER WITH A SECOND FILM OF PHOTOSENSITIVE MATERIAL; APPLYING LIGHT TO EXPOSE SAID AREAS TO BE USED AS CONDUCTIVE PATHS THROUGH THE USE OF A NEGATIVE FILM MASK; REMOVING SAID UNEXPOSED PORTIONS OF SAID SECOND PHOTOSENSITIVE FILM; ETCHING SAID UNPROTECTED COPPER AND ALUMINUM TO LEAVE NICKEL CHROMIUM ALLOY PATHS IN AREAS TO BE USED AS RESISTANCE MEANS AND TO LEAVE PATHS COMPOSED OF NICKEL CHROMIUM ALLOY, ALUMINUM, COPPER, AND EXPOSED PHOTOSENSITIVE MATERIAL IN AREAS TO BE USED AS CONDUCTIVE PATHS; AND REMOVING SAID REMAINING EXPOSED PHOTOSENSITIVE MATERIAL TO FORM A FINISHED PRINTED CIRCUIT MEANS.